制备了氮掺杂改性的碳纳米管(CNx),并对其进行了扫描电子显微镜(Scanning Electron Microscopy,SEM)和X射线衍射仪(XRD,X-Ray Diffraction)表征。利用循环伏安法测定了铅离子在氮掺杂碳纳米管修饰电极上的电化学行为。结果表明,氮掺杂...制备了氮掺杂改性的碳纳米管(CNx),并对其进行了扫描电子显微镜(Scanning Electron Microscopy,SEM)和X射线衍射仪(XRD,X-Ray Diffraction)表征。利用循环伏安法测定了铅离子在氮掺杂碳纳米管修饰电极上的电化学行为。结果表明,氮掺杂碳纳米管修饰电极对铅离子有明显的电催化行为,而且它在铅离子检测中的效果明显优于裸的玻碳电极。在拟定条件下,氮掺杂碳纳米管修饰电极对铅离子的检测限为0.06μmol/L,线性范围为0.06～0.1μmol/L,并且具有良好的稳定性与重复性,因而该电极具有良好的应用前景。展开更多
Considering the dielectric confinement effect on excitonics of PbSe quantum dots （QDs）, a correction factor in the wave function was introduced to propose a new band gap calculation model for QDs. The modified model...Considering the dielectric confinement effect on excitonics of PbSe quantum dots （QDs）, a correction factor in the wave function was introduced to propose a new band gap calculation model for QDs. The modified model showed great consistency with the experimental data, especially in small size range. According to the variation of confined barrier, the band gap calculation model of PbSe QDs was analyzed in different solvents. The calculating results showed that the modified model was almost solvent-independent, which was consistent with our experimental results and related reports.展开更多
The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--...The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right comer of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796 × 10^4 cycles under the calculated conditions.展开更多
文摘制备了氮掺杂改性的碳纳米管(CNx),并对其进行了扫描电子显微镜(Scanning Electron Microscopy,SEM)和X射线衍射仪(XRD,X-Ray Diffraction)表征。利用循环伏安法测定了铅离子在氮掺杂碳纳米管修饰电极上的电化学行为。结果表明,氮掺杂碳纳米管修饰电极对铅离子有明显的电催化行为,而且它在铅离子检测中的效果明显优于裸的玻碳电极。在拟定条件下,氮掺杂碳纳米管修饰电极对铅离子的检测限为0.06μmol/L,线性范围为0.06～0.1μmol/L,并且具有良好的稳定性与重复性,因而该电极具有良好的应用前景。
文摘Considering the dielectric confinement effect on excitonics of PbSe quantum dots （QDs）, a correction factor in the wave function was introduced to propose a new band gap calculation model for QDs. The modified model showed great consistency with the experimental data, especially in small size range. According to the variation of confined barrier, the band gap calculation model of PbSe QDs was analyzed in different solvents. The calculating results showed that the modified model was almost solvent-independent, which was consistent with our experimental results and related reports.
基金Project(50376076) supported by the National Natural Science Foundation of China
文摘The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right comer of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796 × 10^4 cycles under the calculated conditions.
