Radiation damage produced in 4H-SiC by electrons of different doses is presented by using multiple characterization techniques. Raman spectra results indicate that SiC crystal structures are essentially impervious to ...Radiation damage produced in 4H-SiC by electrons of different doses is presented by using multiple characterization techniques. Raman spectra results indicate that SiC crystal structures are essentially impervious to 10 Me V electron irradiation with doses up to 3000 kGy. However, irradiation indeed leads to the generation of various defects, which are evaluated through photoluminescence(PL) and deep level transient spectroscopy(DLTS). The PL spectra feature a prominent broad band centered at 500 nm, accompanied by several smaller peaks ranging from 660 to 808 nm. The intensity of each PL peak demonstrates a linear correlation with the irradiation dose, indicating a proportional increase in defect concentration during irradiation. The DLTS spectra reveal several thermally unstable and stable defects that exhibit similarities at low irradiation doses.Notably, after irradiating at the higher dose of 1000 kGy, a new stable defect labeled as R_(2)(Ec-0.51 eV) appeared after annealing at 800 K. Furthermore, the impact of irradiation-induced defects on SiC junction barrier Schottky diodes is discussed. It is observed that high-dose electron irradiation converts SiC n-epilayers to semi-insulating layers. However, subjecting the samples to a temperature of only 800 K results in a significant reduction in resistance due to the annealing out of unstable defects.展开更多
高阻断电压、大功率密度、高转化效率是电力电子器件技术持续追求的目标,基于4H-SiC优异的材料特性,在电力电子器件应用方面具有广阔的发展前景。围绕SiC MOSFET器件对外延材料的需求,介绍了国内外主流的SiC外延设备及国产SiC衬底的发展...高阻断电压、大功率密度、高转化效率是电力电子器件技术持续追求的目标,基于4H-SiC优异的材料特性,在电力电子器件应用方面具有广阔的发展前景。围绕SiC MOSFET器件对外延材料的需求,介绍了国内外主流的SiC外延设备及国产SiC衬底的发展,并重点介绍了宽禁带半导体电力电子器件国家重点实验室在国产150 mm(6英寸)SiC衬底上的高速外延技术进展。通过关键技术攻关,实现了150 mm SiC外延材料表面缺陷密度≤0.5 cm-2,BPD缺陷密度≤0.1 cm-2,片内掺杂浓度不均匀性≤5%,片内厚度不均匀性≤1%。基于自主外延材料,实现了650~1200 V SiC MOSFET产品商业化以及6.5~15 kV高压SiC MOSFET器件的产品定型。展开更多
A new scintillating fiber detector inside magnetic shielding tube was designed and assembled for use in the next round of fusion experiments in the experimental advanced superconducting tokamak to provide D–T neutron...A new scintillating fiber detector inside magnetic shielding tube was designed and assembled for use in the next round of fusion experiments in the experimental advanced superconducting tokamak to provide D–T neutron yield with time resolution.In this study,Geant4 simulations were used to obtain the pulse height spectra for ideal signals produced when detecting neutrons and gamma rays of multiple energies.One of the main sources of interference was found to be low-energy neutrons below 10–5 MeV,which can generate numerous secondary particles in the detector components,such as the magnetic shielding tube,leading to high-amplitude output signals.To address this issue,a compact thermal neutron shield containing a 1-mm Cd layer outside the magnetic shielding tube and a 5-mm inner Pb layer was specifically designed.Adverse effects on the measurement of fast neutrons and the shielding effect on gamma rays were considered.This can suppress the height of the signals caused by thermal neutrons to a level below the height corresponding to neutrons above 4 MeV because the yield of the latter is used for detector calibration.In addition,the detector has relatively flat sensitivity curves in the fast neutron region,with the intrinsic detection efficiencies(IDEs)of approximately 40%.For gamma rays with energies that are not too high(<8 MeV),the IDEs of the detector are only approximately 20%,whereas for gamma rays below 1 MeV,the response curve cuts off earlier in the low-energy region,which is beneficial for avoiding counting saturation and signal accumulation.展开更多
The high-temperature performance of 4H-SiC ultraviolet avalanche photodiodes(APDs)in both linear and Geiger modes is extensively investigated.During the temperature-dependent measurements,a fixed bias voltage is adopt...The high-temperature performance of 4H-SiC ultraviolet avalanche photodiodes(APDs)in both linear and Geiger modes is extensively investigated.During the temperature-dependent measurements,a fixed bias voltage is adopted for the device samples,which is much more practical and important for high-temperature applications.The results show that the fabricated 4H-SiC APDs are very stable and reliable at high temperatures.As the temperature increases from room temperature to 425 K,the dark current at 95%of the breakdown voltage increases slightly and remains lower than40 pA.In Geiger mode,our 4H-SiC APDs can be self-quenched in a passive-quenching circuit,which is expected for highspeed detection systems.Moreover,an interesting phenomenon is observed for the first time:the single-photon detection efficiency shows a non-monotonic variation as a function of temperature.The physical mechanism of the variation in hightemperature performance is further analyzed.The results in this work can provide a fundamental reference for researchers in the field of 4H-SiC APD ultraviolet detectors.展开更多
