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钻孔瞬变电磁法扫描探测RCQPSO-LMO组合算法2.5D反演 被引量:3
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作者 程久龙 焦俊俊 +1 位作者 陈志 董毅 《地球物理学报》 SCIE EI CAS CSCD 北大核心 2024年第2期781-792,共12页
利用钻孔进行超前探测地质构造及含水体是地下开挖工程中的常规手段,如何利用这些钻孔进行钻孔瞬变电磁法扫描探测,从而实现钻孔孔壁外围地质异常体的精细探测,对实现地下工程地质透明化具有重要的指导意义.本文提出钻孔瞬变电磁法扫描... 利用钻孔进行超前探测地质构造及含水体是地下开挖工程中的常规手段,如何利用这些钻孔进行钻孔瞬变电磁法扫描探测,从而实现钻孔孔壁外围地质异常体的精细探测,对实现地下工程地质透明化具有重要的指导意义.本文提出钻孔瞬变电磁法扫描探测2.5D反演的数据解译方法,首先针对随机性反演算法时效性低,易陷入局部最优解,而确定性反演算法依赖初始模型的问题,提出了组合策略的量子粒子群优化算法用来随机搜索最优初始模型.在此基础上,利用Levenberg-Marquarat方法求解Occam反演的目标函数,形成了RCQPSO-LMO组合算法进行2.5D反演,通过对比组合算法和单一算法,验证了组合算法具有更精确的反演结果.其次结合屏蔽条件下扫描探测,对比分析了有无屏蔽的2.5D反演结果,通过设定屏蔽系数对非探测方向信号进行部分压制,可以较好地解决钻孔径向扫描探测中对非探测方向信号部分屏蔽下的反演及成像.最后建立三组理论模型进行组合算法2.5D反演,结果表明:组合算法反演结果与理论模型的一致性较好,对低阻异常体的反演精度较高,验证了组合算法对钻孔孔壁外围低阻异常体具有较高的反演精度和分辨能力. 展开更多
关键词 钻孔瞬变电磁法 扫描探测 量子粒子群优化算法 组合算法 2.5d反演
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铁路路基动力响应的2.5D有限元方法研究现状及展望
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作者 王瑞 胡志平 《岩土力学》 EI CAS CSCD 北大核心 2024年第1期284-301,共18页
作为一种频域计算方法,2.5D有限元具备计算效率高、内存占用小等优势,同时也存在诸多局限。经过20余年的发展,2.5D有限元方法已经具备了描述复杂土体本构关系和复杂路基几何特征条件下铁路路基动力响应的能力。荷载输入方法、建模策略... 作为一种频域计算方法,2.5D有限元具备计算效率高、内存占用小等优势,同时也存在诸多局限。经过20余年的发展,2.5D有限元方法已经具备了描述复杂土体本构关系和复杂路基几何特征条件下铁路路基动力响应的能力。荷载输入方法、建模策略和波动吸收边界的持续优化使得2.5D有限元方法的精度不断提高,二维插值方法则为进一步提升计算效率提供了思路。目前,2.5D有限元已经成为铁路路基动力响应研究中的常用方法。为了理清铁路路基动力响应2.5D有限元方法的发展脉络,分别从荷载输入、路基系统、响应输出和计算精度及效率的提升方面总结了其发展现状,介绍了2.5D有限元在发展过程中遇到的瓶颈问题及解决对策。在此基础上,针对算法的精度和效率、研究的对象和内容进行了进一步的讨论和展望。 展开更多
关键词 2.5d有限元方法 铁路路基 动力响应 建模 吸收边界 二维插值
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2.5D机织复合材料双剪连接力学行为与损伤机制
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作者 钱坤 江昊 张典堂 《天津工业大学学报》 CAS 北大核心 2024年第3期9-15,22,共8页
为研究装配参数对2.5D机织复合材料连接性能的影响,制备了具有不同宽径比w/D与边径比e/D的2.5D机织复合材料试样,通过双搭接拉伸实验,分析了在连接载荷下材料的力学行为与失效模式,并借助微计算机断层扫描技术(Micro-CT)观察试样内部损... 为研究装配参数对2.5D机织复合材料连接性能的影响,制备了具有不同宽径比w/D与边径比e/D的2.5D机织复合材料试样,通过双搭接拉伸实验,分析了在连接载荷下材料的力学行为与失效模式,并借助微计算机断层扫描技术(Micro-CT)观察试样内部损伤情况,阐明其损伤机制。结果表明:试样在w/D和e/D分别取6和3时,表现出较高的力学性能,但适当减少w/D或e/D依旧能保有相当强度,当w/D下降为4时,刚度减少3.18%,极限挤压强度减少2.77%;当e/D下降为2.5时,刚度与强度分别减少1.62%和7.19%;螺栓孔的位置参数对材料的失效模式影响显著,减小w/D使经纱承受更多载荷,失效模式向净张力失效演变;减小e/D使纬纱承受更多载荷,失效模式向撕裂失效演变。 展开更多
关键词 2.5d机织复合材料 螺栓连接 微计算机断层扫描技术(Micro-CT) 复合材料失效 损伤机制
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国产三代2.5D SiC_(f)/SiC复合材料的界面力学性能
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作者 管皞阳 张立 +5 位作者 荆开开 师维刚 王晶 李玫 刘永胜 张程煜 《无机材料学报》 SCIE EI CAS CSCD 北大核心 2024年第3期259-266,I0001,共9页
连续碳化硅纤维增强碳化硅复合材料(SiC_(f)/SiC)是下一代航空发动机的关键结构材料,其界面性能是决定材料力学性能的重要因素之一。为此,本研究表征了国产三代2.5D SiC_(f)/SiC的界面性能,并探究其与材料拉伸性能的关系。利用拉伸加/... 连续碳化硅纤维增强碳化硅复合材料(SiC_(f)/SiC)是下一代航空发动机的关键结构材料,其界面性能是决定材料力学性能的重要因素之一。为此,本研究表征了国产三代2.5D SiC_(f)/SiC的界面性能,并探究其与材料拉伸性能的关系。利用拉伸加/卸载过程中的迟滞特性定量分析了2.5D SiC_(f)/SiC中各组元残余应力和界面滑动应力(IFSS),根据断口拔出纤维的断裂镜面半径得到了纤维就位强度(σ_(fu))的统计分布,通过纤维推入法得到界面剪切强度(ISS)和界面脱黏能(G_(i))。结果表明:利用宏观结合细观的方法能够较全面地描述SiC_(f)/SiC从初始裂纹萌生到最终脱黏不同阶段的界面力学性能,2.5D SiC_(f)/SiC的IFSS、ISS和Gi分别为56 MPa、(28±5)MPa和(2.7±0.6)J/m2。ISS和Gi较低,表明界面结合较弱,在剪应力作用下易产生裂纹,而IFSS较大,表明界面脱黏后纤维与基体间相对滑动较为困难,阻碍了纤维拔出,不利于发挥纤维的增强作用。根据获得的界面性能和经典ACK模型,较好地预测出比例极限应力,并结合σ_(fu)预测了2.5D SiC_(f)/SiC的拉伸强度。拉伸强度预测值高于实验值,这与界面处径向残余压应力以及纤维承受的残余拉应力有关。 展开更多
