Since the three-dimensional Network on Chip(3D NoC)uses through-silicon via technology to connect the chips,each silicon layer is conducted through heterogeneous thermal,and 3D NoC system suffers from thermal problems...Since the three-dimensional Network on Chip(3D NoC)uses through-silicon via technology to connect the chips,each silicon layer is conducted through heterogeneous thermal,and 3D NoC system suffers from thermal problems.To alleviate the seriousness of the thermal problem,the distribution of data packets usually relies on traffic information or historical temperature information.However,thermal problems in 3D NoC cannot be solved only based on traffic or temperature information.Therefore,we propose a Score-Based Traffic-and Thermal-Aware Adaptive Routing(STTAR)that applies traffic load and temperature information to routing.First,the STTAR dynamically adjusts the input and output buffer lengths of each router with traffic load information to limit routing resources in overheated areas and control the rate of temperature rise.Second,STTAR adopts a scoring strategy based on temperature and the number of free slots in the buffer to avoid data packets being transmitted to high-temperature areas and congested areas and to improve the rationality of selecting routing output nodes.In our experiments,the proposed scoring Score-Based Traffic-and Thermal-Aware Adaptive Routing(STTAR)scheme can increase the throughput by about 14.98%to 47.90%and reduce the delay by about 10.80%to 35.36%compared with the previous works.展开更多
3D NoC在同构多核系统中相比2D NoC具有更为优越的性能。本文在研究3DMesh结构的基础上,对拓扑结构中的平均延时和理想吞吐量进行了理论上的评估,并提出了一种基于3DMesh的新的静态路由算法,最后运用NS2网络仿真软件对其进行仿真和比较...3D NoC在同构多核系统中相比2D NoC具有更为优越的性能。本文在研究3DMesh结构的基础上,对拓扑结构中的平均延时和理想吞吐量进行了理论上的评估,并提出了一种基于3DMesh的新的静态路由算法,最后运用NS2网络仿真软件对其进行仿真和比较。实验结果显示,新的路由算法可以有效地提高吞吐量,并在大规模数据传输时不容易造成阻塞,表现了较好的性能。展开更多
三维片上网络(three-dimensional network on chip,3D No C)是在三维集成电路(three-dimensional integrated circuit,3D IC)、片上系统(system on chip,So C)和二维片上网络(two-dimensional network on chip,2D No C)的基础上发展起来...三维片上网络(three-dimensional network on chip,3D No C)是在三维集成电路(three-dimensional integrated circuit,3D IC)、片上系统(system on chip,So C)和二维片上网络(two-dimensional network on chip,2D No C)的基础上发展起来的,主要解决高集成度芯片通信瓶颈等问题,已引起国内外学术界和产业界的高度重视。3D No C拓扑结构体现了通信节点在芯片中的布局与连接,对三维芯片性能起决定性作用。简介了2D No C、2D No C到3D No C的演变、3D No C的优点与存在的问题以及3D No C解决的关键技术问题,分析了3D No C总体发展状况。三维拓扑结构是3D No C设计中的关键问题之一,重点研究了3D No C拓扑结构的分类方法,从通信角度将3D No C拓扑结构分成9大类,分类论述了3D No C拓扑结构,并分析比较了现有63种拓扑结构各自的特点,最后指出了3D No C拓扑结构的未来研究方向。展开更多
基金The work of BJUT researchers Fang et al.was partly supported by the Beijing Natural Science Foundation(4192007)the National Natural Science Foundation of China(61202076)Beijing University of Technology Project No.2021C02.
文摘Since the three-dimensional Network on Chip(3D NoC)uses through-silicon via technology to connect the chips,each silicon layer is conducted through heterogeneous thermal,and 3D NoC system suffers from thermal problems.To alleviate the seriousness of the thermal problem,the distribution of data packets usually relies on traffic information or historical temperature information.However,thermal problems in 3D NoC cannot be solved only based on traffic or temperature information.Therefore,we propose a Score-Based Traffic-and Thermal-Aware Adaptive Routing(STTAR)that applies traffic load and temperature information to routing.First,the STTAR dynamically adjusts the input and output buffer lengths of each router with traffic load information to limit routing resources in overheated areas and control the rate of temperature rise.Second,STTAR adopts a scoring strategy based on temperature and the number of free slots in the buffer to avoid data packets being transmitted to high-temperature areas and congested areas and to improve the rationality of selecting routing output nodes.In our experiments,the proposed scoring Score-Based Traffic-and Thermal-Aware Adaptive Routing(STTAR)scheme can increase the throughput by about 14.98%to 47.90%and reduce the delay by about 10.80%to 35.36%compared with the previous works.
文摘三维片上网络(three-dimensional network on chip,3D No C)是在三维集成电路(three-dimensional integrated circuit,3D IC)、片上系统(system on chip,So C)和二维片上网络(two-dimensional network on chip,2D No C)的基础上发展起来的,主要解决高集成度芯片通信瓶颈等问题,已引起国内外学术界和产业界的高度重视。3D No C拓扑结构体现了通信节点在芯片中的布局与连接,对三维芯片性能起决定性作用。简介了2D No C、2D No C到3D No C的演变、3D No C的优点与存在的问题以及3D No C解决的关键技术问题,分析了3D No C总体发展状况。三维拓扑结构是3D No C设计中的关键问题之一,重点研究了3D No C拓扑结构的分类方法,从通信角度将3D No C拓扑结构分成9大类,分类论述了3D No C拓扑结构,并分析比较了现有63种拓扑结构各自的特点,最后指出了3D No C拓扑结构的未来研究方向。
