Superhydrophilic surfaces were fabricated on copper substrates by an electrochemical deposition and sintering process. Superhydrophobic surfaces were prepared by constructing micro/nano-structure on copper substrates ...Superhydrophilic surfaces were fabricated on copper substrates by an electrochemical deposition and sintering process. Superhydrophobic surfaces were prepared by constructing micro/nano-structure on copper substrates through an electrochemical deposition method. Conversion from superhydrophobic to superhydrophilic was obtained via a suitable sintering process. After reduction sintering, the contact angle of the superhydrophilic surfaces changed from 155° to 0°. The scanning electron microscope(SEM) images show that the morphology of superhydrophobic and superhydrophilic surfaces looks like corals and cells respectively. The chemical composition and crystal structure of these surfaces were examined using energy dispersive spectrometry(EDS) and X-ray diffraction(XRD). The results show that the main components on superhydrophobic surfaces are Cu, Cu2 O and Cu O, while the superhydrophilic surfaces are composed of Cu merely. The crystal structure is more inerratic and the grain size becomes bigger after the sintering. The interfacial strength of the superhydrophilic surfaces was investigated, showing that the interfacial strength between superhydrophilic layer and copper substrate is considerably high.展开更多
Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy...Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu 7 S 4 . The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu 7 S 4 admirably, compared with Cu, which contributes to the stable super hydrophobic surface.展开更多
基金Supported by the National Natural Science Foundation of China(51275180)the Fundamental Research Funds for the Central Universities(2013ZM0003)the Doctorate Dissertation Funds of Guangdong Province(sybzzxm 201213)
文摘Superhydrophilic surfaces were fabricated on copper substrates by an electrochemical deposition and sintering process. Superhydrophobic surfaces were prepared by constructing micro/nano-structure on copper substrates through an electrochemical deposition method. Conversion from superhydrophobic to superhydrophilic was obtained via a suitable sintering process. After reduction sintering, the contact angle of the superhydrophilic surfaces changed from 155° to 0°. The scanning electron microscope(SEM) images show that the morphology of superhydrophobic and superhydrophilic surfaces looks like corals and cells respectively. The chemical composition and crystal structure of these surfaces were examined using energy dispersive spectrometry(EDS) and X-ray diffraction(XRD). The results show that the main components on superhydrophobic surfaces are Cu, Cu2 O and Cu O, while the superhydrophilic surfaces are composed of Cu merely. The crystal structure is more inerratic and the grain size becomes bigger after the sintering. The interfacial strength of the superhydrophilic surfaces was investigated, showing that the interfacial strength between superhydrophilic layer and copper substrate is considerably high.
基金Supported by the Beijing Youth Fellowship Program and the Fundamental Research Funds for the Central Universities(2011YXL056)
文摘Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu 7 S 4 . The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu 7 S 4 admirably, compared with Cu, which contributes to the stable super hydrophobic surface.
