One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm ...One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.展开更多
The mechanical properties and microstructural distribution of the Cu/A1 brazing joints formed by torch-brazing with different Zn-A1 filler metals were investigated. The microstructure of the Zn-A1 alloys was studied b...The mechanical properties and microstructural distribution of the Cu/A1 brazing joints formed by torch-brazing with different Zn-A1 filler metals were investigated. The microstructure of the Zn-A1 alloys was studied by optical microscopy and scanning electron microscopy, and the phase constitution of the Cu/A1 joints was analyzed by energy dispersion spectrometry. The results show that the spreading area of the Zn-A1 filler metals on the Cu and A1 substrates increases as the A1 content increases. The mechanical results indicate that the shear strength reaches a peak value of 88 MPa when A1 and Cu are brazed with Zn-15AI filler metal. Microhardness levels from HV122 to HV515 were produced in the three brazing seam regions corresponding to various microstructure features. The Zn- and Al-rich phases exist in the middle brazing seam regions. However, two interface layers, CuZn3 and A12Cu are formed on the Cu side when the A1 content in the filler metals is 2% and more than 15%, respectively. The relationship between intermetallic compounds on Cu side and Zn-xA1 filler metals was investigated.展开更多
A series of Al?Si?Ge filler metals were studied for brazing aluminum. The microstructures and properties of the filler metals were investigated systematically. The results show that the liquidus temperature of Al?Si?G...A series of Al?Si?Ge filler metals were studied for brazing aluminum. The microstructures and properties of the filler metals were investigated systematically. The results show that the liquidus temperature of Al?Si?Ge filler metals drops from 592 to 519 °C as the content of Ge increases from 0 to 30% (mass fraction). As the content of Ge increases, bright eutectic Ge forms. However, as the Ge content exceeds 20%, the aggregation growth of the eutectic structure tends to happen and coarsened primary Si?Ge particle forms, which is detrimental to the properties of alloys. The Al?10.8Si?10Ge filler metal has good processability and wettability with the base metal Al. When this filler metal is used to braze 1060 aluminum, the complete joint can be achieved. Furthermore, the shear strength test results show that the fracture of brazed joint with Al?10.8Si?10Ge filler metal occurs in the base metal.展开更多
The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl（mass fraction） solution were studied by potentiodynamic polarization test and leaching measurement.The polarization curves indicated th...The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl（mass fraction） solution were studied by potentiodynamic polarization test and leaching measurement.The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint.The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn3O（OH）2Cl2 formed on the surface of Sn-0.75Cu solder at active dissolution stage.As the potential increased from active/passive transition stage,all the surface of Sn-0.75Cu solder was covered by the Sn3O（OH）2Cl2 and some pits appeared after the polarization test.Compared to the Sn-0.75Cu solder alloy,much more Sn3O（OH）2Cl2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints.The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.展开更多
To design a promising Al−Si filler alloy with a relatively low melting-point,good strength and plasticity for the Cu/Al joint,the Cu,Ni,Zr and Er elements were innovatively added to modify the traditional Al−Si eutect...To design a promising Al−Si filler alloy with a relatively low melting-point,good strength and plasticity for the Cu/Al joint,the Cu,Ni,Zr and Er elements were innovatively added to modify the traditional Al−Si eutectic filler.The microstructure and mechanical properties of filler alloys and Cu/Al joints were investigated.The result indicated that the Al−Si−Ni−Cu filler alloys mainly consisted of Al(s,s),Al_(2)(Cu,Ni)and Si(s,s).The Al−10Si−2Ni−6Cu filler alloy exhibited relatively low solidus(521℃)and liquidus(577℃)temperature,good tensile strength(305.8 MPa)and fracture elongation(8.5%).The corresponding Cu/Al joint brazed using Al−10Si−2Ni−6Cu filler was mainly composed of Al_(8)(Mn,Fe)_(2)Si,Al_(2)(Cu,Ni)3,Al(Cu,Ni),Al_(2)(Cu,Ni)and Al(s,s),yielding a shear strength of(90.3±10.7)MPa.The joint strength was further improved to(94.6±2.5)MPa when the joint was brazed using the Al−10Si−2Ni−6Cu−0.2Er−0.2Zr filler alloy.Consequently,the(Cu,Ni,Zr,Er)-modified Al−Si filler alloy was suitable for obtaining high-quality Cu/Al brazed joints.展开更多
Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, ther...Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.展开更多
文摘One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.
