3D‑Printed Carbon‑Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics

Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electronics,posing a major obstacle to the integra-tion of electronics.The innovation of integrating 3D-printed conformal shielding(c-SE)modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE func-tion without occupying additional space.Herein,the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity.Accordingly,the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing.In particular,the SE performance of 3D-printed frame is up to 61.4 dB,simultaneously accompanied with an ultralight architecture of 0.076 g cm^(-3) and a superhigh specific shielding of 802.4 dB cm3 g^(-1).Moreover,as a proof-of-concept,the 3D-printed c-SE module is in situ integrated into core electronics,successfully replacing the traditional metal-based module to afford multiple functions for electromagnetic compatibility and thermal dissipa-tion.Thus,this scientific innovation completely makes up the blank for assembling carbon-based c-SE modules and sheds a brilliant light on developing the next generation of high-performance shielding materials with arbitrarily-customized structure for integrated electronics.

Integral imaging-based tabletop light field 3D display with large viewing angle

Light field 3D display technology is considered a revolutionary technology to address the critical visual fatigue issues in the existing 3D displays.Tabletop light field 3D display provides a brand-new display form that satisfies multi-user shared viewing and collaborative works,and it is poised to become a potential alternative to the traditional wall and portable display forms.However,a large radial viewing angle and correct radial perspective and parallax are still out of reach for most current tabletop light field 3D displays due to the limited amount of spatial information.To address the viewing angle and perspective issues,a novel integral imaging-based tabletop light field 3D display with a simple flat-panel structure is proposed and developed by applying a compound lens array,two spliced 8K liquid crystal display panels,and a light shaping diffuser screen.The compound lens array is designed to be composed of multiple three-piece compound lens units by employing a reverse design scheme,which greatly extends the radial viewing angle in the case of a limited amount of spatial information and balances other important 3D display parameters.The proposed display has a radial viewing angle of 68.7°in a large display size of 43.5 inches,which is larger than the conventional tabletop light field 3D displays.The radial perspective and parallax are correct,and high-resolution 3D images can be reproduced in large radial viewing positions.We envision that this proposed display opens up possibility for redefining the display forms of consumer electronics.

A Semantic-Sensitive Approach to Indoor and Outdoor 3D Data Organization

Building model data organization is often programmed to solve a specific problem,resulting in the inability to organize indoor and outdoor 3D scenes in an integrated manner.In this paper,existing building spatial data models are studied,and the characteristics of building information modeling standards(IFC),city geographic modeling language(CityGML),indoor modeling language(IndoorGML),and other models are compared and analyzed.CityGML and IndoorGML models face challenges in satisfying diverse application scenarios and requirements due to limitations in their expression capabilities.It is proposed to combine the semantic information of the model objects to effectively partition and organize the indoor and outdoor spatial 3D model data and to construct the indoor and outdoor data organization mechanism of“chunk-layer-subobject-entrances-area-detail object.”This method is verified by proposing a 3D data organization method for indoor and outdoor space and constructing a 3D visualization system based on it.

High-Performance and Flexible Co-Planar Integrated Microsystem of Carbon-Based All-Solid-State Micro-Supercapacitor and Real-Time Temperature Sensor

With the rapid development of flexible and portable microelectronics,the extreme demand for miniaturized,mechanically flexible,and integrated microsystems are strongly stimulated.Here,biomass-derived carbons(BDCs)are prepared by KOH activation using Qamgur precursor,exhibiting three-dimensional(3D)hierarchical porous structure.Benefiting from unobstructed 3D hierarchical porous structure,BDCs provide an excellent specific capacitance of 433 F g^(-1)and prominent cyclability without capacitance degradation after 50000 cycles at 50 A g^(-1).Furthermore,BDC-based planar micro-supercapacitors(MSCs)without metal collector,prepared by mask-assisted coating,exhibit outstanding areal-specific capacitance of 84 mF cm^(-2)and areal energy density of 10.6μWh cm^(-2),exceeding most of the previous carbon-based MSCs.Impressively,the MSCs disclose extraordinary flexibility with capacitance retention of almost 100%under extreme bending state.More importantly,a flexible planar integrated system composed of the MSC and temperature sensor is assembled to efficiently monitor the temperature variation,providing a feasible route for flexible MSC-based functional micro-devices.

