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高强度低Cr铁素体电焊锅炉管的开发
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作者 张朝生 《焊管》 2008年第1期93-94,共2页
关键词 电焊锅炉管 成分设计 蠕变特性 高温耐腐蚀性
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Corrosion properties of stainless steel 316L/Ni-Cu-P coatings in warm acidic solution
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作者 方信贤 周衡志 薛亚军 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第8期2594-2600,共7页
In order to improve corrosion resistance of stainless steel 316L in warm acidic solution, Ni?Cu?P coatings with high copper and phosphorus contents were deposited onto stainless steel 316L substrates via electroless... In order to improve corrosion resistance of stainless steel 316L in warm acidic solution, Ni?Cu?P coatings with high copper and phosphorus contents were deposited onto stainless steel 316L substrates via electroless plating. The structure of the film and its resistance to corrosion in a warm acidic environment were investigated using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction spectrometry (XRD), polarization curves, electrochemical impedance spectroscopy (EIS), and dipping corrosion tests, respectively. The results demonstrate that Ni?Cu?P coatings consist of two types of nodules, which are 19.98% Cu and 39.17% Cu (mass fraction) respectively. The corrosion resistance of the 316L substrate when subjected to a warm acidic solution is significantly improved by the addition of the new type of the Ni?Cu?P coating. The as-plated coatings demonstrate better corrosion resistance than annealed coatings. As-plated coatings and those annealed at 673 K are found to corrode selectively, while pitting is observed to be the main corrosion mechanism of coatings annealed at 773 and 873 K. 展开更多
关键词 Ni-Cu-P coating stainless steel 316L corrosion resistance corrosion mechanism warm acidic solution
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Corrosion evolution of high-temperature formed oxide film on pure Sn solder substrate 被引量:2
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作者 Hui ZHAO Xu SUN +2 位作者 Long HAO Jian-qiu WANG Jing-mei YANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第12期3998-4013,共16页
The evolution of morphology, composition, thickness and corrosion resistance of the oxide film on pure Sn solder substrate submitted to high-temperature aging in 150 °C dry atmosphere was investigated. The result... The evolution of morphology, composition, thickness and corrosion resistance of the oxide film on pure Sn solder substrate submitted to high-temperature aging in 150 °C dry atmosphere was investigated. The results indicate that high-temperature aging accelerates the dehydration of Sn(OH)_(4)in the pre-existing native oxide film to form SnO_(2)and facilitates the oxidation of fresh Sn substrate, resulting in the gradual increase in oxide film thickness and surface roughness with prolonging aging time. However, the corrosion resistance of the film initially is enhanced and then deteriorated with an extending aging time. Besides, the formation and evolution mechanisms of the oxide film with aging time were discussed. 展开更多
关键词 pure Sn solder oxide film high-temperature aging corrosion resistance
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