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Numerical simulation and dimension reduction analysis of electromagnetic logging while drilling of horizontal wells in complex structures 被引量:7
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作者 Zhen-Guan Wu Shao-Gui Deng +5 位作者 Xu-Quan He Runren Zhang Yi-Ren Fan Xi-Yong Yuan Yi-Zhi Wu Qing Huo Liu 《Petroleum Science》 SCIE CAS CSCD 2020年第3期645-657,共13页
Electromagnetic logging while drilling(LWD)is one of the key technologies of the geosteering and formation evaluation for high-angle and horizontal wells.In this paper,we solve the dipole source-generated magnetic/ele... Electromagnetic logging while drilling(LWD)is one of the key technologies of the geosteering and formation evaluation for high-angle and horizontal wells.In this paper,we solve the dipole source-generated magnetic/electric fields in 2D formations efficiently by the 2.5D finite diff erence method.Particularly,by leveraging the field’s rapid attenuation in spectral domain,we propose truncated Gauss–Hermite quadrature,which is several tens of times faster than traditional inverse fast Fourier transform.By applying the algorithm to the LWD modeling under complex formations,e.g.,folds,fault and sandstone pinch-outs,we analyze the feasibility of the dimension reduction from 2D to 1D.For the formations with smooth lateral changes,like folds,the simplified 1D model’s results agree well with the true responses,which indicate that the 1D simplification with sliding window is feasible.However,for the formation structures with drastic rock properties changes and sharp boundaries,for instance,faults and sandstone pinch-outs,the simplified 1D model will lead to large errors and,therefore,2.5D algorithms should be applied to ensure the accuracy. 展开更多
关键词 Complex formation structures Horizontal wells Electromagnetic logging while drilling 2.5d algorithm-Model simplification
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34 GHz Bandpass Filter for Low-temperature Co-fired Ceramic System-in-Package Application
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作者 XU Ziqiang SHI Yu +2 位作者 ZENG Zhiyi LIAO Jiaxuan LI Tian 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2011年第2期309-315,共7页
Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabricati... Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter(mm)-wave communication system,attracting significant interest in three-dimension(3D) miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic(LTCC) technology,which is fully integrated in a system-in package(SIP) communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic(EM) interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material's dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application. 展开更多
关键词 three-dimensional(3D) structure bandpass filter low-temperature co-fired ceramic(LTCC) system in package(SIP)
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Amkor的2.5D和HDFO封装-先进异构芯片封装解决方案
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作者 李吕祝 Mike Kelly 《中国集成电路》 2018年第12期71-75,79,共6页
科技的大浪潮,正向人工智能、深度学习、云端计算、超级电脑等领域快速发展,而这些前沿技术都有一个共同特点,那就是超高性能的高速芯片(IC)。除了主芯片自身往更先进的工艺节点推进外,还可能与更高带宽的内存(High Bandwidth Memory,HB... 科技的大浪潮,正向人工智能、深度学习、云端计算、超级电脑等领域快速发展,而这些前沿技术都有一个共同特点,那就是超高性能的高速芯片(IC)。除了主芯片自身往更先进的工艺节点推进外,还可能与更高带宽的内存(High Bandwidth Memory,HBM),或更高传输速度的串行解串器(Serdes),或其它特定功能的芯片,整合成异构芯片封装(Heterogeneous Package),将整体效能推向极致。为了实现这样的功能,异构芯片集成的封装技术将扮演至关重要的角色。本文介绍由Amkor开发的封装技术平台,包括2.5D硅通孔(TSV)介质层(Interposer)、基板上芯片(CoS)、晶圆上芯片(CoW)、高密度扇出型封装(HDFO),以及电子设计自动化(EDA)设计流程和测试解决方案。为了达到大规模生产此类先进封装的能力,文章还将介绍最先进的高洁净度高自动化封装工厂K5,以高技术和高质量帮助客户实现其高速性能的目标。 展开更多
关键词 2.5d TSV Interposer COS COW HDFO HETEROGENEOUS package Amkor
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2.5维预制体结构参数的设计方法 被引量:3
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作者 杨彩云 《纺织学报》 EI CAS CSCD 北大核心 2009年第6期54-57,共4页
由于缺少三维织物的设计理论,使2.5维预制体结构参数的确定成为三维纺织复合材料预制体设计人员面临的难题。为此,给出了相似2.5维预制体的定义,按纤维体积含量保持不变推导出相似2.5维预制体结构参数的关系式,以便根据原织物的结构参... 由于缺少三维织物的设计理论,使2.5维预制体结构参数的确定成为三维纺织复合材料预制体设计人员面临的难题。为此,给出了相似2.5维预制体的定义,按纤维体积含量保持不变推导出相似2.5维预制体结构参数的关系式,以便根据原织物的结构参数计算出新织物的结构参数,特别是可以准确预测新织物的厚度。同时用3个实例验证了该关系式。研究结果表明,所得到的相似2.5维预制体结构参数关系式具有实用价值。 展开更多
关键词 2.5维预制体 相似2.5维预制体 结构参数 设计方法
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