DATA MODEL AND VISUALIZATION OF 3D CITY LANDSCAPE BASED ON INTEGRATED DATABASES

Data acquisition and modeling are the two important, difficult and costful aspects in a Cybercity project. 2D-GIS is mature and can manage a lot of spatial data. Thus 3D-GIS should make the best of data and technology of 2D-GIS. Construction of a useful synthetic environment requires integration of multiple types of information like DEM, texture images and 3D representation of objects such as buildings. In this paper, the method for 3D city landscape data model and visualization based on integrated databases is presented. Since the data volume of raster are very huge, special strategies(for example, pyramid gridded method) must be adopted in order to manage raster data efficiently. Three different methods of data acquisition, the proper data structure and a simple modeling method are presented as well. At last, a pilot project of Shanghai Cybercity is illustrated.

Heavy ion-induced single event upset sensitivity evaluation of 3D integrated static random access memory

Heavy ion-induced single event upsets(SEUs)of static random access memory(SRAM), integrated with three-dimensional integrated circuit technology, are evaluated using a Monte Carlo simulation method based on the Geant4 simulation toolkit. The SEU cross sections and multiple cell upset(MCU) susceptibility of 3D SRAM are explored using different types and energies of heavy ions.In the simulations, the sensitivities of different dies of 3D SRAM show noticeable discrepancies for low linear energy transfers(LETs). The average percentage of MCUs of 3D SRAM increases from 17.2 to 32.95%, followed by the energy of ^(209)Bi decreasing from 71.77 to 38.28 MeV/u. For a specific LET, the percentage of MCUs presents a notable difference between the face-to-face and back-toface structures. In the back-to-face structure, the percentage of MCUs increases with a deeper die, compared with the face-to-face structure. The simulation method and process are verified by comparing the SEU cross sections of planar SRAM with experimental data. The upset cross sections of the planar process and 3D integrated SRAM are analyzed. The results demonstrate that the 3D SRAM sensitivity is not greater than that of the planar SRAM. The 3D process technology has the potential to be applied to the aerospace and military fields.

3D-printing of integrated spheres as a superior support of phosphotungstic acid for deep oxidative desulfurization of fuel

Construction of catalysts with integral structure for oxidative reaction process is an essential promotion to catalysts in industrial application.In this work,a 3D printing method was employed to prepare 3D printed spheres(3D-PSs),followed by carbonization to form 3D carbon spheres(3D-CSs).Then,a 3D-CSs supported phosphotungstic acid(HPW/3D-CSs)was prepared for deep oxidative desulfurization.Compared with traditional powder catalysts,the as-prepared catalyst is easy to be operated and separated from oil products.The supported catalyst possesses excellent catalytic performance and the removal of DBT,4-MDBT and 4,6-DMDBT in fuel oil,reaching^100%of sulfur removal.The effects of various experimental parameters on desulfurization efficiency were considered to optimize reaction conditions.Moreover,the catalyst shows excellent thermal and chemical stability,with no obvious decrease in desulfurization activity after 5 cycles.GC–MS analysis indicates DBT sulfone was the solely oxidized product of DBT.

Collaborative Design in PDM / 3D CAD Integrated Environment

Some key issues in supporting collaborative design in product data management（PDM ） system and 3D computer aided design（CAD） system integrated environment are analyzed. The general architecture of the integrated environment is divided into five tiers and employs the transparently integrated mode, with the mode, function calling and information exchanging among independent PDM and CAD processes are carried out via message translation /parse approach. Product layout feature（PLF ） model definition is presented, PLF model is used to represent design intention at the preliminary design phase. The collaborative design methodology employing the PLF model in PDM/3D CAD integrated environment is analyzed. The design methodology can speed up the design process, reduce the investment and improve the product quality.

3D printing of osteocytic Dll4 integrated with PCL for cell fate determination towards osteoblasts in vitro

Since 3D printed hard materials could match the shape of bone,cell survival and fate determination towards osteoblasts in such materials have become a popular research target.In this study,a scaffold of hardmaterial for 3D fabrication was designed to regulate developmental signal(Notch)transduction guiding osteoblast differentiation.We established a polycaprolactone(PCL)and cell-integrated 3D printing system(PCI3D)to reciprocally print the beams of PCL and cell-laden hydrogel for a module.This PCI3D module holds good cell viability of over 87%,whereas cells show about sixfold proliferation in a 7-day culture.The osteocytic MLO-Y4 was engineered to overexpress Notch ligand Dll4,making up 25%after mixing with 75%stromal cells in the PCI3D module.Osteocytic Dll4,unlike other delta-like family members such as Dll1 or Dll3,promotes osteoblast differentiation and themineralization of primary mouse and a cell line of bone marrow stromal cells when cultured in a PCI3D module for up to 28 days.Mechanistically,osteocytic Dll4 could not promote osteogenic differentiation of the primary bone marrow stromal cells(BMSCs)after conditional deletion of the Notch transcription factor RBPjκby Cre recombinase.These data indicate that osteocytic Dll4 activates RBPjκ-dependent canonical Notch signaling in BMSCs for their oriented differentiation towards osteoblasts.Additionally,osteocytic Dll4 holds a great potential for angiogenesis in human umbilical vein endothelial cells within modules.Our study reveals that osteocytic Dll4 could be the osteogenic niche determining cell fate towards osteoblasts.This will open a new avenue to overcome the current limitation of poor cell viability and low bioactivity of traditional orthopedic implants.

