Ultra-high molecular weight polyethylene（UHMWPE） fiber/epoxy composites were fabricated by a vacuum assisted resin infused（VARI） processing technology. The curing condition of composites was at a cure temperature ...Ultra-high molecular weight polyethylene（UHMWPE） fiber/epoxy composites were fabricated by a vacuum assisted resin infused（VARI） processing technology. The curing condition of composites was at a cure temperature of 80 ℃ for 3h in a drying oven. The characteristics of 2.5D（shallow bend-joint and deep straight-joint） structure and 3D orthogonal structure were compared. The failure behavior, flexural strength, and microstructures of both composites were investigated. It was found that the flexural property was closely related to undulation angle θ. The flexural strength of 3D orthogonal structure composite was superior to the other two structures composites with the same weave parameters and resin.展开更多
The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-...The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.展开更多
In this paper, we present a three-dimensional（3D） vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system（RF MEMS） resonator, in which low-loss silicon vias is used to tran...In this paper, we present a three-dimensional（3D） vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system（RF MEMS） resonator, in which low-loss silicon vias is used to transmit RF signals.Au–Sn solder bonding is adopted to provide a vacuum encapsulation as well as electrical conductions. A RF model of the encapsulation cap is established to evaluate the parasitic effect of the packaging, which provides an effective design solution of 3D RF MEMS encapsulation. With the proposed packaging structure, the signal-to-background ratio（SBR） of 24 dB is achieved, as well as the quality factor（Q-factor） of the resonator increases from 8000 to 10400 after packaging.The packaged resonator has a linear frequency–temperature（ f –T） characteristic in a temperature range between 0℃ and 100℃. And the package shows favorable long-term stability of the Q-factor over 200 days, which indicates that the package has excellent hermeticity. Furthermore, the average shear strength is measured to be 43.58 MPa among 10 samples.展开更多
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
This paper presents,for the first time,the consideration of three-dimensional(3D)oblique incident P and SV waves in calculating the 3D seismic response of a lined tunnel embedded in a half-space by the 2.5D finite/inf...This paper presents,for the first time,the consideration of three-dimensional(3D)oblique incident P and SV waves in calculating the 3D seismic response of a lined tunnel embedded in a half-space by the 2.5D finite/infinite element method(FIEM).Firstly,the applicability of the 2.5D FIEM for 3D seismic analysis is summarized.With the exact solutions obtained for the free field in the Appendix,the equivalent seismic forces are rationally computed for the near-field boundary,considering the horizontal and vertical excitations of the Chi-Chi Earthquake.By performing seismic analysis of the half space embedded with a tunnel using the 2.5D FIEM,the time-domain responses of the tunnel are obtained.The accuracy of the present solutions is verified against those of de Barros and Luco.Conclusions drawn from the parametric study include:(1)Stress concentration for the principal stress under oblique incident seismic waves occurs at the polar angles of 0(vault),90,180(inverted arch),and 270of the lining wall.(2)The vault and inverted arch are the weakest parts of the tunnel during earthquakes.(3)The accelerations of the tunnel during earthquakes can be regarded as of the rigid body type.(4)The responses of the tunnel lining caused by SV waves of an earthquake are much more critical than those by P waves.(5)For arbitrary seismic waves,the maximum longitudinal acceleration azmax is of the same order of magnitude as the maximum horizontal acceleration axmax.展开更多
Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigat...Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigations of the impact of urban three-dimensional(3D)morphology on PM2.5 concentration have important scientific significance.In this paper,39 PM2.5 monitoring sites of Beijing in China were selected with PM2.5 automatic monitoring data that were collected in 2013.This data set was used to analyze the impacts of the meteorological condition and public transportation on PM2.5 concentrations.Based on the elimination of the meteorological conditions and public transportation factors,the relationships between urban 3D morphology and PM2.5 concentrations are highlighted.Ten urban 3D morphology indices were established to explore the spatial-temporal correlations between the indices and PM2.5 concentrations and analyze the impact of urban 3D morphology on the PM2.5 concentrations.Results demonstrated that road length density(RLD),road area density(RAD),construction area density(CAD),construction height density(CHD),construction volume density(CVD),construction otherness(CO),and vegetation area density(VAD)have positive impacts on the PM2.5 concentrations,whereas water area density(WAD),water fragmentation(WF),and vegetation fragmentation(VF)(except for the 500 m buffer)have negative impacts on the PM2.5 concentrations.Moreover,the correlations between the morphology indices and PM2.5 concentrations varied with the buffer scale.The findings could lay a foundation for the high-precision spatial-temporal modelling of PM2.5 concentrations and the scientific planning of urban 3D spaces by authorities responsible for controlling PM2.5 concentrations.展开更多
基金Funded by the National Natural Science Foundation of China(No.51001117)
文摘Ultra-high molecular weight polyethylene（UHMWPE） fiber/epoxy composites were fabricated by a vacuum assisted resin infused（VARI） processing technology. The curing condition of composites was at a cure temperature of 80 ℃ for 3h in a drying oven. The characteristics of 2.5D（shallow bend-joint and deep straight-joint） structure and 3D orthogonal structure were compared. The failure behavior, flexural strength, and microstructures of both composites were investigated. It was found that the flexural property was closely related to undulation angle θ. The flexural strength of 3D orthogonal structure composite was superior to the other two structures composites with the same weave parameters and resin.