Thermal oxidation and hydrogen annealing were applied on a 100μm thick Al-doped p-type 4H-Si C epitaxial wafer to modulate the minority carrier lifetime,which was investigated by microwave photoconductive decay(μ-PC...Thermal oxidation and hydrogen annealing were applied on a 100μm thick Al-doped p-type 4H-Si C epitaxial wafer to modulate the minority carrier lifetime,which was investigated by microwave photoconductive decay(μ-PCD).The minority carrier lifetime decreased after each thermal oxidation.On the contrary,with the hydrogen annealing time increasing to3 hours,the minority carrier lifetime increased from 1.1μs(as-grown)to 3.14μs and then saturated after the annealing time reached 4 hours.The increase of surface roughness from 0.236 nm to 0.316 nm may also be one of the reasons for limiting the further improvement of the minority carrier lifetimes.Moreover,the whole wafer mappings of minority carrier lifetimes before and after hydrogen annealing were measured and discussed.The average minority carrier lifetime was up to 1.94μs and non-uniformity of carrier lifetime reached 38%after 4-hour hydrogen annealing.The increasing minority carrier lifetimes could be attributed to the double mechanisms of excess carbon atoms diffusion caused by selective etching of Si atoms and passivation of deep-level defects by hydrogen atoms.展开更多
A silicon (Si)/silicon carbide (4H-SiC) heterojunction double-trench metal-oxide-semiconductor field effect transistor (MOSFET) (HDT-MOS) with the gate-controlled tunneling effect is proposed for the first time based ...A silicon (Si)/silicon carbide (4H-SiC) heterojunction double-trench metal-oxide-semiconductor field effect transistor (MOSFET) (HDT-MOS) with the gate-controlled tunneling effect is proposed for the first time based on simulations. In this structure, the channel regions are made of Si to take advantage of its high channel mobility and carrier density. The voltage-withstanding region is made of 4H-SiC so that HDT-MOS has a high breakdown voltage (BV) similar to pure 4H-SiC double-trench MOSFETs (DT-MOSs). The gate-controlled tunneling effect indicates that the gate voltage (V_(G)) has a remarkable influence on the tunneling current of the heterojunction. The accumulation layer formed with positive VG can reduce the width of the Si/SiC heterointerface barrier, similar to the heavily doped region in an Ohmic contact. This narrower barrier is easier for electrons to tunnel through, resulting in a lower heterointerface resistance. Thus, with similar BV (approximately 1770 V), the specific on-state resistance (R_(ON-SP)) of HDT-MOS is reduced by 0.77 mΩ·cm^(2) compared with that of DT-MOS. The gate-to-drain charge (Q_(GD)) and switching loss of HDT-MOS are 52.14% and 22.59% lower than those of DT-MOS, respectively, due to the lower gate platform voltage (V_(GP)) and the corresponding smaller variation (ΔV_(GP)). The figure of merit (Q_(GD)×R_(ON-SP)) of HDT-MOS decreases by 61.25%. Moreover, the heterointerface charges can reduce RON-SP of HDT-MOS due to trap-assisted tunneling while the heterointerface traps show the opposite effect. Therefore, the HDT-MOS structure can significantly reduce the working loss of SiC MOSFET, leading to a lower temperature rise when the devices are applied in the system.展开更多
High-k materials as an alternative dielectric layer for SiC power devices have the potential to reduce interfacial state defects and improve MOS channel conduction capability.Besides,under identical conditions of gate...High-k materials as an alternative dielectric layer for SiC power devices have the potential to reduce interfacial state defects and improve MOS channel conduction capability.Besides,under identical conditions of gate oxide thickness and gate voltage,the high-k dielectric enables a greater charge accumulation in the channel region,resulting in a larger number of free electrons available for conduction.However,the lower energy band gap of high-k materials leads to significant leakage currents at the interface with Si C,which greatly