A new type of electrochemical oscillation induced by surfactant was observed in experiments. The electrochemical system is a Daniell cell with a copper rod in CuSO 4 aqueous and an aluminum rod in Al(NO 3) 3 aqueous a...A new type of electrochemical oscillation induced by surfactant was observed in experiments. The electrochemical system is a Daniell cell with a copper rod in CuSO 4 aqueous and an aluminum rod in Al(NO 3) 3 aqueous as electrodes. The surfactants are CTAB, TX-100, SLS. The addition of trace surfactant solution by a micro-syringe made the original monotonously changing electrochemical system produce obvious periodic phenomena. At the mean time, the copper ion selective electrode and Hg 2SO 4 reference electrode were used to monitor the copper electrode reaction and determine its rate constant k of first order reaction. According to the experimental results of electrode reaction kinetics, the possible mechanism was found to be the polarization induced from the directional adsorption of trace surfactant on the electrode surface. That is the electrochemical oscillations.展开更多
The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from a...The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from acidic sulfate solution was investigated by cyclic voltammetry and potentiodynamic polarization measurements. Results from cyclic voltammetry indicate that these py-iLs have a pronounced inhibiting effect on CuE＋ electroreduction and there exists a typical nucleation and growth process. Kinetic parameters such as Tafel slope, transfer coefficient and exchange current density obtained from Tafel plots, lead to the conclusion that py-iLs inhibit the charge transfer by slightly changing the copper electrodeposition mechanism through their adsorption on the cathodic surface. In addition, scanning electron microscope （SEM） and X-ray diffraction analyses reveal that the presence of these additives leads to more leveled and fine-grained cathodic deposits without changing the crystal structure of the electrodeposited copper but strongly affects the crystallographic orientation by significantly inhibiting the growth of （111）, （200） and （311） planes.展开更多
文摘A new type of electrochemical oscillation induced by surfactant was observed in experiments. The electrochemical system is a Daniell cell with a copper rod in CuSO 4 aqueous and an aluminum rod in Al(NO 3) 3 aqueous as electrodes. The surfactants are CTAB, TX-100, SLS. The addition of trace surfactant solution by a micro-syringe made the original monotonously changing electrochemical system produce obvious periodic phenomena. At the mean time, the copper ion selective electrode and Hg 2SO 4 reference electrode were used to monitor the copper electrode reaction and determine its rate constant k of first order reaction. According to the experimental results of electrode reaction kinetics, the possible mechanism was found to be the polarization induced from the directional adsorption of trace surfactant on the electrode surface. That is the electrochemical oscillations.
基金Projects(51204080, 51274108) supported by the National Natural Science Foundation of ChinaProject(2011FA009) supported by the Natural Science Foundation of Yunnan Province, ChinaProject(2011FZ020) supported by the Application Research Foundation of Yunnan Province, China
文摘The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from acidic sulfate solution was investigated by cyclic voltammetry and potentiodynamic polarization measurements. Results from cyclic voltammetry indicate that these py-iLs have a pronounced inhibiting effect on CuE＋ electroreduction and there exists a typical nucleation and growth process. Kinetic parameters such as Tafel slope, transfer coefficient and exchange current density obtained from Tafel plots, lead to the conclusion that py-iLs inhibit the charge transfer by slightly changing the copper electrodeposition mechanism through their adsorption on the cathodic surface. In addition, scanning electron microscope （SEM） and X-ray diffraction analyses reveal that the presence of these additives leads to more leveled and fine-grained cathodic deposits without changing the crystal structure of the electrodeposited copper but strongly affects the crystallographic orientation by significantly inhibiting the growth of （111）, （200） and （311） planes.
