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锂金属电池三维集流体设计研究进展
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作者 张琳曼 沈玉玺 +2 位作者 张裕 武朋磊 李悦明 《电源技术》 CAS 北大核心 2024年第8期1442-1451,共10页
锂金属因其高理论容量,在能量储存领域极具潜力。然而,锂金属电池中锂金属不均匀沉积产生的锂枝晶,可能导致电池短路并引发安全问题,限制了其目前的实际应用。三维集流体因具有高比表面积和大量亲锂位点,通过动力学原理控制锂金属沉积,... 锂金属因其高理论容量,在能量储存领域极具潜力。然而,锂金属电池中锂金属不均匀沉积产生的锂枝晶,可能导致电池短路并引发安全问题,限制了其目前的实际应用。三维集流体因具有高比表面积和大量亲锂位点,通过动力学原理控制锂金属沉积,从而降低局部电流密度,提高锂离子传输速度和金属成核速率。从锂金属电池中金属基、碳基、复合材料三维集流体及其改性等方面,综述了近年来锂金属电池三维集流体领域的最新研究进展,并对领域内需要解决的问题和未来发展方向进行了展望。 展开更多
关键词 锂金属电池 电极材料 集流体改性
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Silane coupling agent treated copper foil as a current collector for silicon anode 被引量:1
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作者 MENG Xiang-juan ZENG Xiao-min +8 位作者 JIANG Wei LI Si-yuan DU Qiao-kun JI Ze-kai ZHU Wei-wei LIU Chuang LIANG Cheng-du LING Min YAN Li-jing 《Journal of Central South University》 SCIE EI CAS CSCD 2022年第11期3620-3629,共10页
Since the volume variation of silicon particles during cycling,the binding spots between Cu current collector and silicon anode raised to be one of the critical binding problems.In this work,an amino-modified Cu curre... Since the volume variation of silicon particles during cycling,the binding spots between Cu current collector and silicon anode raised to be one of the critical binding problems.In this work,an amino-modified Cu current collector(Cu^(*))is fabricated to tackle this issue.The amino groups on Cu^(*)surface increase its hydrophilicity,which is conducive to the curing process of aqueous slurry on its surface.Meanwhile,these amino groups can form abundant amide bonds with carboxyl groups from the adopted polyacrylic acid(PAA)binder.The combined action composed of the covalent bond and mechanical interlocking could reduce the contact loss inside the electrode.However,high concentration silane coupling agent treatment will weaken the surface roughness of Cu^(*)and weaken mechanical interlocking.What is more,the insulation of silane coupling agent reduces the conductivity of Cu and increases the impedance of battery.Considering the effect of silane coupling agent comprehensively,electrochemical performance of Cu^(*)-0.05%is best. 展开更多
关键词 lithium ion batteries silicon anodes Cu foils surface modification
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