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Y-89在新桥矿选铜厂的应用实践 被引量:5
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作者 王军民 《化工矿物与加工》 CAS 北大核心 2002年第9期19-20,共2页
新桥矿选铜厂 1999年使用捕收剂Y -89后 ,选铜回收率提高了 4.82 % 。
关键词 选铜厂 捕收剂Y-89 回收率 经济效益 工艺流程
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捕收剂Y-89提高金、银回收率的实验与运用 被引量:1
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作者 钱廷武 王军民 《矿业快报》 2001年第23期9-10,共2页
新型捕收剂 Y-89与丁黄的对比实验及工业生产实验结果表明 :Y-89明显优于丁黄 ,它使副产品金。
关键词 选铜厂 Y-89捕收剂 回收率 丁黄 嵌布特征
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Optimization of reagent dosages for copper flotation using statistical technique 被引量:5
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作者 Y.VAZIFEH E.JORJANI A.BAGHERIAN 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2010年第12期2371-2378,共8页
The effects of Z11 and AP407 collectors as well as AF65 and AF70 frothers were evaluated in the rougher flotation circuit of the Sungun copper concentrator plant using 2 4 full factorial design.Response functions were... The effects of Z11 and AP407 collectors as well as AF65 and AF70 frothers were evaluated in the rougher flotation circuit of the Sungun copper concentrator plant using 2 4 full factorial design.Response functions were produced for both Cu grade and recovery and optimized within the experimental range.The optimum reagent dosages were found to be 12.01 g/t Z11,11 g/t AP407,3 g/t AF65 and 5 g/t AF70 to attain the maximum Cu grade(8.17%).The reagent dosages of 12 g/t Z11,11 g/t AP407,3 g/t AF65 and 15 g/t AF70 produced the maximum Cu recovery(86.44%).The collector distribution demonstrated that the distribution pattern of(32%,32%,20%,16%)can produce the best recovery(87.75%)in comparison to other examined distribution patterns. 展开更多
关键词 copper sulphide ores flotation reagents modelling OPTIMIZATION
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ZnO whiskers growth on the surface of Sn9Zn/Cu solder joints in concentrator silicon solar cells solder layer 被引量:1
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作者 张亮 Yang Fan Zhong Sujuan 《High Technology Letters》 EI CAS 2017年第3期337-341,共5页
ZnO whiskers observation on the surface of SnZn/Cu solder joints in concentrator silicon solar cells solder layer is reported. In the experiment,SnZn/Cu samples are left in laboratory after reflow soldering for two ye... ZnO whiskers observation on the surface of SnZn/Cu solder joints in concentrator silicon solar cells solder layer is reported. In the experiment,SnZn/Cu samples are left in laboratory after reflow soldering for two years before an examination by SEM,then ZnO whiskers can be observed obviously,which grows out from the rich-Zn phase of the samples and causes electrical short circuit in the electronics appliances,which demonstrates that the SnZn solder shows a risk for the short circuiting failure of an electronic device. Moreover,the growth mechanism of ZnO whiskers is researched based on cracked oxide theory,which provides the reference support for SnZn solders application. 展开更多
关键词 ZnO whiskers reflow soldering short circuiting failure electronic device
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大宝山矿业有限公司铜选厂尾矿综合利用前期探索情况简介 被引量:1
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作者 周启才 《大宝山科技》 2000年第2期35-37,44,共4页
关键词 选铜厂 尾矿 综合利用 矿物组成 粒度分析
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