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新的快脉冲倍压放电技术
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作者 杨宣宗 俞雪华 《核聚变与等离子体物理》 CAS 1982年第2期126-129,共4页
一、前言 在收缩型高温等离子体实验装置上,往往采用高电压快脉冲放电技术来提高角向电场强度Eθ。此值直接影响等离子体动力学过程和其后的等离子体参数。在工程上已采用了各种倍压方式来提高Eθ值,比较常用的是一个放电线圈有多个剖口... 一、前言 在收缩型高温等离子体实验装置上,往往采用高电压快脉冲放电技术来提高角向电场强度Eθ。此值直接影响等离子体动力学过程和其后的等离子体参数。在工程上已采用了各种倍压方式来提高Eθ值,比较常用的是一个放电线圈有多个剖口,采用多馈点方式供电,还有的采用脉冲变压器升压方式来实现倍压,有的采用高压成形线来供电。但这些方法中有的工程结构上比较麻烦,有的电气绝缘要求较高。下面介绍一个比较简单但又能得到较高倍压效果的倍压方式,我们称它为2N倍压放电(N为一个放电线圈的剖口数目)。 展开更多
关键词 倍压 回路 工作 线圈 集电板 快脉冲
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基于热阻的功放管散热问题 被引量:3
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作者 伍刚 《兵工自动化》 2005年第6期97-98,共2页
功放管输出功率受集电极最大损耗所限,对功放管散热将提高功率输出。从热阻角度出发,功放管散热片的面积可按给定集电极耗散功率和环境温度求出,并采用等效热阻表示由散热片到环境热路上的热阻。即通过计算晶体管输出功率、集电极允许... 功放管输出功率受集电极最大损耗所限,对功放管散热将提高功率输出。从热阻角度出发,功放管散热片的面积可按给定集电极耗散功率和环境温度求出,并采用等效热阻表示由散热片到环境热路上的热阻。即通过计算晶体管输出功率、集电极允许功耗、总热阻、散热片热阻,求出散热片表面积、厚度及其表面尺寸。 展开更多
关键词 功放管 散热 热阻 集电板功率 输出功率 散热片
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中国专利报道
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作者 王元荪 《电源技术》 CAS CSCD 北大核心 2004年第1期66-66,共1页
关键词 集电板 CN 化学 隔膜 专利申请号 申请日 发明人 端子 接线端子 广东省深圳市罗湖区
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Fabrication of integrated resistors in printed circuit boards 被引量:1
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作者 王守国 陈清远 《Journal of Central South University》 SCIE EI CAS 2011年第3期739-743,共5页
In order to utilize integrated passive technology in printed circuit boards (PCBs), manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmeg... In order to utilize integrated passive technology in printed circuit boards (PCBs), manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation (RSD) show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future. 展开更多
关键词 integrated resistors lamination method printed circuit boards integrated passive technology
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Metals Recovery from Fine Printed Circuit Boards Using Falcon SB Concentrator 被引量:2
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作者 WEN Xue-feng ZHAO Yue-min +3 位作者 PAN Yan-jun HE Ya-qun SONG Shu-lei WANG Zhuo-ya 《Journal of China University of Mining and Technology》 EI 2005年第4期322-328,共7页
Physical methods show great potential and advantages on comprehensive reutilization of waste printed circuit boards (PCBs) because of lower investment and operation cost, higher efficiency and environment friendliness... Physical methods show great potential and advantages on comprehensive reutilization of waste printed circuit boards (PCBs) because of lower investment and operation cost, higher efficiency and environment friendliness. However, metals contained in fine fraction of PCBs cannot be recovered effectively by conventional equipments such as high tension electrostatic separator or shaking table. In the paper, this conundrum was resolved successfully with the enhanced Falcon SB concentrator. The separation mechanism of Falcon SB concentrator was analyzed and main factors affecting separation efficiency such as magnitude of rotation frequency of bowl, water counter pressure and slurry concentration of feed were studied and interaction of factors above also were investigated using Design-Expert software. Experiment results show that complete liberation degree and great difference of density between metals and nonmetals are suitable to recover metals from -74 μm PCBs using enhanced Falcon SB concentrator and 80.77 % integration efficiency can be achieved when slurry concentration of feed is 40 g/L with the water counter pressure of 0.01 MPa and rotation frequency of 50 Hz. 展开更多
关键词 Falcon concentrator centrifugal separation waste printed circuit boards integration efficiency
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Incidence of pocket hematoma after electrophysiological device placement:dual antiplatelet therapy versus low-molecular-weight heparin regimen 被引量:3
