Single Ni-P and Ni-Mo-P coatings as well as duplex Ni-P/Ni-Mo-P coatings with the same compositions were prepared by electroless plating.The residual stresses of the coatings on the surface and cross sections were mea...Single Ni-P and Ni-Mo-P coatings as well as duplex Ni-P/Ni-Mo-P coatings with the same compositions were prepared by electroless plating.The residual stresses of the coatings on the surface and cross sections were measured by nanoindentation and AFM analysis,and the corrosion behaviour of the coatings in10%HCl solution was evaluated by electrochemical methods,to establish the correlation between the residual stresses and corrosion behaviour of the coatings.The results showed that the single Ni-P and duplex Ni-P/Ni-Mo-P coatings presented residual compressive stresses of241and206MPa respectively,while the single Ni-Mo-P coating exhibited a residual tensile stress of257MPa.The residual compressive stress impeded the growth of the pre-existing porosity in the coatings,protecting the integrity of the coating.The duplex Ni-P/Ni-Mo-P coatings had better corrosion resistance than their respective single coating.In addition,the stress states affect the corrosive form of coatings.展开更多
Although plating is a necessary process for SMT components, it alters the magnetic characteristics and inductance level of Ni-Cu-Zn ferrite components. The results of this work show that the following three factors in...Although plating is a necessary process for SMT components, it alters the magnetic characteristics and inductance level of Ni-Cu-Zn ferrite components. The results of this work show that the following three factors in plating affect these components, and the effects are different for Ni- and Sn-plating： （1） Plating layers exert stresses and react with the residual stress of components to change the inductance level, and the effect of the tin layer is greater than that of the nickel one; （2） The plating current induces a magnetic field inside the components directly and indirectly, and this remains as remanence inside the components and reduces the inductance level, and the effect level of Ni-plating is greater than that of Sn-plating; （3） The plating solution corrodes the interface of the termination and ferrite core of the components to release the residual stress, and causes an increase in inductance, and the effect of Sn-plating is greater than that of Ni-plating. In addition, the inductance level is the result of the net effect of these three factors, and if the sintering temperature is increased to change in the type of residual stress, the net effect will be changed.展开更多
基金Project(ZR2011EMM014)supported by Shandong Provincial Natural Science Foundation of China
文摘Single Ni-P and Ni-Mo-P coatings as well as duplex Ni-P/Ni-Mo-P coatings with the same compositions were prepared by electroless plating.The residual stresses of the coatings on the surface and cross sections were measured by nanoindentation and AFM analysis,and the corrosion behaviour of the coatings in10%HCl solution was evaluated by electrochemical methods,to establish the correlation between the residual stresses and corrosion behaviour of the coatings.The results showed that the single Ni-P and duplex Ni-P/Ni-Mo-P coatings presented residual compressive stresses of241and206MPa respectively,while the single Ni-Mo-P coating exhibited a residual tensile stress of257MPa.The residual compressive stress impeded the growth of the pre-existing porosity in the coatings,protecting the integrity of the coating.The duplex Ni-P/Ni-Mo-P coatings had better corrosion resistance than their respective single coating.In addition,the stress states affect the corrosive form of coatings.
文摘Although plating is a necessary process for SMT components, it alters the magnetic characteristics and inductance level of Ni-Cu-Zn ferrite components. The results of this work show that the following three factors in plating affect these components, and the effects are different for Ni- and Sn-plating： （1） Plating layers exert stresses and react with the residual stress of components to change the inductance level, and the effect of the tin layer is greater than that of the nickel one; （2） The plating current induces a magnetic field inside the components directly and indirectly, and this remains as remanence inside the components and reduces the inductance level, and the effect level of Ni-plating is greater than that of Sn-plating; （3） The plating solution corrodes the interface of the termination and ferrite core of the components to release the residual stress, and causes an increase in inductance, and the effect of Sn-plating is greater than that of Ni-plating. In addition, the inductance level is the result of the net effect of these three factors, and if the sintering temperature is increased to change in the type of residual stress, the net effect will be changed.
