轧制温度对铝铜锂合金疲劳性能的影响

采用标准紧凑拉伸C(T)试样研究了室温冷轧和350℃温轧的铝铜锂合金固溶时效处理后的疲劳裂纹扩展性能,并采用光学显微镜、扫描电子显微镜、透射电子显微镜和电子背散射衍射对合金微观组织以及疲劳断口进行分析以揭示其内在影响机理。结果表明,固溶时效处理后,室温冷轧板材的再结晶程度比350℃温轧板材高25.3%,裂纹易沿着大角度晶界扩展;温轧板材的疲劳裂纹扩展速率较低,抗疲劳性能较好。

铜碲锂多元合金在3.5% NaCl溶液中腐蚀行为的研究

研究了铜碲锂多元合金中碲对合金耐腐蚀性的影响。经过25℃在 3.5% NaCl溶液中的全浸试验表明铜碲锂多元合金比纯铜具有更好的耐蚀性。利用扫描电镜观察腐蚀试样的表面形貌,发现表面不均匀的覆盖着一层多孔的腐蚀产物。经 X 射线衍射仪分析确定,该腐蚀产物为 Cu2 (OH)3Cl 和 Cu2O 的混合物。

锂对工业纯铜抗腐蚀性能的影响

研究了在工业纯铜中加入微量锂对其抗腐蚀性能的影响。结果表明 :在工业纯铜中加入微量锂会使其在Na Cl饱和溶液中的抗腐蚀性能有所提高 ,但当超过一极限值时 ,其抗腐蚀性能又下降 ,这是由于锂对纯铜的净化效应及对晶粒大小、组织形态及晶格畸变的影响而产生的综合效应所致 ,其主要腐蚀机制是吸氧腐蚀和铜及其它夹杂形成的微电池腐蚀。

锂对工业纯铜导电性能的作用效应

用X光电子能谱仪及同步辐射装置分析了铜锂合金的表面电子结合能及费米面处的电子能态分布.研究表明:微量锂的加入影响了纯铜的价带,使纯铜费米面处的电子态密度下降,从而降低纯铜的导电率,但是由于锂具有良好的脱氧、除硫等净化作用,使纯铜中的其他杂质含量有所下降,因此两者相消后略微降低铜的导电率;随锂含量的增加,铜的导电率呈逐渐下降的趋势,这是因为尽管加入锂后脱气除杂效果显著,但残余的锂主要固溶于铜中,使铜的晶格产生畸变,同时提高了纯铜的表面电子结合能,从而使金属导电率有所下降.

锂对工业纯铜的抗氧化性能的影响

向工业纯铜中加入不同含量的锂能提高其３００ ℃以下的低温抗氧化性， 锂的最佳含量为０ ．０２８８ ％ ， 这是由于在铜的表面生成一种致密度较高的ＬｉＣｕＯ 新相， 阻碍或减缓空气中的氧在铜基体中的扩散所致； 温度较高时其抗氧化性降低， 锂含量越高抗氧化性能越差， 锂易于在氧化膜的缺陷处富集， 严重时会在氧化膜中及铜基体中形成大空洞或连成网状，

自然时效对Al-Li-Cu-Mg-Zr合金的影响

采用透射电镜 (TEM)和维氏硬度计详细研究淬火后与人工时效前的时间间隔 (自然时效 )对 Al- L i- Cu- Mg合金的影响。研究发现 ,通过在人工时效前引入自然时效可以提高 Al- 2 .4L i- 1.16 Cu- 0 .8Mg- 0 .1Zr(wt% )合金的硬度。合金硬度的增加主要来自于 S相数量的增加和分布更均匀。在人工时效前引入自然时效对 δ′相的尺寸和分布没有影响。

Al-Cu-Li系合金热轧板材组织、性能和织构的研究

研究了 Al-Cu-Li-( Mn) -( Zr)合金热轧板在 T8态下的显微组织、性能和织构情况。发现因合金的成分不同 ,T8处理对它们造成的影响也不同。其原因主要是由于 Mn、Zr对合金内部的再结晶过程产生了不同的影响。对热轧板的织构和性能测试结果表明 ,晶体学织构与材料的各向异性之间存在着对应关系 ,材料的塑性各向异性比强度各向异性更为严重 。

Sc对Al-3Cu-1Li合金显微组织和电化学腐蚀行为的影响

用真空熔炼炉制备Al-3Cu-1Li-xSc(x=0、0.1%、0.3%和0.5%)合金,观察合金的显微组织,测量合金的维氏硬度。在0.1mol/L NaCl溶液中,用开路电位(OCP)、极化曲线、电化学阻抗谱(EIS)和Mott-Schottky曲线研究了Sc对Al-3Cu-1Li合金腐蚀行为的影响。结果表明:Sc细化了合金的显微组织,提高了合金硬度;Sc添加后未改变合金的电化学腐蚀机制,该合金热力学稳定性提高的同时耐蚀性有所降低;该合金的耐蚀性与其腐蚀产物膜的载流子密度高低具有相关性。

