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3-D寄生电阻电容线性元计算的并行实现
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作者 周文明 王泽毅 饶岚 《电子学报》 EI CAS CSCD 北大核心 1998年第2期123-126,共4页
VLSI电路中,深亚微米工艺及多层布线技术的广泛应用使互连寄生效应成为制约电路性能的主要因素,直接边界元素法3-D寄生电阻电容提取的计算量很大,采用并行计算是快速提取的重要途径之一。本文介绍运用PC机网络计算软件PV... VLSI电路中,深亚微米工艺及多层布线技术的广泛应用使互连寄生效应成为制约电路性能的主要因素,直接边界元素法3-D寄生电阻电容提取的计算量很大,采用并行计算是快速提取的重要途径之一。本文介绍运用PC机网络计算软件PVM实现寄生电阻电容线性元分布式计算的方法,讨论了线性方程组建立和求解过程采用的并行计算方案。最后,对算法的并行效率及负载平衡作了分析。 展开更多
关键词 3-d寄生电阻 电容提取 并行计算 vlsi
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Analytical-BEM coupling method for fast 3-D interconnect resistance extraction
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作者 WANG Xi-ren YU Wen-jian WANG Ze-yi 《Frontiers of Electrical and Electronic Engineering in China》 CSCD 2006年第2期239-243,共5页
Deep submicron process technology is widely being used and interconnect structures are becoming more and more complex.This means that the resistance calculation based on two-dimensional models can no longer provide su... Deep submicron process technology is widely being used and interconnect structures are becoming more and more complex.This means that the resistance calculation based on two-dimensional models can no longer provide sufficiently accurate results.This paper presents a three-dimensional resistance calculation method called the combined analytical formula and boundary element method(ABEM).The method cuts selected interconnecting lines then it calculates the resistances of straight sections using an analytical formula and the resistances of the other sections using the boundary element method(BEM).The resistances of the different sub-regions are combined to calculate the resistance of the entire region.Experiments on actual layouts show that compared with the commercial software Raphael based on finite difference method,the proposed method is 2-3 orders of magnitude faster.The ABEM method uses much less memory(about 0.1%-1%),and is more accurate than Raphael with default mesh partitions.The results illustrate that the proposed method is efficient and accurate. 展开更多
关键词 Very large scale integration interconnecting resistance 3-d extraction Analytical formula BEM
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基于K参数思想的快速三维互连电感电阻提取算法 被引量:4
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作者 魏洪川 喻文健 +1 位作者 杨柳 王泽毅 《电子学报》 EI CAS CSCD 北大核心 2005年第8期1365-1369,共5页
在GHz以上高频集成电路中,电感寄生效应已严重影响了电路性能,必须研究有效的算法提取互连电感电阻.本文基于K参数(电感矩阵的逆)较好的局部化特性,提出适应高频情况的互连电感电阻提取算法.通过采用有效的窗口选择技术和导体细丝划分,... 在GHz以上高频集成电路中,电感寄生效应已严重影响了电路性能,必须研究有效的算法提取互连电感电阻.本文基于K参数(电感矩阵的逆)较好的局部化特性,提出适应高频情况的互连电感电阻提取算法.通过采用有效的窗口选择技术和导体细丝划分,以及在细丝电感计算复用和导纳矩阵求逆两方面的改进,本文算法可有效处理复杂的多层互连结构,在保持较好精度的情况下,计算速度比FastHenry快上百倍. 展开更多
关键词 三维互连 电感电阻提取 K参数 高频率 窗口技术
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三维涡流计算中最少变量数边界积分方程的一个注记 被引量:1
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作者 方蜀州 王泽毅 《电子学报》 EI CAS CSCD 北大核心 2002年第8期1114-1116,共3页
本文回顾了求解三维电磁场涡流问题的数值计算方法 ,其中最少变量数边界积分方程法 (BoundaryIn tegralEquationsofMinimumOrderMethod)具有很多优点 .但提出该方法的论文以及后续论文中的边界积分方程中存在一些错误 ,本文给出了边界... 本文回顾了求解三维电磁场涡流问题的数值计算方法 ,其中最少变量数边界积分方程法 (BoundaryIn tegralEquationsofMinimumOrderMethod)具有很多优点 .但提出该方法的论文以及后续论文中的边界积分方程中存在一些错误 ,本文给出了边界积分方程的极限推导过程 ,改正了这些错误 . 展开更多
关键词 涡流计算 变量数 三维 边界积分方程 互连线 互连寄生效应 集成电路
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On Fault Tolerance of 3-Dimensional Mesh Networks 被引量:3
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作者 Gao-CaiWang Jian-ErChen Guo-JunWang 《Journal of Computer Science & Technology》 SCIE EI CSCD 2004年第2期183-190,共8页
In this paper, the concept of k-submesh and k-submesh connectivity fault tolerance model is proposed. And the fault tolerance of 3-D mesh networks is studied under a more realistic model in which each network node has... In this paper, the concept of k-submesh and k-submesh connectivity fault tolerance model is proposed. And the fault tolerance of 3-D mesh networks is studied under a more realistic model in which each network node has an independent failure probability. It is first observed that if the node failure probability is fixed, then the connectivity probability of 3-D mesh networks can be arbitrarily small when the network size is sufficiently large. Thus, it is practically important for multicomputer system manufacturer to determine the upper bound for node failure probability when the probability of network connectivity and the network size are given. A novel technique is developed to formally derive lower bounds on the connectivity probability for 3-D mesh networks. The study shows that 3-D mesh networks of practical size can tolerate a large number of faulty nodes thus are reliable enough for multicomputer systems. A number of advantages of 3-D mesh networks over other popular network topologies are given. Compared to 2-D mesh networks, 3-D mesh networks are much stronger in tolerating faulty nodes, while for practical network size, the fault tolerance of 3-D mesh networks is comparable with that of hypercube networks but enjoys much lower node degree. 展开更多
关键词 interconnection network 3-d mesh network fault tolerance parallel processing
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New Multipole Method for 3-D Capacitance Extraction
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作者 Zhao-ZhiYang Ze-YiWang 《Journal of Computer Science & Technology》 SCIE EI CSCD 2004年第4期544-549,共6页
This paper describes an efficient improvement of the multipole accelerated boundary element method for 3-D capacitance extraction. The overall relations between the positions of 2-D boundary elements are considered in... This paper describes an efficient improvement of the multipole accelerated boundary element method for 3-D capacitance extraction. The overall relations between the positions of 2-D boundary elements are considered instead of only the relations between the center-points of the elements, and a new method of cube partitioning is introduced. Numerical results are presented to demonstrate that the method is accurate and has nearly linear computational growth as O(n), where n is the number of panels/boundary elements. The proposed method is more accurate and much faster than Fastcap. 展开更多
关键词 3-d interconnect parasitic capacitance extraction IBEM (indirect boundary element method) electronic design automation parasitic parameter extraction vlsi simulation verification
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