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作者 Yan CHEN Yun-Tao LI +8 位作者 Ming-Dong GAO Ze-Chun ZENG Jin-Rong ZHANG Hong-Liang CONG Yin LIU Ru ZHAO Le-Feng WANG Xin-Cun YANG Kang MENG 《Journal of Geriatric Cardiology》 SCIE CAS CSCD 2014年第3期200-205,共6页
Background Given the increasing number of patients who require dual antiplatelet (DAP) therapy and electrophysiological device (EPD) placement, perioperative antiplatelet management is a current challenge. In this... Background Given the increasing number of patients who require dual antiplatelet (DAP) therapy and electrophysiological device (EPD) placement, perioperative antiplatelet management is a current challenge. In this study, we investigated the incidence of pocket hema-toma formation after EPD placement in patients undergoing DAP therapy or an alternative low-molecular-weight heparin (LMWH) regimen. Methods This clinical observational study was performed from July 2010 to July 2012. In total, 171 patients were enrolled in the analysis after meeting the inclusion criteria. These patients were divided into two groups: 86 patients were treated with DAP therapy at the time of device implantation, and the DAP therapy was discontinued for 5 to 7 days and replaced with enoxaparin before device implantation in the other 85 patients. Adenosine phosphate (ADP)-mediated platelet aggregation and arachidonic acid-induced platelet aggregation were tested preoperatively. We compared the incidence of pocket hematoma between the two groups and the association of pocket hematoma develop-ment with ADP-mediated platelet aggregation and arachidonic acid-induced platelet aggregation.Results The incidence of pocket hema-toma in the patients who continued DAP was lower than that in the patients who replaced the dual antiplatelet regimen with LMWH (3.49%vs. 16.47%, respectively;X2 = 6.66,P 〈 0.01). Among the patients who continued DAP therapies, the rate of ADP-mediated platelet aggre-gation inhibition in patients with pocket hematomas was higher than that in patients without pocket hematomas. None of the patients under-going DAP or enoxaparin therapy developed pocket infection, thromboembolic events, or other serious complications. Multiple logistic re-gression analysis revealed that LMWH therapy was an independent risk factor for the development of pocket hematoma (RR = 0.054, 95%CI = 0.012-0.251). Furthermore, patients undergoing LMWH therapy were 5.1-fold more likely to develop pocket hematomas than were DAP-treated individuals.Conclusion Continuance of DAP therapy does not increase the risk of pocket hematoma formation after EPD placement. 展开更多
关键词 Antiplatelet drug Hematoma Low-molecular-weight heparin Electrophysiological device
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利用PN結产生频率調制
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《电信科学》 1958年第7期21-,共1页
在1957年十月号的“Electronic Engineering”上,介紹了一种利用PN結作可变电抗以产生頻率調制的方法。作者研制出一完全晶体管化的調制器,使-10兆赫載波产生頻調,調制信号变化0.15伏可获得100千赫的頻偏,並且頻調质量很佳,幅調極微。... 在1957年十月号的“Electronic Engineering”上,介紹了一种利用PN結作可变电抗以产生頻率調制的方法。作者研制出一完全晶体管化的調制器,使-10兆赫載波产生頻調,調制信号变化0.15伏可获得100千赫的頻偏,並且頻調质量很佳,幅調極微。这种頻调技术可用于100兆赫,若採用新型高頻晶体管,可能在几百兆赫产生頻調。 展开更多
关键词 PN 信号变化 反向 振频 集电板 司戈
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真空管放大器与半导体放大器的理论比较以及统一它们的可能性
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作者 A.A.库里科夫斯基 江明德 《电信科学》 1956年第4期34-38,共5页
本文比较了真空管放大器和半导体放大器线路的基本理论,从它们差别的原因找出统一化的可能性。系全苏无线电工学与电信科学技技术协会在纪念1955年的无线电日的科学常会上宣读过的报告的扩充提纲。
关键词 信号 信科学 回授 系数定义 接触型 压增益 阻扰 自激 特性方程 集电板
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晶体管物理講話—Ⅱ
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作者 W.箫克莱 朱鑑明 《电信科学》 1956年第5期36-43,共8页
(三)P-N结在讨论如何控制半导体原料的化学结构的方法前,我想先叙述一个特别的“组成结构”:这就是,一个各部分有不同的化学成份的半导体。P-N结就属于这类最简单的组成结构,它是硅和锗整流器的基础,并且也在许多种晶体管中起重要的作用... (三)P-N结在讨论如何控制半导体原料的化学结构的方法前,我想先叙述一个特别的“组成结构”:这就是,一个各部分有不同的化学成份的半导体。P-N结就属于这类最简单的组成结构,它是硅和锗整流器的基础,并且也在许多种晶体管中起重要的作用.我们可以设想锗的完整晶体相当于通常电子管中的真空。在这结构中,我们加入施主、受主以及一些复合中心,结果使得晶体分成两个区域,一是P-型,另一则是N-型。 展开更多
关键词 接触型 完整晶体 载流子密度 反向 集电板 反向偏压 化学成份 密度比 化学结构 多数载流子
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