文摘The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.
基金supported by the National Natural Science Foundation of China(Grant Nos.61234007,61404136,and 61504130)the Fund from the Ministry of Science and Technology of China(Grant No.2013YQ16055103)+1 种基金the Key Research&Development Program of Jiangsu Province,China(Grant No.BE2016007-2)the Major Project of Natural Science Research of the Higher Education Institutions of Jiangsu Province,China(Grant No.16KJA510006)
文摘In this paper, we present a three-dimensional（3D） vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system（RF MEMS） resonator, in which low-loss silicon vias is used to transmit RF signals.Au–Sn solder bonding is adopted to provide a vacuum encapsulation as well as electrical conductions. A RF model of the encapsulation cap is established to evaluate the parasitic effect of the packaging, which provides an effective design solution of 3D RF MEMS encapsulation. With the proposed packaging structure, the signal-to-background ratio（SBR） of 24 dB is achieved, as well as the quality factor（Q-factor） of the resonator increases from 8000 to 10400 after packaging.The packaged resonator has a linear frequency–temperature（ f –T） characteristic in a temperature range between 0℃ and 100℃. And the package shows favorable long-term stability of the Q-factor over 200 days, which indicates that the package has excellent hermeticity. Furthermore, the average shear strength is measured to be 43.58 MPa among 10 samples.
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
文摘This paper presents,for the first time,the consideration of three-dimensional(3D)oblique incident P and SV waves in calculating the 3D seismic response of a lined tunnel embedded in a half-space by the 2.5D finite/infinite element method(FIEM).Firstly,the applicability of the 2.5D FIEM for 3D seismic analysis is summarized.With the exact solutions obtained for the free field in the Appendix,the equivalent seismic forces are rationally computed for the near-field boundary,considering the horizontal and vertical excitations of the Chi-Chi Earthquake.By performing seismic analysis of the half space embedded with a tunnel using the 2.5D FIEM,the time-domain responses of the tunnel are obtained.The accuracy of the present solutions is verified against those of de Barros and Luco.Conclusions drawn from the parametric study include:(1)Stress concentration for the principal stress under oblique incident seismic waves occurs at the polar angles of 0(vault),90,180(inverted arch),and 270of the lining wall.(2)The vault and inverted arch are the weakest parts of the tunnel during earthquakes.(3)The accelerations of the tunnel during earthquakes can be regarded as of the rigid body type.(4)The responses of the tunnel lining caused by SV waves of an earthquake are much more critical than those by P waves.(5)For arbitrary seismic waves,the maximum longitudinal acceleration azmax is of the same order of magnitude as the maximum horizontal acceleration axmax.
基金Under the auspices of National Key Research and Development Program of China(No.2016YFB0502504)Beijing Excellent Youth Talent Program(No.2015400018760G294)National Natural Science Foundation of China(No.41201443,41001267).
文摘Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigations of the impact of urban three-dimensional(3D)morphology on PM2.5 concentration have important scientific significance.In this paper,39 PM2.5 monitoring sites of Beijing in China were selected with PM2.5 automatic monitoring data that were collected in 2013.This data set was used to analyze the impacts of the meteorological condition and public transportation on PM2.5 concentrations.Based on the elimination of the meteorological conditions and public transportation factors,the relationships between urban 3D morphology and PM2.5 concentrations are highlighted.Ten urban 3D morphology indices were established to explore the spatial-temporal correlations between the indices and PM2.5 concentrations and analyze the impact of urban 3D morphology on the PM2.5 concentrations.Results demonstrated that road length density(RLD),road area density(RAD),construction area density(CAD),construction height density(CHD),construction volume density(CVD),construction otherness(CO),and vegetation area density(VAD)have positive impacts on the PM2.5 concentrations,whereas water area density(WAD),water fragmentation(WF),and vegetation fragmentation(VF)(except for the 500 m buffer)have negative impacts on the PM2.5 concentrations.Moreover,the correlations between the morphology indices and PM2.5 concentrations varied with the buffer scale.The findings could lay a foundation for the high-precision spatial-temporal modelling of PM2.5 concentrations and the scientific planning of urban 3D spaces by authorities responsible for controlling PM2.5 concentrations.
