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Effect of Cu additions on interdiffusion behavior in the Al-Zn solid solution
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作者 任玉平 郝士明 《材料与冶金学报》 CAS 2005年第2期163-166,共4页
After diffusion couples were annealed at 260-360 ℃, the concentration profiles of Zn element were measured by EPMA. It has been first quantitatively determined by Matano method that the interdiffusion coefficient in ... After diffusion couples were annealed at 260-360 ℃, the concentration profiles of Zn element were measured by EPMA. It has been first quantitatively determined by Matano method that the interdiffusion coefficient in A1-Zn fee solid solution containing high Zn contents is remarkably decreased due to the small addition of Cu. Also, the interdiffusion coefficient in A1-Zn fee solid solution clearly increases with the increasing of Zn concentration. The interdiffusion activity energy remarkably decreases with the increasing of Zn contents. On the other hand, the interdiffusion activity energy markedly increases due to the small addition of Cu in the A1 Zn fcc solid solution containing high Zn contents. 展开更多
关键词 CU a1-zn固溶体 扩散行为 活化能
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