Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabricati...Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.展开更多
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-...The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.展开更多
Recently,food grade nanofiber-based materials have received growing attentions in food packaging.In this work,novel active and intelligent packaging nanofibers based on gelatin/chitosan with curcumin(GA/CS/CUR)were de...Recently,food grade nanofiber-based materials have received growing attentions in food packaging.In this work,novel active and intelligent packaging nanofibers based on gelatin/chitosan with curcumin(GA/CS/CUR)were developed via electrospinning technique.Effects of the incorporation of CUR content(0.1%-0.3%,m/m)on the microstructure and functional properties of the electrospun nanofibers were investigated.Morphological studies using scanning electron microscopy indicated that loading CUR can affect the average diameter of nanofiber mats,which remained around 160-180 nm.The addition of an appropriate level CUR(0.2%,m/m)led to a stronger intermolecular interaction,and thus enhanced the thermal stability and tensile strength of the obtained nanofibers.Meanwhile,the incorporation of CUR significantly improved antioxidant activity and the antimicrobial activity of GA/CS/CUR nanofibers.Moreover,the sensitivity of nanofibers to ammonia results indicated that GA/CS nanofibers containing 0.2%CUR(GA/CS/CURⅡ)presented high sensitivity of colorimetric behavior to ammonia(within 3 min).These results suggest GA/CS/CURⅡnanofibers has great potential as a multifunctional packaging to protect and monitor the freshness of proteinrich animal foods,such as meat and seafood.展开更多
Background: Patients with dementia who accidentally swallowed a press- through package (PTP) have been increased in recent years. Swallowed PTP is usually detected with CT having a risk of radiation exposure since PTP...Background: Patients with dementia who accidentally swallowed a press- through package (PTP) have been increased in recent years. Swallowed PTP is usually detected with CT having a risk of radiation exposure since PTP is very difficult to detect with abdominal X-ray image. Purpose: This study is aimed at developing the new PTP sheet recognizable with abdominal X-ray by improving the conventional PTP sheet. Material and Methods: The PTP sheet samples used in this study are: No. 1 Control: Commercially available tablet 100 mg, No. 2 Triple-stacked aluminum foil, 6-overcoated with BaSO4 10.3 g/m2, No. 3 Aluminum foil, 6-overcoated with BaSO4 10.3 g/m2, No. 4 Five-stacked aluminum foil, 6-overcoated with BaSO4 No. 5 Aluminum foil, single-coated with WO3 2.55 g/m2, No. 6 Aluminum foil, double-coated with WO3 5.1 g/m2, No. 7 Aluminum foil, triple-coated with WO3 7.66 g/m2, No. 8 Three-stacked aluminum foil, triple-coated with WO3. PTP sheets (No. 1 - No. 8) were placed inside the abdominal soft tissue phantom, and the images were obtained using FUJIFILM DR CALNEO PT. Region of interest (ROI) was placed on PTP sheets (No. 1 - No. 8) and abdominal soft tissue liquid phantom, and each contrast was measured from the average pixel of the two ROIs. Contrast was calculated by the calculation formula. Each ROI was measured three times, and their average value and standard deviation were estimated. Results: Statistical significance in contrast was not observed in commercial PTP sheet (No. 1), PTP sheet (No. 3), and PTP sheet (No. 5), while there was a significant difference between PTP sheet (No. 1) and PTP sheet (No. 2), PTP sheet (No. 4) PTP sheet (No. 6), PTP sheet (No. 7) (p Conclusion: The other all prototype PTP sheets (No. 2, No. 4, No. 6, No. 7 and No. 8) were well recognized. PTP sheets (No. 2, No. 4) of BaSO4 is considered to be more suitable than PTP sheets of WO3 (No. 6, No. 7, No. 8) because it is easier to produce. We will develop oral PTP sheets for patients with dementia for abdominal X-ray in the future.展开更多
基金supported by Research Fund for the Doctoral Program of Higher Education of China(Grant No.20060614021)Sichuan Provincial Fundamental Research of China(Grant No.2008JY0057),Fundamental Research Funds for the Central Universities of China(Grant No.ZYGX2009J091)
文摘Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
文摘The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.
