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TFT中底栅Cu膜凸起现象研究
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作者 高搏剑 徐佳慧 +2 位作者 夏杰 吴登刚 朱元 《信息记录材料》 2018年第5期10-11,共2页
超高清显示器需要具有低的信号传输层,Cu膜取代Al膜。针对绝缘膜高温下,底栅Cu膜,在玻璃边缘小黑点的现象,通过OM和FIB分析,确认为Cu膜凸起。本文通过实验提出一种H2预处理方式,利用H2的还原性,去除Cu表面氧化物,释放Cu膜内部应力,降低C... 超高清显示器需要具有低的信号传输层,Cu膜取代Al膜。针对绝缘膜高温下,底栅Cu膜,在玻璃边缘小黑点的现象,通过OM和FIB分析,确认为Cu膜凸起。本文通过实验提出一种H2预处理方式,利用H2的还原性,去除Cu表面氧化物,释放Cu膜内部应力,降低Cu膜凸起的发生率,在实际生产过程中具有应用价值。 展开更多
关键词 薄膜晶体管 铜凸起 绝缘膜 H2预处理
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Influence of pile-up on nanoindentation measurements in Cu-2wt.%Be samples with precipitates 被引量:1
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作者 S.MONTECINOS S.TOGNANA W.SALGUEIRO 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2019年第11期2340-2350,共11页
The influence of pile-up on the nanoindentation measurements in Cu 2wt.%Be samples with precipitates was carefully studied.The precipitates were formed by aging treatments for 1 h at different temperatures between 540... The influence of pile-up on the nanoindentation measurements in Cu 2wt.%Be samples with precipitates was carefully studied.The precipitates were formed by aging treatments for 1 h at different temperatures between 540 and 680 K.The load depth curves were analyzed using the classical Oliver and Pharr method,and the obtained elastic modulus and hardness were compared with values estimated by other techniques.An important level of pile-up was found in samples with precipitates and differences in the load depth curves were observed between the unaged and aged samples.A correction of the contact depth considering the pile-up proposed by Loubet was used for hardness estimation.For the determination of the elastic modulus,an approach based on the relation between the ratio of unloading work to indentation total work,with the ratio H/Er(H is the hardness;Er is the reduced modulus),was employed.A specific relation between both parameters was developed. 展开更多
关键词 PILE-UP nanoindentation measurement copper alloy precipitation microstructure mechanical properties
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