Electron transport properties in AlGaN/GaN heterostructures with different Al-contents have been in-vestigated from room temperature up to 680 K. The temperature dependencies of electron mobility have been systematica...Electron transport properties in AlGaN/GaN heterostructures with different Al-contents have been in-vestigated from room temperature up to 680 K. The temperature dependencies of electron mobility have been systematically measured for the samples. The electron mobility at 680 K were measured as 154 and 182 cm2/V.s for Al0.15Ga0.85N/GaN and Al0.40Ga0.60N/GaN heterostructures,respectively. It was found that the electron mobility of low Al-content Al0.15Ga0.85N/GaN heterostructure was less than that of high Al-content Al0.40Ga0.60N/GaN heterostructure at high temperature of 680 K,which is different from that at room temperature. Detailed analysis showed that electron occupations in the first subband were 75% and 82% at 700 K for Al0.15Ga0.85N/GaN and Al0.40Ga0.60N/GaN heterostructures,respectively,and the two dimensional gas (2DEG) ratios in the whole electron system were 30% and near 60%,respectively. That indicated the 2DEG was better confined in the well,and was still dominant in the whole electron system for higher Al-content AlGaN/GaN heterostructure at 700 K,while lower one was not. Thus it had a higher electron mobility. So a higher Al-content AlGaN/GaN heterostructure is more suitable for high-temperature applications.展开更多
Electrical properties of an AIlnN/GaN high-electron mobility transistor （HEMT） on a sapphire substrate are investigated in a cryogenic temperature range from 295 K down to 50 K. It is shown that drain saturation cur...Electrical properties of an AIlnN/GaN high-electron mobility transistor （HEMT） on a sapphire substrate are investigated in a cryogenic temperature range from 295 K down to 50 K. It is shown that drain saturation current and conductance increase as transistor operation temperature decreases. A self-heating effect is observed over the entire range of temperature under high power consumption. The dependence of channel electron mobility on electron density is investigated in detail. It is found that aside from Coulomb scattering, electrons that have been pushed away from the AIInN/GaN interface into the bulk GaN substrate at a large reverse gate voltage are also responsible for the electron mobility drop with the decrease of electron density.展开更多
文摘Electron transport properties in AlGaN/GaN heterostructures with different Al-contents have been in-vestigated from room temperature up to 680 K. The temperature dependencies of electron mobility have been systematically measured for the samples. The electron mobility at 680 K were measured as 154 and 182 cm2/V.s for Al0.15Ga0.85N/GaN and Al0.40Ga0.60N/GaN heterostructures,respectively. It was found that the electron mobility of low Al-content Al0.15Ga0.85N/GaN heterostructure was less than that of high Al-content Al0.40Ga0.60N/GaN heterostructure at high temperature of 680 K,which is different from that at room temperature. Detailed analysis showed that electron occupations in the first subband were 75% and 82% at 700 K for Al0.15Ga0.85N/GaN and Al0.40Ga0.60N/GaN heterostructures,respectively,and the two dimensional gas (2DEG) ratios in the whole electron system were 30% and near 60%,respectively. That indicated the 2DEG was better confined in the well,and was still dominant in the whole electron system for higher Al-content AlGaN/GaN heterostructure at 700 K,while lower one was not. Thus it had a higher electron mobility. So a higher Al-content AlGaN/GaN heterostructure is more suitable for high-temperature applications.
基金Project supported by the National Natural Science Foundation of China (Grant No. 61204018)
文摘Electrical properties of an AIlnN/GaN high-electron mobility transistor （HEMT） on a sapphire substrate are investigated in a cryogenic temperature range from 295 K down to 50 K. It is shown that drain saturation current and conductance increase as transistor operation temperature decreases. A self-heating effect is observed over the entire range of temperature under high power consumption. The dependence of channel electron mobility on electron density is investigated in detail. It is found that aside from Coulomb scattering, electrons that have been pushed away from the AIInN/GaN interface into the bulk GaN substrate at a large reverse gate voltage are also responsible for the electron mobility drop with the decrease of electron density.