关键词 2.5d SiC_(f)/SiC 拉伸加/卸载 纤维推入 界面剪切强度 界面脱黏能 界面滑动应力
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2.5D C/SiC复合材料超声振动辅助铣削数值模拟研究
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作者 杨定成 张小冰 《宇航材料工艺》 CAS CSCD 北大核心 2024年第3期30-37,共8页
为了揭示2.5D C/SiC陶瓷基复合材料在铣削加工过程中的去除机理及表面损伤特性,开展了其传统铣削和超声振动辅助铣削实验,建立了两类铣削工况下的三维数值模型。结果表明,相对于传统铣削,超声振动辅助铣削在其高频的交变载荷下,降低材... 为了揭示2.5D C/SiC陶瓷基复合材料在铣削加工过程中的去除机理及表面损伤特性,开展了其传统铣削和超声振动辅助铣削实验,建立了两类铣削工况下的三维数值模型。结果表明,相对于传统铣削,超声振动辅助铣削在其高频的交变载荷下,降低材料的微切削厚度,减小材料的变形挠度从而使径向和切向的切削力分别都降低了68%、72%;可有效改善2.5D C/SiC复合材料加工表面损伤,如倾斜断裂面、粗糙断裂面;其加工表面残余压应力明显大于传统铣削;经过实验验证,所建立的数值模型可以有效地模拟材料去除过程和0°、90°纤维的断裂形貌;为2.5D C/SiC复合材料的高效低损伤加工提供了理论依据和指导。 展开更多
关键词 2.5d C/SiC 数值模拟 超声振动辅助铣削 材料去除特性
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Polar-coordinate line-projection light-curing continuous 3D printing for tubular structures
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作者 Huiyuan Wang Siqin Liu +12 位作者 Xincheng Yin Mingming Huang Yanzhe Fu Xun Chen Chao Wang Jingyong Sun Xin Yan Jianmin Han Jiping Yang Zhijian Wang Lizhen Wang Yubo Fan Jiebo Li 《International Journal of Extreme Manufacturing》 SCIE EI CAS CSCD 2024年第4期247-260,共14页
3D printing techniques offer an effective method in fabricating complex radially multi-material structures.However,it is challenging for complex and delicate radially multi-material model geometries without supporting... 3D printing techniques offer an effective method in fabricating complex radially multi-material structures.However,it is challenging for complex and delicate radially multi-material model geometries without supporting structures,such as tissue vessels and tubular graft,among others.In this work,we tackle these challenges by developing a polar digital light processing technique which uses a rod as the printing platform.The 3D model fabrication is accomplished through line projection.The rotation and translation of the rod are synchronized to project and illuminate the photosensitive material volume.By controlling the distance between the rod and the printing window,we achieved the printing of tubular structures with a minimum wall thickness as thin as 50 micrometers.By controlling the width of fine slits at the printing window,we achieved the printing of structures with a minimum feature size of 10 micrometers.Our process accomplished the fabrication of thin-walled tubular graft structure with a thickness of only 100 micrometers and lengths of several centimeters within a timeframe of just 100 s.Additionally,it enables the printing of axial multi-material structures,thereby achieving adjustable mechanical strength.This method is conducive to rapid customization of tubular grafts and the manufacturing of tubular components in fields such as dentistry,aerospace,and more. 展开更多
关键词 3D printing polar coordinate line projection LIGHT-CURING tubular structure radially multi-material structures
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Biomimetic 3D printing of composite structures with decreased cracking
