Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected ...Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.展开更多
基金Key Scientific and Technological Research Projects of Henan Province(072102240027)Dr Foundation of Henan Polytechnic University(648602)Postgraduate Degree Thesis Innovation Foundation of Henan Polytechnic University(644005)
文摘Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.
