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添加剂对高铋电解铜体系中铜沉积过程的影响 被引量:9
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作者 鲁道荣 林建新 朱佩佩 《合肥工业大学学报(自然科学版)》 CAS CSCD 1998年第2期61-65,共5页
用稳态法研究了添加剂Cl-、glue、(NH2)2CS对高铋电解铜体系阴极铜沉积反应的影响。用AA、SEM、XRD等仪器研究了添加剂对阴极铜沉积的组成和晶面取向的影响。结果表明:Cl-对铜沉积反应起去极化作用。glu... 用稳态法研究了添加剂Cl-、glue、(NH2)2CS对高铋电解铜体系阴极铜沉积反应的影响。用AA、SEM、XRD等仪器研究了添加剂对阴极铜沉积的组成和晶面取向的影响。结果表明:Cl-对铜沉积反应起去极化作用。glue对铜沉积反应起强极化作用。(NH2)2CS能改变铜沉积过程的电化学反应机理,使铜沉积反应出现由扩散控制的极限电流。当Cl-、glue、(NH2)2CS共存于电解液中时,既对铜沉积反应起强极化作用,又使铜沉积过程的极限电流降低。以低电流密度(200A·m-2)电解,添加剂存在时可使阴极铜沉积中铋含量从0.013%降至0.0021%,但添加剂不影响铜沉积的晶面择优取向(220)。以高电流密度(1500A·m-2)电解时,添加剂的存在,会改变铜沉积的晶面择优取向。 展开更多
关键词 添加剂 铜沉积反应 极化 高铋电解体系
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论孔化电镀后孔壁出现空洞的原因
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作者 徐自金 《印制电路信息》 1998年第10期15-17,共3页
介绍可能造成金属化孔图形电镀后孔壁出现覆铜空洞的三个工序及使用5540高速沉铜工艺情况。同时根据实践经验,假设了铜沉积反应的反应历程,从而由质量作用定律得出沉积速率与甲醛浓度的平方成正比。结合试验数据,阐释了图形电镀后孔壁... 介绍可能造成金属化孔图形电镀后孔壁出现覆铜空洞的三个工序及使用5540高速沉铜工艺情况。同时根据实践经验,假设了铜沉积反应的反应历程,从而由质量作用定律得出沉积速率与甲醛浓度的平方成正比。结合试验数据,阐释了图形电镀后孔壁出现覆铜空洞的原因,并提出解决措施。 展开更多
关键词 沉积速率 图形电镀 沉积层厚度 金属化孔 印制板 孔壁 甲醛浓度 铜沉积反应 沉积时间 质量作用定律
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Chemical Vapor Deposition Mechanism of Copper Films on Silicon Substrates 被引量:1
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作者 Song Wu Bo Tao +1 位作者 Yong-ping Shen Qi Wang 《Chinese Journal of Chemical Physics》 SCIE CAS CSCD 北大核心 2006年第3期248-252,共5页
A versatile metal-organic chemical vapor deposition (MOCVD) system was designed and constructed. Copper films were deposited on silicon (100) substrates by chemical vapor deposition (CVD) using Cu(hfac)2 as a ... A versatile metal-organic chemical vapor deposition (MOCVD) system was designed and constructed. Copper films were deposited on silicon (100) substrates by chemical vapor deposition (CVD) using Cu(hfac)2 as a precursor. The growth of Cu nucleus on silicon substrates by H2 reduction of Cu(hfac)2 was studied by atomic force microscopy and scanning electron microscopy. The growth mode of Cu nucleus is initially Volmer-Weber mode (island), and then transforms to Stranski-Rastanov mode (layer-by-layer plus island). The mechanism of Cu nucleation on silicon (100) substrates was further investigated by X-ray photoelectron spectroscopy. From Cu2p, O1s, F1s, Si2p patterns, the observed C=O, OH and CF3/CF2 should belong to Cu(hfac) formed by the thermal dissociation of Cu(hfac)2. H2 reacts with hfac on the surface, producing OH. With its accumulation, OH reacts with hfac, forming HO-hfac, and desorbs, meanwhile, the copper oxide is reduced, and thus the redox reaction between Cu(hafc)2 and H2 occurs. 展开更多
关键词 Metal-organic chemical vapor deposition Copper film Silicon (100) Deposition reaction mechanism
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Highly effective electrochemical water oxidation by copper oxide film generated in situ from Cu(Ⅱ) tricine complex
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作者 Yan Gao Hu Chen +4 位作者 Lu Ye Zhongkai Lu Yanan Yao Yu Wei Xuyang Chen 《Chinese Journal of Catalysis》 SCIE EI CAS CSCD 北大核心 2018年第3期479-486,共8页
Developing highly efficient and stable water oxidation catalysts based on abundant metallic elements is a challenge that must be met to fulfill the promise of water splitting for clean energy production.In this work,w... Developing highly efficient and stable water oxidation catalysts based on abundant metallic elements is a challenge that must be met to fulfill the promise of water splitting for clean energy production.In this work,we developed an oxygen evolution reaction catalyst consisting of a nanostructured film electrodeposited from a phosphate buffer solution(0.2mol/L,pH=12.0)containing Cu‐tricine complex.A Tafel plot showed that the required overpotential for a current densityof1.0mA/cm2was only395mV and the Tafel slope was46.7mV/decade.In addition,the Cu‐tricine film maintained a stable current density of7.5mA/cm2for the oxygen evolution reaction in phosphate buffer solution for10h,and a Faradaic efficiency of99%was obtained. 展开更多
关键词 Water oxidation Oxygen evolution reaction ELECTRODEPOSITION Copper oxide film ELECTROCATALYST
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