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作者 Fan Du Kai Li +7 位作者 Mingzhen Li Junyang Fang Long Sun Chao Wang Yexin Wang Maiqi Liu Jinbang Li Xiaoying Wang 《Nanotechnology and Precision Engineering》 EI CAS CSCD 2024年第3期24-34,共11页
The development of tissue engineering and regeneration research has created new platforms for bone transplantation.However,the preparation of scaffolds with good fiber integrity is challenging,because scaffolds prepar... The development of tissue engineering and regeneration research has created new platforms for bone transplantation.However,the preparation of scaffolds with good fiber integrity is challenging,because scaffolds prepared by traditional printing methods are prone to fiber cracking during solvent evaporation.Human skin has an excellent natural heat-management system,which helps to maintain a constant body temperature through perspiration or blood-vessel constriction.In this work,an electrohydrodynamic-jet 3D-printing method inspired by the thermal-management system of skin was developed.In this system,the evaporation of solvent in the printed fibers can be adjusted using the temperature-change rate of the substrate to prepare 3D structures with good structural integrity.To investigate the solvent evaporation and the interlayer bonding of the fibers,finite-element analysis simulations of a three-layer microscale structure were carried out.The results show that the solvent-evaporation path is from bottom to top,and the strain in the printed structure becomes smaller with a smaller temperaturechange rate.Experimental results verified the accuracy of these simulation results,and a variety of complex 3D structures with high aspect ratios were printed.Microscale cracks were reduced to the nanoscale by adjusting the temperature-change rate from 2.5 to 0.5℃s-1.Optimized process parameters were selected to prepare a tissue engineering scaffold with high integrity.It was confirmed that this printed scaffold had good biocompatibility and could be used for bone-tissue regeneration.This simple and flexible 3D-printing method can also help with the preparation of a wide range of micro-and nanostructured sensors and actuators. 展开更多
关键词 3D printing Electrohydrodynamic jet BIOMIMETIC Structural integrity Composite scaffold
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Interpenetrated Structures for Enhancing Ion Diffusion Kinetics in Electrochemical Energy Storage Devices
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作者 Xinzhe Xue Longsheng Feng +9 位作者 Qiu Ren Cassidy Tran Samuel Eisenberg Anica Pinongcos Logan Valdovinos Cathleen Hsieh Tae Wook Heo Marcus A.Worsley Cheng Zhu Yat Li 《Nano-Micro Letters》 SCIE EI CAS CSCD 2024年第11期718-728,共11页
