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飞兆全新8引脚逻辑器件封装
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《世界产品与技术》 2003年第8期92-92,共1页
关键词 飞兆半导体公司 8引脚逻辑器件封装 面栅阵列 MicroPak8 无引脚封装
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BGA/CSP/WLP生产和分析技术简介 被引量:2
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作者 单宏坤 《中国集成电路》 2003年第46期96-98,共3页
前言随着手提式电器(移动电话、笔记本电脑、数码相机、数码摄像机、掌上电脑等)的迅猛发展,对 IC器件的小型化、轻量化和可靠性要求越来越高,同时对微电子封装技术的要求也越来越高。BGA、CSP、WLP
关键词 BGA CSP WLP 生产工艺 阵列封装形式 芯片级封装 集成电路 生产设备
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Quasi-Dammann grating with proportional intensity of array spots for surface hardening of metal 被引量:2
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作者 LI ShaoXia TAN QiaoFeng +2 位作者 YU Gang WANG HengHai JIN GuoFan 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS 2011年第1期79-83,共5页
For surface hardening of metal,a quasi-Dammann grating (QDG) is proposed and fabricated to generate array spots with proportional-intensity distribution.To get uniformly hardened band distribution and improve the wear... For surface hardening of metal,a quasi-Dammann grating (QDG) is proposed and fabricated to generate array spots with proportional-intensity distribution.To get uniformly hardened band distribution and improve the wear resistance of the sample surface,a three-order QDG is designed to produce array spots with enhanced intensity in the edge.The design and fabrication of the QDG are described in detail.The surface profile of the fabricated grating was measured,which shows that the fabrication error is less than 2%.The laser beam intensity distribution shaped by the QDG was tested by a laser beam analyzer to verify the validity of the QDG.The application of the QDG in the laser surface hardening of metal was experimentally investigated,and the results show that the hardness distribution of the modified layer and the wear resistance of the sample surface are improved significantly by using the QDG. 展开更多
关键词 quasi Dammann grating beam shaping laser surface hardening DIFFRACTION
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