affects device reliability.By inserting a layer of SiO_(2)between the high-k material and Si C,the interfacial barrier can be effectively widened and hence the leakage current will be reduced.In this study,the optimal thickness of the intercalated SiO_(2)was determined by investigating and analyzing the gate dielectric breakdown voltage and interfacial defects of a dielectric stack composed of atomic-layer-deposited Al_(2)O_(3)layer and thermally nitride SiO_(2).Current-voltage and high-frequency capacitance-voltage measurements were performed on metal-oxide-semiconductor test structures with 35 nm thick Al_(2)O_(3)stacked on 1 nm,2 nm,3 nm,6 nm,or 9 nm thick nitride SiO_(2).Measurement results indicated that the current conducted through the oxides was affected by the thickness of the nitride oxide and the applied electric field.Finally,a saturation thickness of stacked SiO_(2)that contributed to dielectric breakdown and interfacial band offsets was identified.The findings in this paper provide a guideline for the SiC gate dielectric stack design with the breakdown strength and the interfacial state defects considered.展开更多
In this paper,we propose a near-infrared p-type β-FeSi2/n-type 4H-SiC heterojunction photodetector with semiconducting silicide（β-FeSi2） as the active region for the first time.The optoelectronic characteristics o...In this paper,we propose a near-infrared p-type β-FeSi2/n-type 4H-SiC heterojunction photodetector with semiconducting silicide（β-FeSi2） as the active region for the first time.The optoelectronic characteristics of the photodetector are simulated using a commercial simulator at room temperature.The results show that the photodetector has a good rectifying character and a good response to near-infrared light.Interface states should be minimized to obtain a lower reverse leakage current.The response spectrum of the β-FeSi2/4H-SiC detector,which consists of a p-type β-FeSi2 absorption layer with a doping concentration of 1×1015cm-3 and a thickness of 2.5 μm,has a peak of 755 mA/W at 1.42 μm.The illumination of the SiC side obtains a higher responsivity than that of the β-FeSi2 side.The results illustrate that the β-FeSi2/4H-SiC heterojunction can be used as a near-infrared photodetector compatible with near-infrared optically-activated SiC-based power switching devices.展开更多
基金supported by the Open Fund(2022E10015)of the Key Laboratory of Power Semiconductor Materials and Devices of Zhejiang Province&Institute of Advanced Semiconductors,ZJU-Hangzhou Global Scientific and Technological Innovation Center。
文摘Radiation damage produced in 4H-SiC by electrons of different doses is presented by using multiple characterization techniques. Raman spectra results indicate that SiC crystal structures are essentially impervious to 10 Me V electron irradiation with doses up to 3000 kGy. However, irradiation indeed leads to the generation of various defects, which are evaluated through photoluminescence(PL) and deep level transient spectroscopy(DLTS). The PL spectra feature a prominent broad band centered at 500 nm, accompanied by several smaller peaks ranging from 660 to 808 nm. The intensity of each PL peak demonstrates a linear correlation with the irradiation dose, indicating a proportional increase in defect concentration during irradiation. The DLTS spectra reveal several thermally unstable and stable defects that exhibit similarities at low irradiation doses.Notably, after irradiating at the higher dose of 1000 kGy, a new stable defect labeled as R_(2)(Ec-0.51 eV) appeared after annealing at 800 K. Furthermore, the impact of irradiation-induced defects on SiC junction barrier Schottky diodes is discussed. It is observed that high-dose electron irradiation converts SiC n-epilayers to semi-insulating layers. However, subjecting the samples to a temperature of only 800 K results in a significant reduction in resistance due to the annealing out of unstable defects.
文摘高阻断电压、大功率密度、高转化效率是电力电子器件技术持续追求的目标,基于4H-SiC优异的材料特性,在电力电子器件应用方面具有广阔的发展前景。围绕SiC MOSFET器件对外延材料的需求,介绍了国内外主流的SiC外延设备及国产SiC衬底的发展,并重点介绍了宽禁带半导体电力电子器件国家重点实验室在国产150 mm(6英寸)SiC衬底上的高速外延技术进展。通过关键技术攻关,实现了150 mm SiC外延材料表面缺陷密度≤0.5 cm-2,BPD缺陷密度≤0.1 cm-2,片内掺杂浓度不均匀性≤5%,片内厚度不均匀性≤1%。基于自主外延材料,实现了650~1200 V SiC MOSFET产品商业化以及6.5~15 kV高压SiC MOSFET器件的产品定型。
基金supported by the University Synergy Innovation Program of Anhui Province(No.GXXT-2022-001)the Institute of Energy,Hefei Comprehensive National Science Center(Anhui Energy Laboratory)under Grant No.21KZS205 and 21KZL401the Comprehensive Research Facility for Fusion Technology Program of China(No.2018-000052-73-01-001228).