The architectural design of electrodes offers new opportunities for next-generation electrochemical energy storage devices(EESDs)by increasing surface area,thickness,and active materials mass loading while maintaining... The architectural design of electrodes offers new opportunities for next-generation electrochemical energy storage devices(EESDs)by increasing surface area,thickness,and active materials mass loading while maintaining good ion diffusion through optimized electrode tortuosity.However,conventional thick electrodes increase ion diffusion length and cause larger ion concentration gradients,limiting reaction kinetics.We demonstrate a strategy for building interpenetrated structures that shortens ion diffusion length and reduces ion concentration inhomogeneity.This free-standing device structure also avoids short-circuiting without needing a separator.The feature size and number of interpenetrated units can be adjusted during printing to balance surface area and ion diffusion.Starting with a 3D-printed interpenetrated polymer substrate,we metallize it to make it conductive.This substrate has two individually addressable electrodes,allowing selective electrodeposition of energy storage materials.Using a Zn//MnO_(2) battery as a model system,the interpenetrated device outperforms conventional separate electrode configurations,improving volumetric energy density by 221%and exhibiting a higher capacity retention rate of 49%compared to 35%at temperatures from 20 to 0℃.Our study introduces a new EESD architecture applicable to Li-ion,Na-ion batteries,supercapacitors,etc. 展开更多
关键词 Interpenetrated structure 3D printing Electrochemical energy storage Ion diffusion length Inter-electrode distance
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3D Road Network Modeling and Road Structure Recognition in Internet of Vehicles
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作者 Dun Cao Jia Ru +3 位作者 Jian Qin Amr Tolba Jin Wang Min Zhu 《Computer Modeling in Engineering & Sciences》 SCIE EI 2024年第2期1365-1384,共20页
Internet of Vehicles (IoV) is a new system that enables individual vehicles to connect with nearby vehicles,people, transportation infrastructure, and networks, thereby realizing amore intelligent and efficient transp... Internet of Vehicles (IoV) is a new system that enables individual vehicles to connect with nearby vehicles,people, transportation infrastructure, and networks, thereby realizing amore intelligent and efficient transportationsystem. The movement of vehicles and the three-dimensional (3D) nature of the road network cause the topologicalstructure of IoV to have the high space and time complexity.Network modeling and structure recognition for 3Droads can benefit the description of topological changes for IoV. This paper proposes a 3Dgeneral roadmodel basedon discrete points of roads obtained from GIS. First, the constraints imposed by 3D roads on moving vehicles areanalyzed. Then the effects of road curvature radius (Ra), longitudinal slope (Slo), and length (Len) on speed andacceleration are studied. Finally, a general 3D road network model based on road section features is established.This paper also presents intersection and road section recognition methods based on the structural features ofthe 3D road network model and the road features. Real GIS data from a specific region of Beijing is adopted tocreate the simulation scenario, and the simulation results validate the general 3D road network model and therecognitionmethod. Therefore, thiswork makes contributions to the field of intelligent transportation by providinga comprehensive approach tomodeling the 3Droad network and its topological changes in achieving efficient trafficflowand improved road safety. 展开更多
