Large area diamond films were fabricated on copper substrates by a multi-step process comprised of electroplating Cu-diamond composite layer on Cu substrate, plating a Cu layer to fix the protruding diamond particles,...Large area diamond films were fabricated on copper substrates by a multi-step process comprised of electroplating Cu-diamond composite layer on Cu substrate, plating a Cu layer to fix the protruding diamond particles, and depositing continuous diamond film on composite interlayer by hot-filament chemical vapor deposition （HFCVD）. The interface characteristics, internal stress and adhesion strength were investigated by scanning electron microscopy, Raman analysis and indentation test. The results show that the continuous film without cracks is successfully obtained. The microstructure of the film is a mixture of large cubo-octahedron grains grown from homo-epitaxial growth and small grains with （111） apparent facets grown from lateral second nuclei. The improved adhesion between diamond film and substrate results from the deep anchoring of the diamond particles in the Cu matrix and the low residual stress in the film.展开更多
Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different s...Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).展开更多
Nickel-plated graphite particles and unmodified graphite particles with different contents were added to the Fe-based diamond composites.The basic properties of those specimens were measured,including relative density...Nickel-plated graphite particles and unmodified graphite particles with different contents were added to the Fe-based diamond composites.The basic properties of those specimens were measured,including relative density,hardness,bending strength,abrasion ratio and holding force coefficient.And also,SEM,XRD and EDS were used to carry out microstructure characterization,phase analysis and element distribution of these specimens.The results show that nickel plating effectively improves the surface wettability of graphite particles.And it is determined that an element diffusion zone is formed on the transition interface between the nickel-plated graphite and the matrix materials,effectively enhancing the interfacial bonding strength.Also,the pores and cracks in the matrix generated by adding the graphite particles are reduced after nickel plating.Thus,the loss of basic properties of the specimens is restrained.But it is found the higher the graphite content is,the weaker the positive effect of nickel plating is.In addition,it is revealed that nickel plating plays a conducive part in the formation of graphite lubricants on the working surface,and nickel-plated graphites can slow down the thermal corrosion of the diamond particles inside the high-temperature sintered specimens.展开更多
基金Projects(51071070,51271079)supported by the National Natural Science Foundation of ChinaProject(NCET-11-0156)supported by New Century Excellent Talents in University,China
文摘Large area diamond films were fabricated on copper substrates by a multi-step process comprised of electroplating Cu-diamond composite layer on Cu substrate, plating a Cu layer to fix the protruding diamond particles, and depositing continuous diamond film on composite interlayer by hot-filament chemical vapor deposition （HFCVD）. The interface characteristics, internal stress and adhesion strength were investigated by scanning electron microscopy, Raman analysis and indentation test. The results show that the continuous film without cracks is successfully obtained. The microstructure of the film is a mixture of large cubo-octahedron grains grown from homo-epitaxial growth and small grains with （111） apparent facets grown from lateral second nuclei. The improved adhesion between diamond film and substrate results from the deep anchoring of the diamond particles in the Cu matrix and the low residual stress in the film.
基金supported by the National Natural Science Foundation of China(No.11802125)。
文摘Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).
文摘Nickel-plated graphite particles and unmodified graphite particles with different contents were added to the Fe-based diamond composites.The basic properties of those specimens were measured,including relative density,hardness,bending strength,abrasion ratio and holding force coefficient.And also,SEM,XRD and EDS were used to carry out microstructure characterization,phase analysis and element distribution of these specimens.The results show that nickel plating effectively improves the surface wettability of graphite particles.And it is determined that an element diffusion zone is formed on the transition interface between the nickel-plated graphite and the matrix materials,effectively enhancing the interfacial bonding strength.Also,the pores and cracks in the matrix generated by adding the graphite particles are reduced after nickel plating.Thus,the loss of basic properties of the specimens is restrained.But it is found the higher the graphite content is,the weaker the positive effect of nickel plating is.In addition,it is revealed that nickel plating plays a conducive part in the formation of graphite lubricants on the working surface,and nickel-plated graphites can slow down the thermal corrosion of the diamond particles inside the high-temperature sintered specimens.
