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Multifactor roadmap for designing low-power-consumed micro thermoelectric thermostats in a closed-loop integrated 5G optical module
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作者 Dongwang Yang Yubing Xing +10 位作者 Jiang Wang Kai Hu Yani Xiao Kechen Tang Jianan Lyu Junhao Li Yutian Liu Peng Zhou Yuan Yu Yonggao Yan Xinfeng Tang 《Interdisciplinary Materials》 EI 2024年第2期326-337,共12页
As the core components of fifth-generation(5G)communication technology,optical modules should be consistently miniaturized in size while improving their level of integration.This inevitably leads to a dramatic spike i... As the core components of fifth-generation(5G)communication technology,optical modules should be consistently miniaturized in size while improving their level of integration.This inevitably leads to a dramatic spike in power consumption and a consequent increase in heat flow density when operating in a confined space.To ensure a successful start-up and operation of 5G optical modules,active cooling and precise temperature control via the Peltier effect in confined space is essential yet challenging.In this work,p-type Bi_(0.5)Sb_(1.5)Te_(3)and n-type Bi_(2)Te_(2.7)Se_(0.3)bulk thermoelectric(TE)materials are used,and a micro thermoelectric thermostat(micro-TET)(device size,2×9.3×1.1mm^(3);leg size,0.4×0.4×0.5mm^(3);number of legs,44)is successfully integrated into a 5G optical module with Quad Small Form Pluggable 28 interface.As a result,the internal temperature of this kind of optical module is always maintained at 45.7°C and the optical power is up to 7.4 dBm.Furthermore,a multifactor design roadmap is created based on a 3D numerical model using the ANSYS finite element method,taking into account the number of legs(N),leg width(W),leg length(L),filling atmosphere,electric contact resistance(Rec),thermal contact resistance(Rtc),ambient temperature(Ta),and the heat generated by the laser source(QL).It facilitates the integrated fabrication of micro-TET,and shows the way to enhance packaging and performance under different operating conditions.According to the roadmap,the micro-TET(2×9.3×1mm^(3),W=0.3 mm,L=0.4 mm,N=68 legs)is fabricated and consumes only 0.89W in cooling mode(Q_(L)=0.7W,T_(a)=80℃)and 0.36Win heating mode(T_(a)=0℃)to maintain the laser temperature of 50℃.This research will hopefully be applied to other microprocessors for precise temperature control and integrated manufacturing. 展开更多
关键词 5g optical module finite element simulation micro thermoelectric thermostat Peltier effect
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A Survey: Several Technologies of Non-Orthogonal Transmission for 5G 被引量:33
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作者 TAO Yunzheng LIU Long +1 位作者 LIU Shang ZHANG Zhi 《China Communications》 SCIE CSCD 2015年第10期1-15,共15页
One key advantage of 4G OFDM system is the relatively simple receiver implementation due to the orthogonal resource allocation.However,from sum-capacity and spectral efficiency points of view,orthogonal systems are ne... One key advantage of 4G OFDM system is the relatively simple receiver implementation due to the orthogonal resource allocation.However,from sum-capacity and spectral efficiency points of view,orthogonal systems are never the achieving schemes.With the rapid development of mobile communication systems,a novel concept of non-orthogonal transmission for 5G mobile communications has attracted researches all around the world.In this trend,many new multiple access schemes and waveform modulation technologies were proposed.In this paper,some promising ones of them were discussed which include Non-orthogonal Multiple Access(NOMA),Sparse Code Multiple Access(SCMA),Multi-user Shared Access(MUSA),Pattern Division Multiple Access(PDMA)and some main new waveforms including Filter-bank based Multicarrier(FBMC),Universal Filtered Multi-Carrier(UFMC),Generalized Frequency Division Multiplexing(GFDM).By analyzing and comparing features of these technologies,a research direction of guiding on future 5G multiple access and waveform are given. 展开更多
关键词 non-orthogonal transmission multiple access waveform modulation sur-vey 5g
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