箔材退火炉控制技术的理论与实践

介绍箔材退火炉结构、电气控制系统、PLC组态及退火炉控制原理。详细描述了用PID控制、温度补偿法来调节炉温均匀性的方法。

Effect of heat treatment on microstructure and thermophysical properties of diamond/2024 Al composites

50%diamond particle （5μm） reinforced 2024 aluminum matrix （diamond/2024 Al） composites were prepared by pressure infiltration method. Diamond particles were distributed uniformly without any particle clustering, and no apparent porosities or significant casting defects were observed in the composites. The diamond-Al interfaces of as-cast and annealed diamond/2024 Al composites were clean, smooth and free from interfacial reaction product. However, a large number of Al2Cu precipitates were found at diamond-Al interface after aging treatment. Moreover, needle-shaped Al2MgCu precipitates in Al matrix were observed after aging treatment. The coefficient of thermal expansion （CTE） of diamond/2024 Al composites was about 8.5×10-6 °C-1 between 20 and 100 °C, which was compatible with that with chip materials. Annealing treatment showed little effect on thermal expansion behavior, and aging treatment could further decrease the CTE of the composites. The thermal conductivity of obtained diamond/2024 Al composites was about 100 W/（m？K）, and it was slightly increased after annealing while decreased after aging treatment.

Formation mechanism and organizational controlling of ultra-fine-grain copper processed by asymmetrical accumulative rolling-bond and annealing

The initial copper with large grain sizes of 60-100 μm was processed by six passes asymmetrical accumulative rolling-bond （AARB） and annealing, the ultra-fine-grained （UFG） copper with grain size of 200 nm was obtained, and the microstructures and properties were studied. The results show that there are large sub-structures and also texture component C for the UFG copper obtained by six passes AARB, possessing high strength and microhardness in company with poor elongation and conductivity. Thereafter, the UFG copper was annealed at 220 °C for 35 min, in which the sub-structures disappear, the grain boundaries are composed of big angle grain boundaries, and the textures are composed of a variety of texture components and parts of twins. Compared with the UFG copper obtained by six passes AARB, the tensile strength and yield strength for the UFG copper obtained by six passes AARB and annealing at 220 °C for 35 min are decreased slightly, the elongation and conductivity are improved obviously.

Preparation of Semi-Insulating Material by Annealing Undoped InP

Semi insulating (SI) InP wafers of 50 and 75mm in diameter can be obtained by annealing of undoped liquid encapsulated Czochralski (LEC) InP at 930℃ for 80h.The annealing ambient can be pure phosphorus (PP) or iron phosphide (IP).The IP SI InP wafers have good electrical parameters and uniformity of whole wafer.However,PP SI InP wafers exhibit poor uniformity and electrical parameters.Photoluminescence which is subtle to deep defect appears in IP annealed semi insulating InP.Traps in annealed SI InP are detected by the spectroscopy of photo induced current transient.The results indicate that there are fewer traps in IP annealed undoped SI InP than those in as grown Fe doped and PP undoped SI InP.The formation mechanism of deep defects in annealed undoped InP is discussed.

重卷机组的优化设计

莱钢板带厂冷轧生产线随着一期配套工程的相继投产,2#轧机、罩式退火炉和平整机也相继生产,市场对退火材需求大幅度提升。板带厂冷轧生产线对现在的重卷机组优化设计,使重卷机组既能生产冷硬卷又能生产退火卷。使重卷设备作业率大幅度提高。

Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy

The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe（Ni,Co） in the composites is reduced, because a-Fe（Ni,Co） partly transfers into y-Fe（Ni,Co） through the diffusion of the Ni atoms into a-Fe（Ni,Co） from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/（m.K） （as-tested） and a CTE of 10.79× 10-6/K （20-100 ℃）.