Integrated 3D Fan-out Package of RF Microsystem and Antenna for 5G Communications

A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.

Fabrication of polyetheretherketone(PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method

Additive manufacturing(AM)is a free-form technology that shows great potential in the integrated creation of three-dimensional(3D)electronics.However,the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature,high conductivity and high resolution remains a challenge.In this paper,a hybrid AM method combining the fused deposition modeling(FDM)and hydrophobic treatment assisted laser activation metallization(LAM)was proposed for manufacturing the polyetheretherketone(PEEK)-based 3D electronics,by which the conformal copper patterns were deposited on the 3D-printed PEEK parts,and the adhesion between them reached the 5B high level.Moreover,the 3D components could support the thermal cycling test from-55℃ to 125℃ for more than 100 cycles.Particularly,the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface,not affected by the inevitable printing borders and pores in the FDM-printed parts,then making the resolution of the electroless plated copper lines improved significantly.In consequence,Cu lines with width and spacing of only60μm and 100μm were obtained on both as-printed and after-polished PEEK substrates.Finally,the potential of this technique to fabricate 3D conformal electronics was demonstrated.

Innovation leading development:a glimpse into three-dimensional bioprinting in Israel

Three-dimensional(3D)printing has attracted increasing research interest as an emerging manufacturing technology for devel-oping sophisticated and exquisite architecture through hierarchical printing.It has also been employed in various advanced industrial areas.The development of intelligent biomedical engineering has raised the requirements for 3D printing,such as flexible manufacturing processes and technologies,biocompatible constituents,and alternative bioproducts.However,state-of-the-art 3D printing mainly involves inorganics or polymers and generally focuses on traditional industrial fields,thus severely limiting applications demanding biocompatibility and biodegradability.In this regard,peptide architectonics,which are self-assembled by programmed amino acid sequences that can be flexibly functionalized,have shown promising potential as bioinspired inks for 3D printing.Therefore,the combination of 3D printing and peptide self-assembly poten-tially opens up an alternative avenue of 3D bioprinting for diverse advanced applications.Israel,a small but innovative nation,has significantly contributed to 3D bioprinting in terms of scientific studies,marketization,and peptide architectonics,including modulations and applications,and ranks as a leading area in the 3D bioprinting field.This review summarizes the recent progress in 3D bioprinting in Israel,focusing on scientific studies on printable components,soft devices,and tissue engineering.This paper further delves into the manufacture of industrial products,such as artificial meats and bioinspired supramolecular architectures,and the mechanisms,physicochemical properties,and applications of peptide self-assembly.Undoubtedly,Israel contributes significantly to the field of 3D bioprinting and should thus be appropriately recognized.

Three-Dimensional Cooperative Localization via Space-Air-Ground Integrated Networks

The space-air-ground integrated network(SAGIN)combines the superiority of the satellite,aerial,and ground communications,which is envisioned to provide high-precision positioning ability as well as seamless connectivity in the 5G and Beyond 5G(B5G)systems.In this paper,we propose a three-dimensional SAGIN localization scheme for ground agents utilizing multi-source information from satellites,base stations and unmanned aerial vehicles(UAVs).Based on the designed scheme,we derive the positioning performance bound and establish a distributed maximum likelihood algorithm to jointly estimate the positions and clock offsets of ground agents.Simulation results demonstrate the validity of the SAGIN localization scheme and reveal the effects of the number of satellites,the number of base stations,the number of UAVs and clock noise on positioning performance.

Computation of the Eigenvalues of 3<i>D</i>“Charged” Integral Equations

The Rayleigh-Ritz and the inverse iteration methods are used in order to compute the eigenvalues of 3D Fredholm-Stieltjes integral equations, i.e. 3D Fredholm equations with respect to suitable Stieltjes-type measures. Some applications are shown, relevant to the problem of computing the eigenvalues of a body charged by a finite number of masses concentrated on points, curves or surfaces lying in.

