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电子组装业钎接材料的发展 被引量:1
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作者 魏尔枝 曾乐 +1 位作者 石小平 居建华 《电子工艺技术》 1996年第4期3-8,共6页
CFC的禁用使得钎接材料制造商把重点放在水洗钎剂和免洗钎剂的研究。考虑到这两种钎剂的可靠性,现行的测试标准必须作相应的修改,新型钎剂的使用要配合新的组装工艺和设备,其中比较有生命力的是氮气保护钎接工艺。细节距SMD越... CFC的禁用使得钎接材料制造商把重点放在水洗钎剂和免洗钎剂的研究。考虑到这两种钎剂的可靠性,现行的测试标准必须作相应的修改,新型钎剂的使用要配合新的组装工艺和设备,其中比较有生命力的是氮气保护钎接工艺。细节距SMD越来越多的使用,推动了钎膏的发展,更深入地理解钎膏的流变性,有利于更好地控制钎膏的印刷性能。解决汽相焊中易于出现的虹吸问题。 展开更多
关键词 电子组装 钎接材料 电子材料
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Electrochemical response of Ti joints vacuum brazed with TiCuNi, AgCu, and Ag fillers 被引量:2
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作者 C.MARINHO F.TOPTAN +1 位作者 A.GUEDES A.C.ALVES 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第4期999-1011,共13页
The properties of the joints are dictated by the nature, distribution, and morphology of the phases formed at the interface. The mechanical properties of brazed joints are well documented in the literature, contrarily... The properties of the joints are dictated by the nature, distribution, and morphology of the phases formed at the interface. The mechanical properties of brazed joints are well documented in the literature, contrarily to their electrochemical behaviour. Thus, the main objective of this study was to understand the influence of the phases formed at the interface on the corrosion behaviour of commercially pure Ti brazed joints, produced by using TiCuNi, eutectic Ag Cu, and Ag filler foils. The electrochemical behaviour of the Ti joints was accessed by open circuit potential and potentiodynamic polarization tests in phosphate buffer saline solution electrolyte at body temperature. Results showed that Ag-based fillers induced susceptibility to micro-galvanic corrosion between the Ag-rich and Ti phases formed at the interface and commercially pure Ti base metal. However, no significant differences were observed between the joint system and the base material when brazing with TiCuNi filler. 展开更多
关键词 biomaterial TITANIUM joining brazing alloys interface microstructure corrosion
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