关键词 Internet of vehicles road networks 3D road model structure recognition GIS
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A three-dimensional co-continuous network structure polymer electrolyte with efficient ion transport channels enabling ultralong-life all solid-state lithium metal batteries
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作者 Meng Wang Hu Zhang +2 位作者 Yewen Li Ruiping Liu Huai Yang 《Journal of Energy Chemistry》 SCIE EI CAS CSCD 2024年第7期635-645,共11页
Solid polymer electrolytes(SPEs)have emerged as one of the most promising candidates for the construction of solid-state lithium batteries due to their excellent flexibility,scalability,and interface compatibility wit... Solid polymer electrolytes(SPEs)have emerged as one of the most promising candidates for the construction of solid-state lithium batteries due to their excellent flexibility,scalability,and interface compatibility with electrodes.Herein,a novel all-solid polymer electrolyte(PPLCE)was fabricated by the copolymer network of liquid crystalline monomers and poly(ethylene glycol)dimethacrylate(PEGDMA)acts as a structural frame,combined with poly(ethylene glycol)diglycidyl ether short chain interspersed serving as mobile ion transport entities.The preparaed PPLCEs exhibit excellent mechanical property and out-standing electrochemical performances,which is attributed to their unique three-dimensional cocontinuous structure,characterized by a cross-linked semi-interpenetrating network and an ionic liquid phase,resulting in a distinctive nanostructure with short-range order and long-range disorder.Remarkably,the addition of PEGDMA is proved to be critical to the comprehensive performance of the PPLCEs,which effectively modulates the microscopic morphology of polymer networks and improves the mechanical properties as well as cycling stability of the solid electrolyte.When used in a lithiumion symmetrical battery configuration,the 6 wt%-PPLCE exhibites super stability,sustaining operation for over 2000 h at 30 C,with minimal and consistent overpotential of 50 mV.The resulting Li|PPLCE|LFP solid-state battery demonstrates high discharge specific capacities of 160.9 and 120.1 mA h g^(-1)at current densities of 0.2 and 1 C,respectively.Even after more than 300 cycles at a current density of 0.2 C,it retaines an impressive 73.5%capacity.Moreover,it displayes stable cycling for over 180 cycles at a high current density of 0.5C.The super cycle stability may promote the application for ultralong-life all solid-state lithium metal batteries. 展开更多
关键词 Solid-state electrolyte Lithium-metal batteries Liquid crystalline polymer COPOLYMER 3D co-continuous structure Long cycle stability
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Acoustical properties of a 3D printed honeycomb structure filled with nanofillers:Experimental analysis and optimization for emerging applications