基金Project (2009GJC20040) supported by the Scientist and Technician Serve the Enterprise,MOST,China
文摘The mechanical properties and microstructural distribution of the Cu/A1 brazing joints formed by torch-brazing with different Zn-A1 filler metals were investigated. The microstructure of the Zn-A1 alloys was studied by optical microscopy and scanning electron microscopy, and the phase constitution of the Cu/A1 joints was analyzed by energy dispersion spectrometry. The results show that the spreading area of the Zn-A1 filler metals on the Cu and A1 substrates increases as the A1 content increases. The mechanical results indicate that the shear strength reaches a peak value of 88 MPa when A1 and Cu are brazed with Zn-15AI filler metal. Microhardness levels from HV122 to HV515 were produced in the three brazing seam regions corresponding to various microstructure features. The Zn- and Al-rich phases exist in the middle brazing seam regions. However, two interface layers, CuZn3 and A12Cu are formed on the Cu side when the A1 content in the filler metals is 2% and more than 15%, respectively. The relationship between intermetallic compounds on Cu side and Zn-xA1 filler metals was investigated.
基金Project(2010A080402014)supported by the Guangdong Provincial Science and Technology Foundation,China
文摘A series of Al?Si?Ge filler metals were studied for brazing aluminum. The microstructures and properties of the filler metals were investigated systematically. The results show that the liquidus temperature of Al?Si?Ge filler metals drops from 592 to 519 °C as the content of Ge increases from 0 to 30% (mass fraction). As the content of Ge increases, bright eutectic Ge forms. However, as the Ge content exceeds 20%, the aggregation growth of the eutectic structure tends to happen and coarsened primary Si?Ge particle forms, which is detrimental to the properties of alloys. The Al?10.8Si?10Ge filler metal has good processability and wettability with the base metal Al. When this filler metal is used to braze 1060 aluminum, the complete joint can be achieved. Furthermore, the shear strength test results show that the fracture of brazed joint with Al?10.8Si?10Ge filler metal occurs in the base metal.
基金Project (2005DKA10400-Z23) supported by Chinese National Science and Technology InfrastructureProject (DUT10R:(3)65) supported by Fundamental Research Funds for the Central Universities,China
文摘The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl（mass fraction） solution were studied by potentiodynamic polarization test and leaching measurement.The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint.The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn3O（OH）2Cl2 formed on the surface of Sn-0.75Cu solder at active dissolution stage.As the potential increased from active/passive transition stage,all the surface of Sn-0.75Cu solder was covered by the Sn3O（OH）2Cl2 and some pits appeared after the polarization test.Compared to the Sn-0.75Cu solder alloy,much more Sn3O（OH）2Cl2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints.The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.
基金the financial support from the Primary Research&Development Plan of Zhejiang Province,China(No.2021C01178)the National MCF Energy R&D Program,China(No.2019YFE03100400)+1 种基金the National Natural Science Foundation of China(Nos.51705457,51975530,52005445,52175368)the Natural Science Foundation of Zhejiang Province,China(Nos.LQ21E050015,LQ21E050018).
文摘To design a promising Al−Si filler alloy with a relatively low melting-point,good strength and plasticity for the Cu/Al joint,the Cu,Ni,Zr and Er elements were innovatively added to modify the traditional Al−Si eutectic filler.The microstructure and mechanical properties of filler alloys and Cu/Al joints were investigated.The result indicated that the Al−Si−Ni−Cu filler alloys mainly consisted of Al(s,s),Al_(2)(Cu,Ni)and Si(s,s).The Al−10Si−2Ni−6Cu filler alloy exhibited relatively low solidus(521℃)and liquidus(577℃)temperature,good tensile strength(305.8 MPa)and fracture elongation(8.5%).The corresponding Cu/Al joint brazed using Al−10Si−2Ni−6Cu filler was mainly composed of Al_(8)(Mn,Fe)_(2)Si,Al_(2)(Cu,Ni)3,Al(Cu,Ni),Al_(2)(Cu,Ni)and Al(s,s),yielding a shear strength of(90.3±10.7)MPa.The joint strength was further improved to(94.6±2.5)MPa when the joint was brazed using the Al−10Si−2Ni−6Cu−0.2Er−0.2Zr filler alloy.Consequently,the(Cu,Ni,Zr,Er)-modified Al−Si filler alloy was suitable for obtaining high-quality Cu/Al brazed joints.
基金Project(50675234)supported by the National Natural Science Foundation of China
文摘Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.
