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锂电极表面膜的组成和阻抗行为 被引量:1
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作者 霍国燕 《河北化工》 1995年第4期30-33,共4页
介绍了锂电池中锂电极的表面膜的组成和阻抗行为,并根据其表面膜的阻抗行为提出了电化学模型。
关键词 锂电极 表面膜 阻抗行为 锂电池
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犯罪心理测试中阻抗行为的鉴别
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作者 胡顺华 张蓓 +2 位作者 李安育 辛忠安 周志兵 《海峡科学》 2014年第11期64-65,共2页
犯罪心理测试中,被测人存在大量的防御阻抗行为。该文试图从时间维度鉴别阻抗行为:测试前,阻抗行为是围绕着是否"自愿接受测试"展开的;测试中,阻抗行为是围绕着应对问题展开的;测试结束后,阻抗行为是围绕着获取测试结果展开的。
关键词 犯罪心理测试 阻抗行为 反测试 鉴别
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Corrosion behavior of tinplate in NaCl solution 被引量:10
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作者 夏大海 宋诗哲 +3 位作者 王吉会 毕慧超 蒋雨轩 韩哲文 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2012年第3期717-724,共8页
The corrosion process of tinplate in 0.5 mol/L NaCl solution was investigated using the electrochemical impedance spectroscopy(EIS),and the morphology and structure of the corrosion products were characterized by sc... The corrosion process of tinplate in 0.5 mol/L NaCl solution was investigated using the electrochemical impedance spectroscopy(EIS),and the morphology and structure of the corrosion products were characterized by scanning electron microscope(SEM),scanning probe microscopy(SPM),X-ray diffraction(XRD) and X-ray photoelectron spectroscopy(XPS).The results showed that the resistance of tin coating,Rc,was essentially constant but the charge transfer resistance,Rct,decreased by 2 orders of magnitude,which indicated that the tin coating was not seriously corroded while the carbon steel substrate was corroded continuously.The corrosion of tinplate in 0.5 mol/L NaCl solution was mainly the dissolution of carbon steel substrate because of the defects in the tin layer and the corrosion product was mainly γ-FeOOH. 展开更多
关键词 TINPLATE corrosion behavior electrochemical impedance spectroscopy NaCl solution
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化学复合镀Ni-P-SiO_2机制的研究 被引量:1
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作者 黄晓梅 向旭 《电镀与环保》 CAS CSCD 北大核心 2019年第1期56-59,共4页
采用开路电位-时间曲线、阴极极化曲线、不同测试电位下的交流阻抗图谱等电化学测试手段,对化学复合镀Ni-P-SiO_2的机制进行了研究。结果表明:基体在化学复合镀Ni-P-SiO_2溶液中具有最佳的反应时间,不考虑温度时最佳的反应时间为4 000s... 采用开路电位-时间曲线、阴极极化曲线、不同测试电位下的交流阻抗图谱等电化学测试手段,对化学复合镀Ni-P-SiO_2的机制进行了研究。结果表明:基体在化学复合镀Ni-P-SiO_2溶液中具有最佳的反应时间,不考虑温度时最佳的反应时间为4 000s。向镀液中加入SiO_2微粒可以增加膜电阻,对Ni-P合金的沉积具有阻化作用。通过研究次磷酸钠的阳极氧化行为发现,交流阻抗曲线由高频的电感弧和低频的电容弧组成。加入Ni 2+可使电化学反应电阻明显降低,使得次磷酸钠的氧化反应更容易进行。 展开更多
关键词 开路电位-时间曲线)阴极极化曲线 极化度 交流阻抗图谱)阳极氧化行为
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Corrosion behavior of Cu-Al-Mn-Zn-Zr shape memory alloy in NaCl solution 被引量:3
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作者 Mo-yang YIN Zhou LI +3 位作者 Zhu XIAO Yong PANG Ya-ping LI Zi-yan SHEN 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第4期1012-1022,共11页
The corrosion behavior of a copper-based shape memory alloy(Cu-Al-Mn-Zn-Zr) in 3.5 wt.% Na Cl solution was investigated by means of potentiodynamic polarization measurements, electrochemical impedance spectroscopy(EIS... The corrosion behavior of a copper-based shape memory alloy(Cu-Al-Mn-Zn-Zr) in 3.5 wt.% Na Cl solution was investigated by means of potentiodynamic polarization measurements, electrochemical impedance spectroscopy(EIS) and X-ray photoelectron spectroscopy(XPS). At the beginning of corrosion, oxidation products formed on the surface of the shape memory alloy and constantly covered the reaction surface, resulting in the decrease of corrosion rate. After 4 d of immersion in NaCl solution, the corrosion product layer became thick and porous, leading to the increase of corrosion rate, and the corrosion reaction mechanism changed from polarization control to diffusion control. The diffusion impedance increased with increasing thickness of the oxide layer for the samples immersed in NaCl solution for 6-15 d. During the whole corrosion process, the reaction mechanism of the alloy changed and the corrosion resistance was improved continuously. The corrosion products mainly contained CuO, ZnO, Al2O3, MnO/Mn2O3, MnO2 and Al(OH)3. Transition of the corrosion products from Cu2O to CuO and Al2O3 to Al(OH)3 occurred during corrosion. 展开更多
关键词 Cu-based shape memory alloy corrosion behavior POLARIZATION diffusion impedance
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机电组件
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《电子科技文摘》 2000年第5期12-12,共1页
Y99-61677-205 0007330薄膜退耦电容器的建模与模拟=Modeling and simula-tion of thin film decoupling capacitors[会,英]/Chen,K.Y.& Brown,W.D.//Characterization of flip-chipCMOS ASIC simultaneous switching noise on mult... Y99-61677-205 0007330薄膜退耦电容器的建模与模拟=Modeling and simula-tion of thin film decoupling capacitors[会,英]/Chen,K.Y.& Brown,W.D.//Characterization of flip-chipCMOS ASIC simultaneous switching noise on multilayerorganic and ceramic BGA/CGA packages.—205~208(EG)对具有新型结构的薄膜退耦电容器的特性进行了模拟。对接触形状、电介质及金属层厚度对阻抗行为的影响进行了研究。模拟表明薄膜电容器具有优良的高频特性。 展开更多
关键词 陶瓷电容器 机电组件 建模与模拟 新型结构 薄膜电容器 高频特性 阻抗行为 电介质 退耦 层厚度
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