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添加剂对阴极电铜表面质量的影响 被引量:14
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作者 蒙延双 李坚 +1 位作者 朱祖泽 王达健 《云南冶金》 2002年第5期29-32,共4页
研究明胶、硫脲、十二烷基磺酸钠、丙烯基硫脲及阿维同-A等作为添加剂 ,对阴极铜表面质量的影响。通过目测和金相显微观察对其影响效果进行了评价。结果表明 :十二烷基磺酸钠和阿维同-A的作用效果相似 ,丙烯基硫脲也能明显改善电铜表面... 研究明胶、硫脲、十二烷基磺酸钠、丙烯基硫脲及阿维同-A等作为添加剂 ,对阴极铜表面质量的影响。通过目测和金相显微观察对其影响效果进行了评价。结果表明 :十二烷基磺酸钠和阿维同-A的作用效果相似 ,丙烯基硫脲也能明显改善电铜表面质量 ,有望成为铜电解工艺中的添加剂。 展开更多
关键词 添加剂 阴极电铜 表面质量
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Separation and recovery of Cu and As from copper electrolyte through electrowinning and SO_2 reduction 被引量:4
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作者 郑雅杰 彭映林 +1 位作者 柯浪 陈文汨 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2013年第7期2166-2173,共8页
Cu and As were separated and recovered from copper electrolyte by multiple stage electrowinning, reduction with SO2and evaporative crystallization. Experimental results showed that when the current density was 200 A/m... Cu and As were separated and recovered from copper electrolyte by multiple stage electrowinning, reduction with SO2and evaporative crystallization. Experimental results showed that when the current density was 200 A/m2, the electrolyte temperature was 55 °C, the electrolyte circulation rate was about 10 mL/min and the final Cu concentration was higher than 25.88 g/L, the pure copper cathode was recovered. By adjusting the current density to 100 A/m2 and the electrolyte temperature to 65 °C, the removal rate of As was 18.25% when the Cu concentration decreased from 24.69 g/L to 0.42 g/L. After As(V) in Cu-depleted electrolyte was fully reduced to As(Ⅲ) by SO2, the resultant solution was subjected to evaporative crystallization, then As2O3 was produced, and the recovery rate of As was 59.76%. The cathodic polarization curves demonstrated that both Cu2+ concentration and As(V) affect the limiting current of Cu2+ deposition. 展开更多
关键词 copper electrolyte copper cathode ARSENIC sulfur dioxide REDUCTION ELECTROWINNING CRYSTALLIZATION
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A rapid one-step electrodeposition process for fabrication of superhydrobic surfaces on anode and cathode 被引量:3
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作者 郝丽梅 闫小乐 +2 位作者 解忧 张涛 陈志 《Journal of Central South University》 SCIE EI CAS CSCD 2016年第7期1576-1583,共8页
This work presents a method to solve the weak solubility of zinc chloride(ZnCl_2) in the ethanol by adding some reasonable water into an ethanol electrolyte containing ZnCl_2 and myristic acid(CH_3(CH_2)_(12)COOH).A r... This work presents a method to solve the weak solubility of zinc chloride(ZnCl_2) in the ethanol by adding some reasonable water into an ethanol electrolyte containing ZnCl_2 and myristic acid(CH_3(CH_2)_(12)COOH).A rapid one-step electrodeposition process was developed to fabricate anodic(2.5 min) and cathodic(40 s) superhydrophobic surfaces of copper substrate(contact angle more than 150°) in an aqueous ethanol electrolyte.Morphology,composition,chemical structure and superhydrophobicity of these superhydrophobic surfaces were investigated by SEM,FTIR,XRD,and contact angle measurement,respectively.The results indicate that water ratio of the electrolyte can reduce the required deposition time,superhydrophobic surface needs over 30 min with anhydrous electrolyte,while it needs only 2.5 min with electrolyte including 10 mL water,and the maximum contact angle of anodic surface is 166° and that of the cathodic surface is 168°.Two copper electrode surfaces have different reactions in the process of electrodeposition time,and the anodic copper surface covers copper myristate(Cu[CH_3(CH_2)_(12)COO]_2) and cupric chloride(CuCl);while,zinc myristate(Zn[CH_3(CH_2)_(12)COO]_2) and pure zinc(Zn) appear on the cathodic surface. 展开更多
关键词 one-step electrodeposition process SUPERHYDROPHOBICITY contact angle AQUEOUS ANODE CATHODE
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