Metallogenic model of the Shuangjianzishan Ag-Pb-Zn district,Northeast China:Revealed from integrated geophysical investigation

The Shuangjianzishan deposit in Inner Mongolia is a typical Ag-Pb-Zn deposit of the southern Great Xing’an Range.Proven reserves of Ag,Pb,and Zn in this deposit have reached the scale of super-large deposits,with favorable metallogenic conditions,strong prospecting signs,and high metallogenic potential.This paper reports a study involving integrated geophysical methods,including controlled-source audio-frequency magnetotelluric,gravity,magnetic,and shallow-seismic-reflection methods,to determine the spatial distribution of ore-controlling structures and subsurface intrusive rock for a depth range of<2000 m in the Shuangjianzishan ore district.The objective of this study is to construct a metallogenic model of the ore district and provide a scientific basis for the exploration of similar deposits in the deep and surrounding regions.We used three-dimensional inversion for controlled-source audio-frequency magnetotelluric data based on the limited memory quasi-Newton algorithm,and three-dimensional physical-property inversion for the gravity and magnetic data to obtain information about the subsurface distribution of ore-controlling structures and intrusive rocks.Under seismic reflection results,regional geology,petrophysical properties,and borehole information,the geophysical investigation shows that the Dashizhai group,which contains the main ore-bearing strata in the ore district,is distributed within a depth range of<1239 m,and is thick in the Xinglongshan ore block and the eastern part of the Shuangjianzishan ore block.The mineralization is spatially associated with a fault system characterized by NE-,NW-,and N-trending faults.The magnetic and electrical models identify large,deep bodies of intrusive rock that are inferred to have been involved in mineralization,with local shallow emplacement of some intrusions.Combining the subsurface spatial distributions of ore-bearing strata,ore-controlling faults,and intrusive rock,we propose two different metallogenic models for the Shuangjianzishan ore district,which provide a scientific basis for further prospecting in the deep regions of the ore district and surrounding areas.

The Use of Three-Dimensional Integrated Design System in Smart Substation Design

The traditional power design, construction, has been able to meet the requirements, but it has not been established engineering data database support and the correlation between the data is poor, due to inadequate coordination among design professionals, design easily lead to mistakes, field problems, and design results failed in all aspects of the project to be fully utilized. With the technology of three-dimensional integrated design system penetrates in all walks of life, the introduction of three-dimensional integrated design system substation design solutions and the application of common devices of State Grid Corporation in recent years, which provide technical conditions for the application of virtual reality technology in substation design. According to its own characteristics of substation project, we now propose prospect on virtual reality technology in substation design application.

玻纤／涤纶混杂3D整体机织蜂窝结构复合材料的冲击性能

为研究玻纤/涤纶混杂纤维复合材料中涤纶含量对复合材料低速冲击性能的影响,设计了7种混杂纱线,并在改进后的普通织机上织造,同时采用真空辅助成型工艺制成混杂纤维复合材料板材。探讨了多种纤维混杂后纤维体积含量的计算方法,对混杂纤维增强复合材料冲击后断裂情况及能量吸收性能进行研究。结果表明,混入涤纶后复合材料会产生明显的混杂效应,经预测当涤纶含量约为55.69%时,复合材料能量吸收性能最好,在节省成本的情况下达到了最优。

基于3DGIS技术的电网3维可视化系统技术架构设计

从信息技术应用的角度,通过整合3维GIS,虚拟现实技术和信息集成等信息技术,为电网实现3维可视化提出一个技术机构,它可以从多分辨率、多尺度、多时空等多种角度实现电网的3维可视化。论文阐述了该系统的技术架构以及实现的关键技术,如合成建模、可视化仿真、信息集成、可视化,为电网规划设计、工程建设、运行维护3维可视化提出一种建设思路,相信对从事相关工作的同行能有所裨益。

单镜头真3D立体摄像技术

针对集成成像技术记录图像呈现立体深度小、图像摄取技术要求高等缺点,提出一种单镜头真3D立体摄像系统,并从系统结构、原理、核心元件参数设计、显示效果等方面对系统进行分析。研究表明,单镜头真3D立体摄像系统能记录并呈现更深的三维场景,且可在一定范围内进行焦距调整,其结构简单,有利于真3D立体图像技术的推广,具有较高的研究与应用价值。

基于3-D整数小波变换的视频压缩算法研究

视频图像数据可以被看成三维数据体来进行3-D小波变换,对变换后的数据进行编码就可以达到压缩视频数据的目的。主要讨论了这种变换的整数实现方法,以及对小波系数使用SPIHT算法进行编码压缩,并对SPIHT算法进行了有针对性的优化。仿真实验证明,该文方法压缩效果良好,运行效率高,输出码流具有嵌入式特性,是一种有应用前景的算法。