杂质及Ce含量对Al-Li-Cu-Zr和Al-Li-Mg-Zr合金韧化水平的影响

研究了 Fe,Si,Na,K杂质及 Ce微合金化对 A l-L i-Cu-Zr及 Al-L i-Mg-Zr合金内、外韧化水平的影响 .杂质降低了 Al-L i-Cu-Zr合金的内韧化水平 ,从而降低了其总体韧化水平 .由于 Al-L i-Cu-Zr合金中添加微量 Ce可明显提高材料的内韧化水平及抑制杂质的脆化作用 ,故可改善合金的断裂韧性 .对于Al-L i-Mg-Zr合金 。

Li对工业纯Cu的变质效应研究

在真空保护气氛下 ,熔炼不同锂加入量的铜锂合金 ,用扫描电镜及图像分析仪分析其晶粒大小。结果表明 ,微量锂增大工业纯铜的晶粒尺寸 ,且随锂含量的增加 ,其晶粒尺寸亦随之增大 ,增至一定值后其晶粒尺寸又随锂含量的增加而减小 ,这主要是由于锂加入量的改变引起晶体核心形核率的变化所致。

Exfoliation corrosion of T6- and T8-aged Al_xCu_yLi_z alloy

The exfoliation corrosion behavior of a novel Al-Li alloy treated by T6- and T8-peak ageing was studied by electrochemical impedance spectroscopy(EIS) technique. The surface morphology of corroded samples was examined by scanning electron microscope(SEM). The microstructure of un-corroded samples was observed by transmission electron microscope(TEM). At early stage of immersion in EXCO, EIS plots of the two differently processed samples are composed of a capacitive arc in the high frequency range and an inductive loop in the low frequency range. Inductive loop disappears with the increasing of immersion time and two capacitive arcs appear. T6-treated alloy has higher exfoliation susceptibility than T8-treated one, suggested by different exfoliation starting time, which is 23 h and 27 h respectively. T1 phase and equilibrium precipitate at the grain boundary of T6-treated alloy are larger in amount and size than those of T8-treated alloy. This is the main reason for the higher exfoliation susceptibility of T6-treated alloy.

Calculation of free energy of Al-Cu-Li alloy under electric field

Based on Thomas-Fermi model, the interior potential boundary condition with the effect of electric field was defined, the calculation method of free energy for atom cluster under electric field was established. The change of free energy of Al-Cu-Li alloy under the effect of electric field was calculated quantitatively. It is shown that: near the zero electric field and the side of positive electric field, the free energy of Cu4LiAl7 compound at aging temperature 460 K is higher than that of free energy at solid solution temperature 725 K, but once the negative electric field increases to certain degree there will be opposite result. Under the effect of electric field, at 725 K the free energy of Cu4LiAl7 is higher than that of Al-1.0%Li-4.0%Cu, and at 460 K the free energy of compound is lower than that of solid solution. When the copper content in the Al-Li-Cu solid solution is below 5%, under the effect of electric field the free energy of solid solution increases gradually with the increasing of copper content, but the increasing amplitude reduces with the increasing of copper content. The free energy of binary solid solution increases with the addition of lithium, and with the increasing of electric field intensity the free energy margin of two kinds of solid solution becomes bigger.

Microstructure evolution and mechanical properties of Al−3.6Cu−1Li alloy via cryorolling and aging

An Al−3.6Cu−1Li alloy was subjected to room temperature rolling and cryorolling to investigate their effects on microstructure evolution and mechanical properties.The microstructure and aging characteristics of the room temperature-rolled and the cryorolled alloys with 70%and 90%of thickness reductions were studied by microstructure analysis and mechanical tests.The samples subjected to cryorolling with 90%of thickness reduction have high strength and good toughness.This is mainly due to the inhibition of dynamic recovery and the accumulation of high-density dislocations in cryorolled samples.In addition,the artificial aging reveals that the temperature at which peak hardness is attained is inversely proportional to the deformation amount and directly proportional to the rolling temperature.Moreover,bright field images of cryorolled samples after aging indicate the existence of T1(Al2CuLi)precipitates.This suggests that the high stored strain energy enhances the aging kinetics of the alloy,which further promotes the nucleation of T1 phases.

