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镍铂合金溅射靶材在半导体制造中的应用及发展趋势 被引量:12
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作者 王一晴 郭俊梅 +4 位作者 管伟明 闻明 谭志龙 张俊敏 王传军 《贵金属》 CAS CSCD 北大核心 2016年第3期87-92,共6页
镍铂合金靶材广泛应用于半导体工业。通过磁控溅射,镍铂合金靶材在硅器件表面沉积并反应生成镍铂硅化物薄膜,实现半导体接触及互连。对镍铂硅化物在肖特基二极管制造和半导体集成电路中的应用进行了分析,综述了镍铂合金结构与性质研究... 镍铂合金靶材广泛应用于半导体工业。通过磁控溅射,镍铂合金靶材在硅器件表面沉积并反应生成镍铂硅化物薄膜,实现半导体接触及互连。对镍铂硅化物在肖特基二极管制造和半导体集成电路中的应用进行了分析,综述了镍铂合金结构与性质研究成果及制备方法,提出了镍铂合金靶材高纯化、提高磁透率和控制晶粒度的发展趋势。 展开更多
关键词 金属材料 合金薄膜 镍铂硅化物 溅射靶材 半导体 发展趋势
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Effect of Pt Addition on the Stress of NiSi Film Formed on Si (100)
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作者 黄巍 茹国平 +4 位作者 Detavernier C Van Meirhaeghe R L 蒋玉龙 屈新萍 李炳宗 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第5期635-639,共5页
In order to clarify the effect of pt addition on the stress of NiSi film, in situ stress measurements were taken to evaluate the stress evolution during heating and cooling treatment of Ni1- x Ptx Si alloy films with ... In order to clarify the effect of pt addition on the stress of NiSi film, in situ stress measurements were taken to evaluate the stress evolution during heating and cooling treatment of Ni1- x Ptx Si alloy films with different Pt concentrations. The room temperature stress, which is mainly thermal stress, was measured to be 775MPa and 1.31GPa for pure NiSi and pure PtSi films grown on Si (100) substrates,respectively. For Ni1-x Ptx Si alloy film, the room temperature stress was observed to increase steadily with Pt concentration. From the temperature dependent stress evolution curves,the stress relaxation temperature was found to increase from 440℃ (for pure NiSi film) to 620℃ (for pure PtSi film) with increasing Pt concentration, thus influencing the residual stress at room temperature. 展开更多
关键词 NiSi Ni1- x Ptx Si stress
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