Anand模型预测63Sn37Pb焊锡钎料的应力应变行为

通过在温度 3 13K～ 3 98K、应变率 10 - 3% s～ 10 % s内的一系列恒应变率拉伸实验 ,研究 63Sn3 7Pb焊锡钎料的力学行为 ,发现该材料的应力应变关系与温度和应变率有很大的相关性。采用统一型Anand粘塑性本构方程对该材料在较大温度和应变率范围内的应力应变行为进行数值模拟。结果表明Anand粘塑性方程可以有效地描述 63Sn3 7Pb焊锡钎料在 10 %应变下的温度和应变率相关粘塑性本构行为。

63Sn37Pb钎料的高温单轴变形行为

在323,353和373K温度下,对63Sn37Pb钎料合金分别进行单轴应变控制的系统循环试验,揭示和分析循环应变率、应变幅值、加载波形、保持时间、平均应变及其历史对材料高温循环特性的影响以及应力保持时间及其历史对高温蠕变效应的影响。研究表明,无论是单轴应变循环特性还是蠕变效应不但依赖于当前温度和加载状态,而且依赖于其加载历史。

Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints

Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.

The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints

Creep property of solder alloys is one of the important factors to affect the reliabdity of soldered joints in SMT （surface mount technology）. Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37 Pb based composite soldered joints and 63Sn37 Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37 Pb eutectic soldered joint.

球化温度对BGA钎焊球质量的影响

钎焊球是BGA及μBGA等高密封装技术中凸点制作关键材料。球化温度是影响钎焊球质量关键因素。本文采用切丝重熔法制作钎焊球,研究了球化温度对63Sn37Pb钎焊球真球度和外观质量的影响。结果表明:在一定球化温度范围内,钎焊球的真球度和表面质量均随着球化温度的升高而变好,但温度接近球化剂沸点时,真球度有所下降。

预热温度对BGA钎焊球质量影响

钎焊球是BGA及BGA等高密封装技术中凸点制作关键材料。预热温度是影响钎焊球质量关键因素。本文采用切丝重熔法制作钎焊球,研究了预热温度对63Sn37Pb钎焊球真球度和外观质量的影响。结果表明:在实验条件下,随着预热温度升高,钎焊球真球度逐渐升高,表观质量逐渐变好。当预热温度500℃～600℃时,钎焊球真球度和外观质量变化不明显。从使用角度出发,预热温度稍大于500℃为宜。