The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is...The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%,mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.展开更多
The interfacial bonding of Ag-Cu (they are limited soluble) formed by the technology of cold pressure welding was discussed from the point of metallurgic view in this paper. Meanwhile, tensile test and microscopic tes...The interfacial bonding of Ag-Cu (they are limited soluble) formed by the technology of cold pressure welding was discussed from the point of metallurgic view in this paper. Meanwhile, tensile test and microscopic test were adopted for studying the state of interfacial bonding, suggesting that the joint of Ag-Cu has not only strong welding joint but also atomic diffusion on the interface. For Ag-Cu, the interaction of dislocation caused by plastic deformation will cause the strain and the vibration of microconstructer defects, accompanied by emitting energy. The energy increases the atomic action and the amplitude of atomic vibration, and the result is that the atom can diffuse to several lattice parameters deep from interface to inner metals. Therefore, under the condition of chemical potential gradient, the special technique, cold pressure welding rather than basic requirements of diffusion should be taken into account. During the cold pressure welding, plastic deformation plays an important role for it causes the metals′ displacement, crystal defects, further activates the surface atoms. Finally, the fracture of atomic bonding leads to the atomic exchange and diffusion between the new metals′ surfaces.In other words the metals Ag,Cu can achieve solidate bonding by cold pressure welding accompanied by the atomic diffusion. Moreover, theoretical analysis and calculation on the basis of thermodynamics, crystallogy, so- lid physics,etc, have been applied to calculate the amount of atomic diffusion, which has further proved the testing results that joint Ag-Cu has strong bonding strength through the mechanism of atomic diffusion.展开更多
基金Project(06GK2002) supported by the Major Project of Hunan Provincial Science and Technology Development Strategy
文摘The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%,mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.
文摘The interfacial bonding of Ag-Cu (they are limited soluble) formed by the technology of cold pressure welding was discussed from the point of metallurgic view in this paper. Meanwhile, tensile test and microscopic test were adopted for studying the state of interfacial bonding, suggesting that the joint of Ag-Cu has not only strong welding joint but also atomic diffusion on the interface. For Ag-Cu, the interaction of dislocation caused by plastic deformation will cause the strain and the vibration of microconstructer defects, accompanied by emitting energy. The energy increases the atomic action and the amplitude of atomic vibration, and the result is that the atom can diffuse to several lattice parameters deep from interface to inner metals. Therefore, under the condition of chemical potential gradient, the special technique, cold pressure welding rather than basic requirements of diffusion should be taken into account. During the cold pressure welding, plastic deformation plays an important role for it causes the metals′ displacement, crystal defects, further activates the surface atoms. Finally, the fracture of atomic bonding leads to the atomic exchange and diffusion between the new metals′ surfaces.In other words the metals Ag,Cu can achieve solidate bonding by cold pressure welding accompanied by the atomic diffusion. Moreover, theoretical analysis and calculation on the basis of thermodynamics, crystallogy, so- lid physics,etc, have been applied to calculate the amount of atomic diffusion, which has further proved the testing results that joint Ag-Cu has strong bonding strength through the mechanism of atomic diffusion.
