CFRP超声振动套磨钻孔高效排屑机理和实验

针对碳纤维增强复合材料(CFRP)在普通套磨钻孔(CCD)过程中,切屑粉尘粘刀和料芯堵刀导致的排屑效果较差而影响套磨加工效率和加工质量的问题,采用超声振动套磨钻孔(UVCD)新技术进行了CFRP高效套磨钻孔的基础理论和实验研究。从理论上分析了CFRP超声振动套磨钻孔原理和高效排屑机理,同时结合所设计的超声振动气钻和车床平台实验验证了CFRP超声振动套磨钻孔的高效排屑钻孔效果。结果表明:相比于CFRP普通套磨钻孔,超声振动套磨钻孔极大提高了切屑粉尘和料芯的排屑效果,有效防止了切屑粉尘粘刀和料芯堵刀现象,明显降低了12%~20%的钻削力、16%~24%的切削温度和33%~39%的孔表面粗糙度,明显改善了CFRP孔加工质量并且延长了套磨刀具使用寿命。

金牌信息

专利成果 无偿转让 广谱速效纳米抗菌口罩专利号：（03212977.7） 在非典的启发下，发明人潜心研究，于2004年5月获国家专利，该专利科技含量高、实用性强、抗菌功能极佳、市场巨大，该专利2004年9月28日在北京人民大会堂举行的第三次“科学”家论坛被确定为论坛交流专利，受到与会专家的好评。

Wear of CVD thick film diamond cutter while machining laminated flooring

The wide application of high pressure laminated (HPL) flooring has an insistent need for cutting tools with an excellent performance and fine cutting quality. Chemical vapor deposition (CVD) thick film diamond is a promising material for the machining of HPL flooring. In the present work, CVD thick film diamond tools were used to mill the wear resistance layer of HPL flooring. Wear volumes of flank face were examined by optical microscopy, and micro wear morphologies were observed by scanning electron microscopy (SEM). The experiments revealed that the predominant wear characteristics of CVD diamond tools were transgranular cleavage wear and intergranular peeling of the CVD diamond. Experimental results also showed that twin characteristic, cavity defect, micro crack and grain size of CVD thick film diamond contributed greatly to the wear process of CVD thick film diamond tools. The effects caused by the factors were also analyzed in detail in the paper.