In this study, the physics-based device simulation tool Silvaco ATLAS is used to characterize the electrical properties of an AlGaN/GaN high electron mobility transistor （HEMT） with a U-type gate foot. The U-gate Al...In this study, the physics-based device simulation tool Silvaco ATLAS is used to characterize the electrical properties of an AlGaN/GaN high electron mobility transistor （HEMT） with a U-type gate foot. The U-gate AlGaN/GaN HEMT mainly features a gradually changed sidewall angle, which effectively mitigates the electric field in the channel, thus obtaining enhanced off-state breakdown characteristics. At the same time, only a small additional gate capacitance and decreased gate resistance ensure excellent RF characteristics for the U-gate device. U-gate AlGaN/GaN HEMTs are feasible through adjusting the etching conditions of an inductively coupled plasma system, without introducing any extra process steps. The simulation results are confirmed by experimental measurements. These features indicate that U-gate A1GaN/GaN HEMTs might be promising candidates for use in millimeter-wave power applications.展开更多
The development of an AIGaN/GaN HEMT power MMIC on SI-SiC designed in microstrip technology is pres- ented. A recessed-gate and a field-plate are used in the device processing to improve the performance of the AIGaN/G...The development of an AIGaN/GaN HEMT power MMIC on SI-SiC designed in microstrip technology is pres- ented. A recessed-gate and a field-plate are used in the device processing to improve the performance of the AIGaN/GaN HEMTs. S-parameter measurements show that the frequency performance of the AIGaN/GaN HEMTs depends significantly on the operating voltage. Higher operating voltage is a key to higher power gain for the AIGaN/GaN HEMTs. The developed 2-stage power MMIC delivers an output power of more than 10W with over 12dB power gain across the band of 9-11GHz at a drain bias of 30V. Peak output power inside the band reaches 14.7W with a power gain of 13.7dB and a PAE of 23%. The MMIC chip size is only 2.0mm × 1. 1mm. This work shows superiority over previously reported X-band AIGaN/GaN HEMT power MMICs in output power per millimeter gate width and output power per unit chip size.展开更多
基金Project supported by the Major Program of the National Natural Science Foundation of China （Grant No. 60890191） and the National Key Basic Research Program of China （Grant No. 2010CB327503）.
文摘In this study, the physics-based device simulation tool Silvaco ATLAS is used to characterize the electrical properties of an AlGaN/GaN high electron mobility transistor （HEMT） with a U-type gate foot. The U-gate AlGaN/GaN HEMT mainly features a gradually changed sidewall angle, which effectively mitigates the electric field in the channel, thus obtaining enhanced off-state breakdown characteristics. At the same time, only a small additional gate capacitance and decreased gate resistance ensure excellent RF characteristics for the U-gate device. U-gate AlGaN/GaN HEMTs are feasible through adjusting the etching conditions of an inductively coupled plasma system, without introducing any extra process steps. The simulation results are confirmed by experimental measurements. These features indicate that U-gate A1GaN/GaN HEMTs might be promising candidates for use in millimeter-wave power applications.
文摘The development of an AIGaN/GaN HEMT power MMIC on SI-SiC designed in microstrip technology is pres- ented. A recessed-gate and a field-plate are used in the device processing to improve the performance of the AIGaN/GaN HEMTs. S-parameter measurements show that the frequency performance of the AIGaN/GaN HEMTs depends significantly on the operating voltage. Higher operating voltage is a key to higher power gain for the AIGaN/GaN HEMTs. The developed 2-stage power MMIC delivers an output power of more than 10W with over 12dB power gain across the band of 9-11GHz at a drain bias of 30V. Peak output power inside the band reaches 14.7W with a power gain of 13.7dB and a PAE of 23%. The MMIC chip size is only 2.0mm × 1. 1mm. This work shows superiority over previously reported X-band AIGaN/GaN HEMT power MMICs in output power per millimeter gate width and output power per unit chip size.
