Two kinds of thin-film SOI high voltage MOSFETs are developed.One is general structure,the other is novel two-drift-region structure.The gate width is 760μm,and the active area is 8.58×10 -2 mm 2.The experim...Two kinds of thin-film SOI high voltage MOSFETs are developed.One is general structure,the other is novel two-drift-region structure.The gate width is 760μm,and the active area is 8.58×10 -2 mm 2.The experiments show that the breakdown voltages of the two-drift-region and general structures are 26V and 17V,respectively,and the on resistances are 65Ω and 80Ω,respectively.展开更多
文摘为使3300 V及以上电压等级绝缘栅双极型晶体管(IGBT)的工作结温达到150℃以上,设计了一种具有高结终端效率、结构简单且工艺可实现的线性变窄场限环(LNFLR)终端结构。采用TCAD软件对这种终端结构的击穿电压、电场分布和击穿电流等进行了仿真,调整环宽、环间距及线性变窄的公差值等结构参数以获得最优的电场分布,重点对比了高环掺杂浓度和低环掺杂浓度两种情况下LNFLR终端的阻断特性。仿真结果表明,低环掺杂浓度的LNFLR终端具有更高的击穿电压。进一步通过折中击穿电压和终端宽度,采用LNFLR终端的3300 V IGBT器件可以实现4500 V以上的终端耐压,而终端宽度只有700μm,相对于标准的场限环场板(FLRFP)终端缩小了50%。
文摘Two kinds of thin-film SOI high voltage MOSFETs are developed.One is general structure,the other is novel two-drift-region structure.The gate width is 760μm,and the active area is 8.58×10 -2 mm 2.The experiments show that the breakdown voltages of the two-drift-region and general structures are 26V and 17V,respectively,and the on resistances are 65Ω and 80Ω,respectively.