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作者 Jeyanthi Subramanian Vinoth kumar Selvaraj +3 位作者 Rohan Singh Ilangovan S Naresh Kakur Ruban Whenish 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2024年第5期248-258,共11页
The novelty of this research lies in the successful fabrication of a 3D-printed honeycomb structure filled with nanofillers for acoustic properties,utilizing an impedance tube setup in accordance with ASTM standard E ... The novelty of this research lies in the successful fabrication of a 3D-printed honeycomb structure filled with nanofillers for acoustic properties,utilizing an impedance tube setup in accordance with ASTM standard E 1050-12.The Creality Ender-3,a 3D printer,was used for printing the honeycomb structures,and polylactic acid(PLA)material was employed for their construction.The organic,inorganic,and polymeric compounds within the composites were identified using fourier transformation infrared(FTIR)spectroscopy.The structure and homogeneity of the samples were examined using a field emission scanning electron microscope(FESEM).To determine the sound absorption coefficient of the 3D printed honeycomb structure,numerous samples were systematically developed using central composite design(CCD)and analysed using response surface methodology(RSM).The RSM mathematical model was established to predict the optimum values of each factor and noise reduction coefficient(NRC).The optimum values for an NRC of 0.377 were found to be 1.116 wt% carbon black,1.025 wt% aluminium powder,and 3.151 mm distance between parallel edges.Overall,the results demonstrate that a 3Dprinted honeycomb structure filled with nanofillers is an excellent material that can be utilized in various fields,including defence and aviation,where lightweight and acoustic properties are of great importance. 展开更多
关键词 3D printing Honeycomb structure ACOUSTICS Field emission scanning electron microscope Response surface methodology
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Elimination of cracks in stainless steel casings via 3D printed sand molds with an internal topology structure
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作者 Jun-hang Xu Bao-zhi Li +6 位作者 Zhao-wei Song Yun-bao Gao Jing-ming Li Yu Wang Qiu-lin Wen Heng Cao Zeng-rui Wang 《China Foundry》 SCIE EI CAS CSCD 2024年第4期319-326,共8页
The important supporting component in a gas turbine is the casing,which has the characteristics of large size,complex structure,and thin wall.In the context of existing 3DP sand casting processes,casting crack defects... The important supporting component in a gas turbine is the casing,which has the characteristics of large size,complex structure,and thin wall.In the context of existing 3DP sand casting processes,casting crack defects are prone to occur.This leads to an increase in the scrap rate of casings,causing significant resource wastage.Additionally,the presence of cracks poses a significant safety hazard after the casings are put into service.The generation of different types of crack defects in stainless steel casings is closely related to casting stress and the high-temperature concession of