Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of ...Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was refowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.展开更多
Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the s...Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.展开更多
Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys a...Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite soldered joints and 63Sn37Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37Pb eutectic soldered joint.展开更多
文摘Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was refowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.
基金This study is financially supported by the Foundation of Henan University of Science & Technology(No.13420060) Luoyang Advanced Hydraulic Pressure Technology Ltd. ( 6142004).
文摘Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.
文摘Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite soldered joints and 63Sn37Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37Pb eutectic soldered joint.