基金supported by Distinguished Youth Talent Program of Fujian Agriculture and Forestry University(xjq201912)the National Natural Science Foundation of China(31801616)+1 种基金Scientific Research Foundation of Hainan Tropical Ocean University(RHDRC202117)Excellent Master Thesis Fund Project of Fujian Agriculture and Forestry University(1122YS01002)。
文摘Recently,food grade nanofiber-based materials have received growing attentions in food packaging.In this work,novel active and intelligent packaging nanofibers based on gelatin/chitosan with curcumin(GA/CS/CUR)were developed via electrospinning technique.Effects of the incorporation of CUR content(0.1%-0.3%,m/m)on the microstructure and functional properties of the electrospun nanofibers were investigated.Morphological studies using scanning electron microscopy indicated that loading CUR can affect the average diameter of nanofiber mats,which remained around 160-180 nm.The addition of an appropriate level CUR(0.2%,m/m)led to a stronger intermolecular interaction,and thus enhanced the thermal stability and tensile strength of the obtained nanofibers.Meanwhile,the incorporation of CUR significantly improved antioxidant activity and the antimicrobial activity of GA/CS/CUR nanofibers.Moreover,the sensitivity of nanofibers to ammonia results indicated that GA/CS nanofibers containing 0.2%CUR(GA/CS/CURⅡ)presented high sensitivity of colorimetric behavior to ammonia(within 3 min).These results suggest GA/CS/CURⅡnanofibers has great potential as a multifunctional packaging to protect and monitor the freshness of proteinrich animal foods,such as meat and seafood.
文摘Background: Patients with dementia who accidentally swallowed a press- through package (PTP) have been increased in recent years. Swallowed PTP is usually detected with CT having a risk of radiation exposure since PTP is very difficult to detect with abdominal X-ray image. Purpose: This study is aimed at developing the new PTP sheet recognizable with abdominal X-ray by improving the conventional PTP sheet. Material and Methods: The PTP sheet samples used in this study are: No. 1 Control: Commercially available tablet 100 mg, No. 2 Triple-stacked aluminum foil, 6-overcoated with BaSO4 10.3 g/m2, No. 3 Aluminum foil, 6-overcoated with BaSO4 10.3 g/m2, No. 4 Five-stacked aluminum foil, 6-overcoated with BaSO4 No. 5 Aluminum foil, single-coated with WO3 2.55 g/m2, No. 6 Aluminum foil, double-coated with WO3 5.1 g/m2, No. 7 Aluminum foil, triple-coated with WO3 7.66 g/m2, No. 8 Three-stacked aluminum foil, triple-coated with WO3. PTP sheets (No. 1 - No. 8) were placed inside the abdominal soft tissue phantom, and the images were obtained using FUJIFILM DR CALNEO PT. Region of interest (ROI) was placed on PTP sheets (No. 1 - No. 8) and abdominal soft tissue liquid phantom, and each contrast was measured from the average pixel of the two ROIs. Contrast was calculated by the calculation formula. Each ROI was measured three times, and their average value and standard deviation were estimated. Results: Statistical significance in contrast was not observed in commercial PTP sheet (No. 1), PTP sheet (No. 3), and PTP sheet (No. 5), while there was a significant difference between PTP sheet (No. 1) and PTP sheet (No. 2), PTP sheet (No. 4) PTP sheet (No. 6), PTP sheet (No. 7) (p Conclusion: The other all prototype PTP sheets (No. 2, No. 4, No. 6, No. 7 and No. 8) were well recognized. PTP sheets (No. 2, No. 4) of BaSO4 is considered to be more suitable than PTP sheets of WO3 (No. 6, No. 7, No. 8) because it is easier to produce. We will develop oral PTP sheets for patients with dementia for abdominal X-ray in the future.