the sand mold.Therefore,the types and causes of cracks in stainless steel casing products,based on their structural characteristics,were systematically analyzed.Various sand molds with different internal topology designs were printed using the 3DP technology to investigate the impact of sand mold structures on high-temperature concession.The optimal sand mold structure was used to cast casings,and the crack suppression effect was verified by analyzing its eddy current testing results.The experimental results indicate that the skeleton structure has an excellent effect on suppressing cracks in the casing.This research holds important theoretical and engineering significance in improving the quality of casing castings and reducing production costs. 展开更多
关键词 gas turbine casing crack defects 3D printed sand mold topological structure high-temperature concession
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2.5D C/SiC复合材料铣削材料去除的实验研究
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作者 侯兆鑫 刘畅 高磊 《宇航材料工艺》 CAS CSCD 北大核心 2024年第4期110-116,共7页
为了探究2.5D C/SiC复合材料铣削加工的材料去除特性,分别选用端铣刀和鱼鳞铣刀对2.5D C/SiC复合材料开展普通铣削和超声振动辅助铣削实验。分析了四种铣削工况下切削力、切削温度的变化规律,研究了0°、90°和z向针刺纤维的去... 为了探究2.5D C/SiC复合材料铣削加工的材料去除特性,分别选用端铣刀和鱼鳞铣刀对2.5D C/SiC复合材料开展普通铣削和超声振动辅助铣削实验。分析了四种铣削工况下切削力、切削温度的变化规律,研究了0°、90°和z向针刺纤维的去除特性。结果表明,相比于传统端铣刀和普通铣削,鱼鳞铣刀和超声振动辅助铣削分别可以显著地降低切削力和切削温度。超声振动辅助铣削可以使纤维的整体去除变为破碎去除,减小表面缺陷。鱼鳞铣刀和超声振动辅助铣削的组合工艺方式可以较大程度地降低表面缺陷、切削力和切削温度,提高工件表面质量,为2.5D C/SiC复合材料低损伤铣削提供了可行性。 展开更多
关键词 2.5d C/SiC复合材料 超声振动辅助铣削 切削力 切削温度 材料去除
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一种基于热阻矩阵的2.5D封装芯片结温预测模型
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作者 刘加豪 古莉娜 +2 位作者 陈方舟 郭小童 赵昊 《电子产品可靠性与环境试验》 2024年第1期63-67,共5页
随着2.5D封装芯片的封装尺寸不断减小和功率密度持续增加,芯片内部温度急剧上升。为了满足芯片散热和可靠性需求,准确预测服役过程中芯片的结温具有重要的意义。在充分考虑热耦合效应后,从2.5D封装芯片的热阻网络拓扑结构出发,提出了一... 随着2.5D封装芯片的封装尺寸不断减小和功率密度持续增加,芯片内部温度急剧上升。为了满足芯片散热和可靠性需求,准确预测服役过程中芯片的结温具有重要的意义。在充分考虑热耦合效应后,从2.5D封装芯片的热阻网络拓扑结构出发,提出了一种基于热阻矩阵的2.5D封装芯片结温预测模型。同时,采用FloTHERM热仿真软件对该预测模型进行了验证。结果表明,在对2.5D封装芯片施加不同功率后,该模型的计算结果和FloTHERM仿真结果相对误差小于5%。由此说明,该模型能够高效准确地预测2.5D封装芯片的结温。 展开更多
关键词 2.5d封装 热阻矩阵 热耦合效应 结温预测 有限元分析
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基于二维降阶Hermite插值的铁路路基动力响应2.5D有限元模拟 被引量:4
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作者 王瑞 胡志平 +1 位作者 彭建兵 王启耀 《岩土力学》 EI CAS CSCD 北大核心 2023年第3期908-915,共8页
2.5D有限元方法在铁路路基动力响应研究领域中的应用渐趋广泛。针对其在求解随机不平顺条件下路基动力响应时计算效率显著下降的问题,构建了基于二维降阶Hermite插值的2.5D有限元路基动力响应快速计算框架。以路基在频率-波数域动力响... 2.5D有限元方法在铁路路基动力响应研究领域中的应用渐趋广泛。针对其在求解随机不平顺条件下路基动力响应时计算效率显著下降的问题,构建了基于二维降阶Hermite插值的2.5D有限元路基动力响应快速计算框架。以路基在频率-波数域动力响应的基本特征为依据确定了插值原则,讨论了插值点分布和数量对插值精度的影响。研究表明:采用二维降阶Hermite插值方法可以实现随机不平顺条件下路基动力响应的快速计算。相比插值点非均匀分布,插值点均匀分布可以兼顾幅值和相位的插值精度,适应性更好。此外,该方法的计算效率仅与插值点数量相关,不受随机不平顺谐波数量的影响,在模拟随机不平顺条件下路基动力响应方面具备显著的优势。 展开更多
关键词 2.5d有限元 铁路路基 响应函数 计算效率 二维插值
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含减纱2.5D机织碳/环氧复合材料低速冲击损伤机制
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作者 张典堂 窦宏通 +1 位作者 董放 江昊 《天津工业大学学报》 CAS 北大核心 2023年第6期24-32,46,共10页