Effect of vacuum annealing on microstructure and mechanical properties of TA15 titanium alloy sheets

The mechanical properties, microstructures, and fractographs of TA15 sheets vacuum-annealed under different patterns were investigated. The results indicate that vacuum annealing significantly improves the mechanical properties of the sheets in comparison with those after ambient annealing. With increasing the annealing temperature, the phase boundaries and secondary a-phase increase, whereas the volume fraction of primary a-phase decreases, resulting in increased strength and decreased elongation A relatively fine secondary a-phase is obtained after double annealing. The desirable mechanical properties （i.e., ultimate tensile strength, yield strength, and elongation are 1070 MPa, 958 MPa, and 15%, respectively） are obtained through double annealing （（950 ℃/2 h, AC）＋（600 ℃/2 h, AC））. The fractographs obtained after tensile tests show that the deepest and largest dimples are formed in the specimen annealed at 850 ℃, which indicates that the best plasticity is obtained at this annealing temperature.

EBSD characterization of Al7075/graphene nanoplates/carbon nanotubes composites processed through post-deformation annealing

The effects of the post-deformation annealing on the microstructural evolution of hot rolled Al7075 matrix composites reinforced with CNTs and GNPs were investigated.The multi-pass hot rolling was applied on the stir cast samples.Annealing was then applied to the composites at 450℃ for 4 h.Microstructural evolution was examined by SEM,EDS,and EBSD techniques.EBSD data showed that the addition of 0.87 vol.%(GNPs+CNTs)significantly inhibited the occurrence of recrystallization.Also,in the composite with 0.96 vol.%CNTs,recrystallization was partially inhibited.Whereas,in composites with 0.92 vol.%of GNPs,the occurrence of recrystallization through particle stimulated nucleation(PSN)mechanism was significantly accelerated.The volume fraction of recrystallized grains depends significantly on the occurrence of PSN in the presence of reinforcements.The intensity and type of the main components of the texture as well as the FCC fibers depend on the type of reinforcement.

Formation mechanism and growth kinetics of TiAl_(3) phase in cold-rolled Ti/Al laminated composites during annealing

Cold-rolled Ti/Al laminated composites were annealed at 525−625℃for 0−128 h,and the interfacial microstructure evolution was investigated.The results indicate that only the TiAl_(3) phase was formed at the Ti/Al interface;most of TiAl_(3) grains were fine equiaxed with average sizes ranging from hundreds of nanometers to several microns and the TiAl_(3) grain size increased with increasing annealing time and/or temperature,but the effect of annealing temperature on the TiAl_(3) grain size was far greater than that of annealing time.The growth of the TiAl_(3) phase consisted of two stages.The initial stage was governed by chemical reaction with a reaction activation energy of 195.75 kJ/mol,and the reaction rate constant of the TiAl_(3) phase was larger as the Ti/Al interface was bonded with fresh surfaces.At the second stage,the growth was governed by diffusion,the diffusion activation energy was 33.69 kJ/mol,and the diffusion growth rate constant of the TiAl_(3) phase was mainly determined by the grain boundary diffusion owing to the smaller TiAl_(3) grain size.

Bonding interface zone of Mg-Gd-Y/Mg-Zn-Gd laminated composite fabricated by equal channel angular extrusion

In order to improve the mechanical properties and corrosion resistance of Mg alloys,the equal channel angular extrusion (ECAE)was employed to fabricate the Mg-5Gd-5Y/Mg-2Zn-1Gd(GW55/ZG21)laminated composites.After fabrication and annealing treatment,the microstructural evolution,phase constitution,microhardness,and bonding strength were investigated on the bonding interface zone of GW55/ZG21 laminated composites.The bonding interface zone of GW55/ZG21 laminated composites comprises a lot of Mg3(Y,Gd)2Zn3 particles along the bonding interface,some rod Mg24(Y,Gd)5 phases on GW55 side,and a precipitation free zone(PFZ)on ZG21 side.After annealing treatment,Mg3(Y,Gd)2Zn3 particles along the bonding interface increase, rod Mg24(Y,Gd)5 phases on GW55 side decrease,and PFZ is broadened.Meanwhile,the hardness on the bonding interface zone decreases and the bonding strength increases from 126 MPa to 162 MPa.

