具有较低热膨胀系数的层压板与半固化片对印制电路板可靠性的改善How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can impove the reliability of printed circuit bords (PCBs)本文介绍了印制板制...具有较低热膨胀系数的层压板与半固化片对印制电路板可靠性的改善How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can impove the reliability of printed circuit bords (PCBs)本文介绍了印制板制造由于采用材料的不同而导致热膨胀系数(CTE)不均衡所带来的影响。展开更多
文摘具有较低热膨胀系数的层压板与半固化片对印制电路板可靠性的改善How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can impove the reliability of printed circuit bords (PCBs)本文介绍了印制板制造由于采用材料的不同而导致热膨胀系数(CTE)不均衡所带来的影响。