针对锥形回转体构件常用的减纱工艺,设计和制备了不含减纱、含半列减纱和含整列减纱2.5D机织碳/环氧复合材料。分别设置54 J和72 J的冲击能量,采用落锤冲击仪对3种复合材料开展了低速冲击试验,获取了载荷-时间曲线,并采用Micro-CT开展... 针对锥形回转体构件常用的减纱工艺,设计和制备了不含减纱、含半列减纱和含整列减纱2.5D机织碳/环氧复合材料。分别设置54 J和72 J的冲击能量,采用落锤冲击仪对3种复合材料开展了低速冲击试验,获取了载荷-时间曲线,并采用Micro-CT开展了损伤形貌和损伤量化分析。基于低速冲击损伤“局部”分布特征,建立了一种宏-细观混合有限元模型,开展了3种复合材料的低速冲击数值模拟,并揭示了失效机理。结果表明:数值模拟的力学响应曲线及损伤形貌与对应试验结果吻合较好;相比于不含减纱试样,在54 J冲击能量下,含半列减纱和整列减纱试样的冲击损伤体积分别增加了21.0%和34.8%;在72 J冲击能量下,含半列减纱和整列减纱试样的冲击损伤体积分别增加了15.7%和24.4%。可以看出,减纱点的引入明显降低了结构的承载效率。 展开更多
关键词 减纱 2.5d机织复合材料 低速冲击 损伤机制 混合模型
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2.5D设计在汉口异质文化空间插画中的应用研究
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作者 蓝江平 张子玮 《美术教育研究》 2023年第20期90-92,共3页
为加强汉口城市形象的塑造,扩大城市文化的影响,该文将异质文化空间作为一种对传统文化空间形式的思考方式,在其视角下解析汉口异质文化空间的内涵,结合2.5D设计特点,探索二者结合的动因并产生设计思考,总结汉口异质文化空间2.5D插画设... 为加强汉口城市形象的塑造,扩大城市文化的影响,该文将异质文化空间作为一种对传统文化空间形式的思考方式,在其视角下解析汉口异质文化空间的内涵,结合2.5D设计特点,探索二者结合的动因并产生设计思考,总结汉口异质文化空间2.5D插画设计的设计原则和设计语言。用2.5D设计形式表现汉口异质文化空间的生活形态,展示汉口城市文化生活的真实形态,能为汉口异质文化空间的视觉表达提供全新的思路。 展开更多
关键词 异质空间 汉口文化空间 2.5d插画设计
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基于2.5D微流控技术的黏土矿物运移对喉道封堵和原油运移的影响 被引量:1
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作者 徐飞 姜汉桥 +5 位作者 刘铭 王志强 于馥玮 曲世元 张媌 李俊键 《大庆石油地质与开发》 CAS 北大核心 2023年第4期64-73,共10页
为了研究低矿化度水驱中的黏土矿物在地层中的运移现象,利用可视化2.5D微观模型开展了微流控实验,研究了黏土矿物在运移过程中对扩大水驱波及体积的作用、黏土矿物的运移速度对运移距离的影响、黏土矿物对喉道的封堵作用类型和黏土矿物... 为了研究低矿化度水驱中的黏土矿物在地层中的运移现象,利用可视化2.5D微观模型开展了微流控实验,研究了黏土矿物在运移过程中对扩大水驱波及体积的作用、黏土矿物的运移速度对运移距离的影响、黏土矿物对喉道的封堵作用类型和黏土矿物运移对油滴运移的影响等。实验发现:黏土矿物在运移时可封堵水流优势通道并显著增加水驱波及体积,从而提高原油的采收率;黏土矿物颗粒运移速度越快,越容易在短距离内产生对喉道的封堵,使得黏土矿物颗粒的运移距离越短。根据实验观察将黏土矿物颗粒对喉道的封堵分为3种类型,包括单颗粒封堵、并行颗粒封堵和堵后颗粒截留。黏土矿物对喉道的封堵主要受到喉道尺寸,黏土矿物颗粒的尺寸、数量及形状,流体的驱动力大小等因素的影响;黏土矿物颗粒会附着在油滴表面增加油滴运移的阻力,对喉道的封堵会改变油滴的运移路径和降低注入水对油滴的驱动力,不利于已波及区域油滴的运移。通过微流控实验明确的黏土矿物运移对喉道封堵和原油运移的影响,可为低矿化度水驱在矿场中的应用提供理论指导。 展开更多
关键词 低矿化度水驱 黏土矿物 2.5d微观模型 封堵 提高采收率
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2.5D/3D硅基光电子集成技术及应用 被引量:2
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作者 欧祥鹏 杨在利 +4 位作者 唐波 李志华 罗军 王文武 杨妍 《光通信研究》 2023年第1期1-16,共16页
全球网络流量急速增长,数据传输所需带宽和能源消耗也随之快速增加,传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体(CMOS)技术将光子集成电... 全球网络流量急速增长,数据传输所需带宽和能源消耗也随之快速增加,传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体(CMOS)技术将光子集成电路和电子集成电路大规模集成在硅衬底上等优势,能满足下一代数据传输系统的迫切需求。2.5D/3D硅基光电子集成技术可以有效缩短光芯片和电芯片之间电学互连长度、减小芯片尺寸,从而减小寄生效应、提高集成密度和降低功耗。文章介绍了硅基光电子集成技术的不同方案和最新进展,并展望了硅基光电子芯片结合2.5D/3D集成技术在数据通信、激光雷达、生化传感以及光计算等领域的应用前景。 展开更多
关键词 光通信 硅光 光电集成 2.5d/3D集成 硅通孔 转接板
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2.5D Chiplet封装结构的热应力研究 被引量:1
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作者 张中 乔新宇 +3 位作者 龙欣江 谢雨龙 龚臻 张志强 《传感技术学报》 CAS CSCD 北大核心 2023年第7期1024-1031,共8页
开展了一种2.5D Chiplet封装结构的热应力研究,形成了一套适用于先进封装的设计理论方法,从而显著提升Chiplet封装性能和降低成本。根据实际生产要求,选择芯片表面应力、底部填充胶应力和封装翘曲三个关键封装性能作为优化目标。首先建... 开展了一种2.5D Chiplet封装结构的热应力研究,形成了一套适用于先进封装的设计理论方法,从而显著提升Chiplet封装性能和降低成本。根据实际生产要求,选择芯片表面应力、底部填充胶应力和封装翘曲三个关键封装性能作为优化目标。首先建立了Chiplet封装模型,采用COMSOL进行有限元仿真,揭示了底部填充胶材料选型、两芯片间底部填充胶高度、塑封料和芯片高度三个参数对上述封装性能的影响规律。然后通过正交试验设计方法获得仿真数据,并基于极差分析法处理相关数据,分析各参数影响因素对优化目标的影响程度,进而获得2.5D Chiplet封装结构的最优参数。最后将优化后Chiplet封装模型通过仿真进行验证,结果表明该封装结构中芯片表面平均应力减小为93%,底部填充胶峰值应力减小为86%,和封装翘曲减低为96%,从而验证了设计的有效性。 展开更多
关键词 2.5d Chiplet封装 热应力 封装翘曲 底部填充胶 正交试验 极差分析
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