Annealing hardening and deformation behavior of layered gradient Zr–Ti composite

To investigate potential strengthening approaches,multi-layered zirconium–titanium(Zr-Ti)composites were fabricated by hot-rolling bonding and annealing.The microstructures of these composites were characterized using scanning electron microscopy with energy dispersive spectroscopy(SEM-EDS)and electron backscatter diffractometry(EBSD).Their mechanical properties were evaluated by uniaxial tension and compression measurements.It was found that the fabricated Zr–Ti composites are composed of alternating Zr/diffusion/Ti layers,and chemical compositions of Zr and Ti showed a gradient distribution in the diffusion layer.Compared with as-rolled samples,annealing can strengthen the layered gradient Zr–Ti composite,and this is mainly caused by solid-solution strengthening and microstructure refinement-induced strengthening.Compared with the raw materials,a synergistic improvement of strength and ductility is achieved in the Zr–Ti composite as a result of the layered gradient microstructure.Tension–compression asymmetry is observed in the Zr–Ti composites,which may be attributed to twinning and microvoids induced by unbalanced diffusion.

Ion implantation of semi-insulating InP materials

The methods for protecting InP surface against degradation during annealing,including encapsulant and encapsulant-free techniques;rapid thermal annealing of InP implanted layers;implanted ion species and some profiles of typical dopants,etc.,they are all the key techniques concerning ion implantation into semi-insulating InP,and have been reviewed synthetically as well.

Self-biased magnetoelectric effect in(Pb, Zr)TiO_3/metglas laminates by annealing method

Fe BSi C metglas was annealed at an optimized condition（350 °C, 5 min） to achieve the mixed phases with pristine amorphous phase and crystallization phase.With such annealed metglas, a self-biased magnetoelectric（ME） laminate of metglas/Pb（Zr, Ti）O3/metglas was fabricated. Without any external magnetic field, the composite exhibits the ME coefficient aE31 of 103 m V/（cm Oe） at1 k Hz and 15.5 V/（cm Oe） at electromechanical resonance frequency. The induced ME voltage shows a good linear relation to the applied AC magnetic field with amplitude as low as 10-7T at 1 k Hz. It is expected that such self-biased ME composites provide a practical application of economical and compact magnetic sensors.

Effect of annealing treatment on the performance of organic photovoltaic devices using SPFGraphene as electron-accepter material

We have researched the performances of organic photovoltaic devices with the bulk heterojunction （BHJ） structure using the organic solution-processable functionalized graphene （SPFGraphene） material as the electron-accepter material and P3OT as the donor material. The structural configuration of the device is ITO/PEDOT：PSS/P3OT：PCBM-SPFGraphene/LiF/A1. Given the P3OT/PCBM （1：1） mixture with 8wt% of SPFGraphene, the open-circuit voltage （Voc） of the device reaches 0.64 V, a short-circuit current density （J^c） reaches 5.7 mA/cm2, a fill factor （FF） reaches 0.42, and the power conversion efficiency （7？） reaches 1.53% at illumination at 100 mW/cm2 AM1.5. We further studied the reason for the device performances improvement In the P3OT：PCBM-SPFGraphene composite, the SPFGraphene material acts as exciton dissociation sites and provides the transport pathways of the lowest unoccupied molecular orbital （LUMO）-SPFGraphene-A1. Furthermore, adding SPFGraphene to P3OT results in appropriate energetic distance between the highest occupied molecular orbital （HOMO） and LUMO of the donoffacceptor and provides higher exciton dissociation volume mobility of carrier transport. We have researched the effect of annealing treatment for the devices and found that the devices with annealing treatment at 180℃ show better performances compared with devices without annealed treatment. The devices with annealed treatment show the best performance, with an enhancement of the power conversion efficiency from 1.53% to 1.75%.