文摘A new scintillating fiber detector inside magnetic shielding tube was designed and assembled for use in the next round of fusion experiments in the experimental advanced superconducting tokamak to provide D–T neutron yield with time resolution.In this study,Geant4 simulations were used to obtain the pulse height spectra for ideal signals produced when detecting neutrons and gamma rays of multiple energies.One of the main sources of interference was found to be low-energy neutrons below 10–5 MeV,which can generate numerous secondary particles in the detector components,such as the magnetic shielding tube,leading to high-amplitude output signals.To address this issue,a compact thermal neutron shield containing a 1-mm Cd layer outside the magnetic shielding tube and a 5-mm inner Pb layer was specifically designed.Adverse effects on the measurement of fast neutrons and the shielding effect on gamma rays were considered.This can suppress the height of the signals caused by thermal neutrons to a level below the height corresponding to neutrons above 4 MeV because the yield of the latter is used for detector calibration.In addition,the detector has relatively flat sensitivity curves in the fast neutron region,with the intrinsic detection efficiencies(IDEs)of approximately 40%.For gamma rays with energies that are not too high(<8 MeV),the IDEs of the detector are only approximately 20%,whereas for gamma rays below 1 MeV,the response curve cuts off earlier in the low-energy region,which is beneficial for avoiding counting saturation and signal accumulation.
基金the National Natural Science Foundation of China(Grant No.61974134)Hebei Province Outstanding Youth Fund(Grant No.F2021516001).
文摘The high-temperature performance of 4H-SiC ultraviolet avalanche photodiodes(APDs)in both linear and Geiger modes is extensively investigated.During the temperature-dependent measurements,a fixed bias voltage is adopted for the device samples,which is much more practical and important for high-temperature applications.The results show that the fabricated 4H-SiC APDs are very stable and reliable at high temperatures.As the temperature increases from room temperature to 425 K,the dark current at 95%of the breakdown voltage increases slightly and remains lower than40 pA.In Geiger mode,our 4H-SiC APDs can be self-quenched in a passive-quenching circuit,which is expected for highspeed detection systems.Moreover,an interesting phenomenon is observed for the first time:the single-photon detection efficiency shows a non-monotonic variation as a function of temperature.The physical mechanism of the variation in hightemperature performance is further analyzed.The results in this work can provide a fundamental reference for researchers in the field of 4H-SiC APD ultraviolet detectors.
基金Project supported by Key Area Research and Development Project of Guangdong Province,China(Grant No.2020B010170002)the Science Challenge Project(Grant No.TZ2018003-1-101)+4 种基金the Natural Science Foundation of Fujian Province of China for Distinguished Young Scholars(Grant No.2020J06002)the Science and Technology Project of Fujian Province of China(Grant No.2020I0001)the Fundamental Research Funds for the Central Universities(Grant Nos.20720190049 and 20720190053)the Science and Technology Key Projects of Xiamen(Grant No.3502ZCQ20191001)the National Natural Science Foundation of China(Grant No.51871189)。
文摘Thermal oxidation and hydrogen annealing were applied on a 100μm thick Al-doped p-type 4H-Si C epitaxial wafer to modulate the minority carrier lifetime,which was investigated by microwave photoconductive decay(μ-PCD).The minority carrier lifetime decreased after each thermal oxidation.On the contrary,with the hydrogen annealing time increasing to3 hours,the minority carrier lifetime increased from 1.1μs(as-grown)to 3.14μs and then saturated after the annealing time reached 4 hours.The increase of surface roughness from 0.236 nm to 0.316 nm may also be one of the reasons for limiting the further improvement of the minority carrier lifetimes.Moreover,the whole wafer mappings of minority carrier lifetimes before and after hydrogen annealing were measured and discussed.The average minority carrier lifetime was up to 1.94μs and non-uniformity of carrier lifetime reached 38%after 4-hour hydrogen annealing.The increasing minority carrier lifetimes could be attributed to the double mechanisms of excess carbon atoms diffusion caused by selective etching of Si atoms and passivation of deep-level defects by hydrogen atoms.
