A mechanical separation process was developed for recovering metals from printed circuit board(PCB) scrap;it included three steps:impact crushing,sieving and fluidization separation.The mechanism of the technique was ...A mechanical separation process was developed for recovering metals from printed circuit board(PCB) scrap;it included three steps:impact crushing,sieving and fluidization separation.The mechanism of the technique was based on the difference in the crushabilities of metallic and nonmetallic materials in the PCBs that led to the concentrated distribution of metals in particles of larger sizes and nonmetals mostly in particles of smaller sizes.It was found that crushed PCB particles from 0.125 mm to 1.000 mm contained about 80% of metals in the PCBs.Metals acquired satisfactory liberation in particles smaller than 0.800 mm.The crushed PCB particles were sieved into fractions of different size ranges.Each fraction separately went through a gas-solid fluidized bed operating at a selected optimal gas velocity for the specific size range.Approximately 95% of metals in printed circuit board particles from 0.125 mm to 0.800 mm was recovered by the gas-fluidized bed separator at the selected optimal gas velocity.However,separation of metals from particles smaller than 0.125 mm was not satisfactory.Further study is needed on metal recovery from fine particles.展开更多
The life of electronic equipment is becoming increasingly shorter and its replacement always generates a quantity of waste increase, giving rise to a problem of environmental character and still needed new options of ...The life of electronic equipment is becoming increasingly shorter and its replacement always generates a quantity of waste increase, giving rise to a problem of environmental character and still needed new options of solid waste management that will contribute to global sustainable development. Parts of these waste are TCI （the card＇s printed circuit） which containing dangerous elements and turns them into a polluting material from the soil, water and air, being harmful to human health if there is to proper and responsible way, so the recycling of TCI to obtain precious metals is an example of industrial materials that can be recycled. Despite this, large quantities of these are not recycled and some others are not considered. The objective of this work is to present a systematic and ecological methodology for the recovery of valuable materials contained in parts of used in computers, circuit boards using a leaching process. The method determines a set of variables to evaluate the kinetics of the reaction and the leaching of metals that form the substrate of metal and to establish the parameters that affect the rate of leaching of metals through a sensitivity analysis, to identify design alternatives. It determines the quantity and percentages that constitutes the motherboard, processor, video cards, accelerator graphics, network and memory cards RAM, among others and its content of metals such as Cu, Fe, Ag, Au and Pt.展开更多
基金the Shanghai EXPO Special Project from the Ministry of Science and Technology of China under the Grant No. 2004BA908B02
文摘A mechanical separation process was developed for recovering metals from printed circuit board(PCB) scrap;it included three steps:impact crushing,sieving and fluidization separation.The mechanism of the technique was based on the difference in the crushabilities of metallic and nonmetallic materials in the PCBs that led to the concentrated distribution of metals in particles of larger sizes and nonmetals mostly in particles of smaller sizes.It was found that crushed PCB particles from 0.125 mm to 1.000 mm contained about 80% of metals in the PCBs.Metals acquired satisfactory liberation in particles smaller than 0.800 mm.The crushed PCB particles were sieved into fractions of different size ranges.Each fraction separately went through a gas-solid fluidized bed operating at a selected optimal gas velocity for the specific size range.Approximately 95% of metals in printed circuit board particles from 0.125 mm to 0.800 mm was recovered by the gas-fluidized bed separator at the selected optimal gas velocity.However,separation of metals from particles smaller than 0.125 mm was not satisfactory.Further study is needed on metal recovery from fine particles.
文摘The life of electronic equipment is becoming increasingly shorter and its replacement always generates a quantity of waste increase, giving rise to a problem of environmental character and still needed new options of solid waste management that will contribute to global sustainable development. Parts of these waste are TCI （the card＇s printed circuit） which containing dangerous elements and turns them into a polluting material from the soil, water and air, being harmful to human health if there is to proper and responsible way, so the recycling of TCI to obtain precious metals is an example of industrial materials that can be recycled. Despite this, large quantities of these are not recycled and some others are not considered. The objective of this work is to present a systematic and ecological methodology for the recovery of valuable materials contained in parts of used in computers, circuit boards using a leaching process. The method determines a set of variables to evaluate the kinetics of the reaction and the leaching of metals that form the substrate of metal and to establish the parameters that affect the rate of leaching of metals through a sensitivity analysis, to identify design alternatives. It determines the quantity and percentages that constitutes the motherboard, processor, video cards, accelerator graphics, network and memory cards RAM, among others and its content of metals such as Cu, Fe, Ag, Au and Pt.
