To study the diagnostic problem of Wire-OR （W-O） interconnect fault of PCB （Printed Circuit Board）, five modified boundary scan adaptive algorithms for interconnect test are put forward. These algorithms apply Glo...To study the diagnostic problem of Wire-OR （W-O） interconnect fault of PCB （Printed Circuit Board）, five modified boundary scan adaptive algorithms for interconnect test are put forward. These algorithms apply Global-diagnosis sequence algorithm to replace the equal weight algorithm of primary test, and the test time is shortened without changing the fault diagnostic capability. The descriptions of five modified adaptive test algorithms are presented, and the capability comparison between the modified algorithm and the original algorithm is made to prove the validity of these algorithms.展开更多
The fractal curve is proposed as a novel scanning path used in Layered Manufacturing. Aiming at a limitation that the fractal curve can only fill a square region, a method is developed to realize the trimming of frac...The fractal curve is proposed as a novel scanning path used in Layered Manufacturing. Aiming at a limitation that the fractal curve can only fill a square region, a method is developed to realize the trimming of fractal curve in arbitrary boundary layer by means of judging intersection points between parameterized arbitrary boundary and a FASS (space filling, self avoiding, simple and self similar) fractal curve. Accordingly, the related algorithm concerning with determining intersection points has been investigated according to the recursion feature of the fractal curve, and in the process of the fractal curve traversed, the rule of judging intersection points is ascertained as well, so that the laser scanning beam can “walk” along the fractal curve inside the desired boundary, and arbitrary contour components are fabricated.展开更多
The boundary scan architecture and its basic principle of board level built in test(BIT) technology are presented. A design for board level built in test and the method to implement test tool are brought forward.
Creep of squeeze-cast Mg-3Y-2Nd-1Zn-1Mn alloy was investigated at the constant load in the stress range of 30-80 MPa. Tensile creep tests were performed at 300℃up to the final fracture.Several tests at 50 MPa were in...Creep of squeeze-cast Mg-3Y-2Nd-1Zn-1Mn alloy was investigated at the constant load in the stress range of 30-80 MPa. Tensile creep tests were performed at 300℃up to the final fracture.Several tests at 50 MPa were interrupted after reaching the steady state creep;and another set of creep tests was interrupted after the onset of ternary creep.Fraction of cavitated dendritic boundaries was evaluated using optical microscopy.Measurement of grain boundary sliding by observation of the offset of marker lines was carried out on the surface of the crept specimens after the test interruption by scanning electron microscopy and by confocal laser scanning microscopy.The results show that the dominant creep mechanism in this alloy is dislocation creep with minor contribution of the grain boundary sliding.Creep failure took place by the nucleation,growth and coalescence of creep cavities on the boundaries predominantly oriented perpendicular to the applied stress.Increasing amount of cavitated boundaries with time of creep exposure supports the mechanism of continuous cavity nucleation and growth.展开更多
为了实时、准确地提取作物行基准线,提出了一种将边缘检测和扫描滤波(Boundary detection and scan-filter,BDSF)相结合的基准线提取方法。首先对RGB颜色空间采用G-R颜色特征因子进行图像灰度化,再采用最大类间方差法(OSTU)对灰度图像...为了实时、准确地提取作物行基准线,提出了一种将边缘检测和扫描滤波(Boundary detection and scan-filter,BDSF)相结合的基准线提取方法。首先对RGB颜色空间采用G-R颜色特征因子进行图像灰度化,再采用最大类间方差法(OSTU)对灰度图像进行分割,得到二值化图像,获取较好的作物信息。然后分别对图像的底端和顶端部分进行垂直投影,获取作物行的位置,形成一个包含作物行直线的条形框;在这个条形框内,再用等面积的小条形框对图像进行扫描并统计有效点的个数。最后根据扫描的结果来提取导航线。试验结果表明,对比Hough算法和最小二乘法(Least square method,LSM),BDSF算法处理一幅分辨率为640像素×480像素的图像,平均耗时为67 ms,与LSM算法耗时相当,精度接近Hough算法;并且在杂草和株数稀缺情况下具有良好的适应性,能够快速准确地提取作物行基准线。展开更多
文摘To study the diagnostic problem of Wire-OR （W-O） interconnect fault of PCB （Printed Circuit Board）, five modified boundary scan adaptive algorithms for interconnect test are put forward. These algorithms apply Global-diagnosis sequence algorithm to replace the equal weight algorithm of primary test, and the test time is shortened without changing the fault diagnostic capability. The descriptions of five modified adaptive test algorithms are presented, and the capability comparison between the modified algorithm and the original algorithm is made to prove the validity of these algorithms.
文摘The fractal curve is proposed as a novel scanning path used in Layered Manufacturing. Aiming at a limitation that the fractal curve can only fill a square region, a method is developed to realize the trimming of fractal curve in arbitrary boundary layer by means of judging intersection points between parameterized arbitrary boundary and a FASS (space filling, self avoiding, simple and self similar) fractal curve. Accordingly, the related algorithm concerning with determining intersection points has been investigated according to the recursion feature of the fractal curve, and in the process of the fractal curve traversed, the rule of judging intersection points is ascertained as well, so that the laser scanning beam can “walk” along the fractal curve inside the desired boundary, and arbitrary contour components are fabricated.
文摘The boundary scan architecture and its basic principle of board level built in test(BIT) technology are presented. A design for board level built in test and the method to implement test tool are brought forward.
基金Project(106/06/0252)supported by the Czech Science FoundationProject(CTU0810412)supported by the Grant Agency of the CzechTechnical University in Prague
文摘Creep of squeeze-cast Mg-3Y-2Nd-1Zn-1Mn alloy was investigated at the constant load in the stress range of 30-80 MPa. Tensile creep tests were performed at 300℃up to the final fracture.Several tests at 50 MPa were interrupted after reaching the steady state creep;and another set of creep tests was interrupted after the onset of ternary creep.Fraction of cavitated dendritic boundaries was evaluated using optical microscopy.Measurement of grain boundary sliding by observation of the offset of marker lines was carried out on the surface of the crept specimens after the test interruption by scanning electron microscopy and by confocal laser scanning microscopy.The results show that the dominant creep mechanism in this alloy is dislocation creep with minor contribution of the grain boundary sliding.Creep failure took place by the nucleation,growth and coalescence of creep cavities on the boundaries predominantly oriented perpendicular to the applied stress.Increasing amount of cavitated boundaries with time of creep exposure supports the mechanism of continuous cavity nucleation and growth.