基金the Major Science and Technology Program of Anhui Province under Grant No.2020b05050007.
文摘A silicon (Si)/silicon carbide (4H-SiC) heterojunction double-trench metal-oxide-semiconductor field effect transistor (MOSFET) (HDT-MOS) with the gate-controlled tunneling effect is proposed for the first time based on simulations. In this structure, the channel regions are made of Si to take advantage of its high channel mobility and carrier density. The voltage-withstanding region is made of 4H-SiC so that HDT-MOS has a high breakdown voltage (BV) similar to pure 4H-SiC double-trench MOSFETs (DT-MOSs). The gate-controlled tunneling effect indicates that the gate voltage (V_(G)) has a remarkable influence on the tunneling current of the heterojunction. The accumulation layer formed with positive VG can reduce the width of the Si/SiC heterointerface barrier, similar to the heavily doped region in an Ohmic contact. This narrower barrier is easier for electrons to tunnel through, resulting in a lower heterointerface resistance. Thus, with similar BV (approximately 1770 V), the specific on-state resistance (R_(ON-SP)) of HDT-MOS is reduced by 0.77 mΩ·cm^(2) compared with that of DT-MOS. The gate-to-drain charge (Q_(GD)) and switching loss of HDT-MOS are 52.14% and 22.59% lower than those of DT-MOS, respectively, due to the lower gate platform voltage (V_(GP)) and the corresponding smaller variation (ΔV_(GP)). The figure of merit (Q_(GD)×R_(ON-SP)) of HDT-MOS decreases by 61.25%. Moreover, the heterointerface charges can reduce RON-SP of HDT-MOS due to trap-assisted tunneling while the heterointerface traps show the opposite effect. Therefore, the HDT-MOS structure can significantly reduce the working loss of SiC MOSFET, leading to a lower temperature rise when the devices are applied in the system.
基金Project supported by the Key Area Research and Development Program of Guangdong Province of China(Grant No.2021B0101300005)the National Key Research and Development Program of China(Grant No.2021YFB3401603)。
文摘High-k materials as an alternative dielectric layer for SiC power devices have the potential to reduce interfacial state defects and improve MOS channel conduction capability.Besides,under identical conditions of gate oxide thickness and gate voltage,the high-k dielectric enables a greater charge accumulation in the channel region,resulting in a larger number of free electrons available for conduction.However,the lower energy band gap of high-k materials leads to significant leakage currents at the interface with Si C,which greatly affects device reliability.By inserting a layer of SiO_(2)between the high-k material and Si C,the interfacial barrier can be effectively widened and hence the leakage current will be reduced.In this study,the optimal thickness of the intercalated SiO_(2)was determined by investigating and analyzing the gate dielectric breakdown voltage and interfacial defects of a dielectric stack composed of atomic-layer-deposited Al_(2)O_(3)layer and thermally nitride SiO_(2).Current-voltage and high-frequency capacitance-voltage measurements were performed on metal-oxide-semiconductor test structures with 35 nm thick Al_(2)O_(3)stacked on 1 nm,2 nm,3 nm,6 nm,or 9 nm thick nitride SiO_(2).Measurement results indicated that the current conducted through the oxides was affected by the thickness of the nitride oxide and the applied electric field.Finally,a saturation thickness of stacked SiO_(2)that contributed to dielectric breakdown and interfacial band offsets was identified.The findings in this paper provide a guideline for the SiC gate dielectric stack design with the breakdown strength and the interfacial state defects considered.
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 60876050 and 51177134)
文摘In this paper,we propose a near-infrared p-type β-FeSi2/n-type 4H-SiC heterojunction photodetector with semiconducting silicide（β-FeSi2） as the active region for the first time.The optoelectronic characteristics of the photodetector are simulated using a commercial simulator at room temperature.The results show that the photodetector has a good rectifying character and a good response to near-infrared light.Interface states should be minimized to obtain a lower reverse leakage current.The response spectrum of the β-FeSi2/4H-SiC detector,which consists of a p-type β-FeSi2 absorption layer with a doping concentration of 1×1015cm-3 and a thickness of 2.5 μm,has a peak of 755 mA/W at 1.42 μm.The illumination of the SiC side obtains a higher responsivity than that of the β-FeSi2 side.The results illustrate that the β-FeSi2/4H-SiC heterojunction can be used as a near-infrared photodetector compatible with near-infrared optically-activated SiC-based power switching devices.
