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5×××合金双级均匀化热处理工艺研究及工业化验证 被引量:1
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作者 赵志文 《铝加工》 CAS 2019年第3期44-47,共4页
通过DSC分析测试,初步制定了5×××合金双级均匀化热处理工艺,开展不同温度下的均热处理方案,并进行组织分析对比,验证了双级均匀化热处理工艺的有效性,然后采用制定的均热工艺开展了工业化试制和铸锭的解剖分析。实验结... 通过DSC分析测试,初步制定了5×××合金双级均匀化热处理工艺,开展不同温度下的均热处理方案,并进行组织分析对比,验证了双级均匀化热处理工艺的有效性,然后采用制定的均热工艺开展了工业化试制和铸锭的解剖分析。实验结果表明,该工艺能够保证5×××铝合金大规格铸锭从表层到心部均取得理想的均匀化效果。 展开更多
关键词 5×××合金 双级 均匀化退火 低熔点相
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5×××系铝合金的研究进展 被引量:55
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作者 唐明君 吉泽升 吕新宇 《轻合金加工技术》 CAS 2004年第7期1-7,23,共8页
全面论述了 5×××系铝合金中微量添加元素Ce、Er、Sc、Zr等对合金微观组织与拉伸性能的影响 ,Fe、Si、Na、H等杂质元素产生的危害。阐述了 5×××合金半连续铸造的熔体净化、在线精炼、晶粒细化技术。简介了... 全面论述了 5×××系铝合金中微量添加元素Ce、Er、Sc、Zr等对合金微观组织与拉伸性能的影响 ,Fe、Si、Na、H等杂质元素产生的危害。阐述了 5×××合金半连续铸造的熔体净化、在线精炼、晶粒细化技术。简介了 5×××系铝合金的塑性加工方法、热处理种类及制定热处理制度的依据。探讨了其耐蚀性能、焊接性能、拉深性能、表面氧化性能及其存在的问题和发展趋势等。 展开更多
关键词 5×××合金 合金 铸造 塑性加工 热处理
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浅析模具因素对某5×××铝合金挤压型材组织条纹的影响 被引量:2
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作者 许栩达 蒋春丽 +1 位作者 黄志其 陈慧 《铝加工》 CAS 2017年第6期45-50,共6页
铝合金挤压组织条纹区别于表面机械纹路,是由于合金内部微观组织结构发生变化而产生的规则或不规则纹路,经表面处理(如碱蚀、化学抛光)后显露。通过分析某5×××系铝合金生产过程中组织条纹缺陷产生的原因,介绍了通过模具... 铝合金挤压组织条纹区别于表面机械纹路,是由于合金内部微观组织结构发生变化而产生的规则或不规则纹路,经表面处理(如碱蚀、化学抛光)后显露。通过分析某5×××系铝合金生产过程中组织条纹缺陷产生的原因,介绍了通过模具设计优化及维护的方法,达到预防控制组织条纹产生的目的。 展开更多
关键词 组织条纹 表面处理 5×××合金 模具设计
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Dumb-bell Structures of Nonstoichiometric La(Ni, Sn)_(5+x) Alloys and Their Relationships with the Preparation Methods
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作者 YUANZhi-Qing LUGuang-Lie +1 位作者 WEIFan-Song LEIYong-Quan 《Chinese Journal of Structural Chemistry》 SCIE CAS CSCD 北大核心 2004年第5期520-524,共5页
Crystal structures of nonstoichiometric La(Ni, Sn)5+x (x = 0.1~0.4) alloys prepared by different methods were investigated by using powder X-ray diffraction and Rietveld refinement analysis. Space group of this type ... Crystal structures of nonstoichiometric La(Ni, Sn)5+x (x = 0.1~0.4) alloys prepared by different methods were investigated by using powder X-ray diffraction and Rietveld refinement analysis. Space group of this type of alloys belongs to P6/mmm, in which Sn only occupies the 3g sites. It has been demonstrated that some of the 1a sites of the nonstoichiometric alloy are replaced by the NiNi dumb-bells which have a strong correlation with the anisotropic thermal parameter B33. The preparation methods have an effect on the number of dumb-bells that can substitute the 1a sites. It was found that the annealed alloys have more NiNi dumb-bells in the structure than the rapid solidified and as-cast alloys have while still keep good crystallinity. 展开更多
关键词 nonstoichiometric alloy rapid solidified alloy crystallographic structure Rietveld refinement
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Microcalorimetric study on host-guest complexation of naphtho-15-crown-5 with four ions of alkaline earth metal 被引量:1
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作者 宋明芝 朱兰英 +2 位作者 高希柯 窦建民 孙德志 《Journal of Zhejiang University-Science B(Biomedicine & Biotechnology)》 SCIE EI CAS CSCD 2005年第1期69-73,共5页
Thermodynamic parameters of complexation of naphto- 15-crown-5 with four alkaline earth ions in aqueous media was determined using titration microcalorimetry at 298.15 K. The stability of the complexes, thermal effect... Thermodynamic parameters of complexation of naphto- 15-crown-5 with four alkaline earth ions in aqueous media was determined using titration microcalorimetry at 298.15 K. The stability of the complexes, thermal effect and entropy effect of the complexation is discussed on the basis of the guest ions structure and the solvent effect. The stability constants tendency to vary with ion radius was interpreted. Complex of naphtha-15-crown-5 with calcium ion is very stable due to the synergism of static electric interaction and size selectivity between the host and the guest. 展开更多
关键词 MICROCALORIMETRY Host-guest complexation Naphtho-15-crown-5 Alkaline earth metal Molecular recognition
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Effects of Ag contents in Sn-xAg lead-free solders on microstructure,corrosion behavior and interfacial reaction with Cu substrate 被引量:18
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作者 Phacharaphon TUNTHAWIROON Kannachai KANLAYASIRI 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2019年第8期1696-1704,共9页
The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn-xAg lead-free solders,and on the formation of intermetallic layer of the solders with Cu substrate were investigated.The Ag contents(x... The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn-xAg lead-free solders,and on the formation of intermetallic layer of the solders with Cu substrate were investigated.The Ag contents(x)were 0,3.0,3.5,4.0,and5.0 wt.%.The Ag content played a role in the morphology of Ag3 Sn phase in the solders.The microstructure analysis showed that theβ-Sn phase was surrounded by eutectic networks in the 3.0 Ag and 3.5 Ag solders and large plate-like Ag3 Sn formed in the 4.0 Ag and5.0 Ag solders.Nonetheless,the Ag content slightly impacted the corrosion behavior of the as-cast solders as characterized using potentiodynamic polarization test.After soldering,only a single layer of a Cu6 Sn5 intermetallic compound formed at the Sn-xAg/Cu interface.By comparison,the Cu6 Sn5 intermetallic layer of the Ag-doped solders was thinner than that of the 0Ag solder.The fine Ag3 Sn particles in the eutectic networks precipitating in the 3.0 Ag and 3.5 Ag solders effectively hindered the growth of Cu6 Sn5 grains compared to large plate-like Ag3 Sn in the 4.0 and 5.0Ag solders. 展开更多
关键词 Sn-Ag lead-free solders MICROSTRUCTURE Ag_(3)Sn intermetallic phase corrosion behavior Cu_(6)Sn_(5) intermetallic layer wettability
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