Mechanical properties and microstructure evolution of an Al-Cu-Li alloy subjected to rolling and aging

The mechanical properties and microstructure of Al-Cu-Li alloy sheets subjected to cryorolling(-100 ° C,-190 ℃) or hot rolling(400 ℃) and subsequent aging at 160 ℃ for different times were investigated. The dynamic precipitation and dislocation characterizations were examined via transmission electron microscopy and X-ray diffraction. The grain morphologies and the fracture-surface morphologies were studied via optical microscopy and scanning electron microscopy. Samples subjected to cryorolling followed by aging exhibited relatively high dislocation densities and a large number of precipitates compared with hot-rolled samples. The samples cryorolled at-190 ℃ and then aged for 15 h presented the highest ultimate tensile strength(586 MPa), while the alloy processed via hot rolling followed by 10 h aging exhibited the highest uniform elongation rate(11.5%). The size of precipitates increased with the aging time, which has significant effects on the interaction mechanism between dislocations and precipitates. Bowing is the main interaction method between the deformation-induced dislocations and coarsened precipitates during tensile tests, leading to the decline of the mechanical properties of the alloy during overaging. These interesting findings can provide significant insights into the development of materials possessing both excellent strength and high ductility.

Flow stress behavior of Al-Cu-Li-Zr alloy containing Sc during hot compression deformation

The flow stress behavior of Al-3.5Cu-1.5Li-0.25(Sc+Zr) alloy during hot compression deformation was studied by isothermal compression test using Gleeble-1500 thermal-mechanical simulator. Compression tests were preformed in the temperature range of 653-773 K and in the strain rate range of 0.001-10 s-1 up to a true plastic strain of 0.7. The results indicate that the flow stress of the alloy increases with increasing strain rate at a given temperature,and decreases with increasing temperature at a given imposed strain rate. The relationship between the flow stress and the strain rate and the temperature was derived by analyzing the experimental data. The flow stress is in a hyperbolic sine relationship with the strain rate,and in an Arrhenius relationship with the temperature,which imply that the process of plastic deformation at an elevated temperature for this material is thermally activated. The flow stress of the alloy during the elevated temperature deformation can be represented by a Zener-Hollomon parameter with the inclusion of the Arrhenius term. The values of n,α and A in the analytical expressions of flow stress σ are fitted to be 5.62,0.019 MPa-1 and 1.51×1016 s-1,respectively. The hot deformation activation energy is 240.85 kJ/mol.

Strengthening mechanism of T8-aged Al-Cu-Li alloy with increased pre-deformation

The microstructure evolution and mechanical properties of a T8-aged Al-Cu-Li alloy with increased pre-deformation(0-15%) were investigated,revealing the microstructure-strength relationship and the intrinsic strengthening mechanism.The results show that increasing the pre-deformation levels remarkably improves the strength of the alloy but deteriorates its ductility.Dislocations introduced by pre-deformation effectively suppress the formation of Guinier-Preston(GP) zones and provide more nucleation sites for T1 precipitates.This leads to more intensive and finer T1 precipitates in the samples with higher pre-deformation levels.Simultaneously,the enhanced precipitation of T1 precipitates and inhibited formation of GP zones cause the decreases in number and sizes of θ′ precipitates.The quantitative descriptions of the strength contributions from different strengthening mechanisms reveal that strengthening contributions from T1 and θ′ precipitates decrease with increasing pre-deformation.The reduced diameters of T1 precipitates are primarily responsible for their weakened strengthening effects.Therefore,the improved strength of the T8-aged Al-Cu-Li alloy is mainly attributed to the stronger strain hardening from the increased pre-deformation levels.

Low-temperature fusion fabrication of Li-Cu alloy anode with in situ formed 3D framework of inert LiCu_x nanowires for excellent Li storage performance

The commercialization of rechargeable Li metal batteries is hindered by dendrite growth and volumetric variation. Herein, we report a Li-rich dual-phase Li-Cu alloy with built-in 3 D conductive skeleton to replace conventional planar Li anode. The Li-Cu alloy is simply prepared by fusion of Li and Cu metals at a relatively low-temperature of 500 °C, followed by a cooling process where phase-segregation leads to metallic Li phase distributed in the network of LiCu_x solid solution phase. Different from the common Li alloy, the electrochemical alloying reaction between Li and Cu metals is not observed. Therefore, the lithiophilic LiCu_x nanowires guides conformal plating of Li and the porous framework provides superior dimensional stability for the anode. This unique ferroconcrete-like structure of Li-Cu alloy enables dendrite-free Li plating for an expanded cycling lifetime. Constructing a new type of Li alloy with in situ formed electrochemically inactive framework is a promising and easily scaled-up strategy toward practical application of Li metal anodes.