The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting s...The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed.The SiC particles are evenly distributed in the coating and enveloped with Ni.No reaction layer is observed at the coating/SiCp/Al composite interfaces.The contact angle increases from^19°with the Ni-P coating to 29°,43°and 113°with the corresponding Ni-P-3SiC,Ni-P-6SiC and Ni-P-9SiC coatings,respectively.An interaction layer containing Cu,Ni,Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces,and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer.Moreover,the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC)coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate.展开更多
The Ag(Invar)composite powder prepared by ball milling was used to fabricate the Cu/Ag(Invar)composites.Microstructures and properties of the composites were studied after sintering and thermo-mechanical treatment.The...The Ag(Invar)composite powder prepared by ball milling was used to fabricate the Cu/Ag(Invar)composites.Microstructures and properties of the composites were studied after sintering and thermo-mechanical treatment.The results indicatethat during ball milling,micro-forging weld and work-hardening fracture result in that the average particle size of the Ag(Invar)powder increases rapidly at first,and then decreases sharply,finally tends to be constant.Compared with the Cu/Invar ones,thesinterability of the composites is greatly improved,resulting in that the pores in them are smaller in amount and size.After thethermo-mechanical treatment,the Cu/Ag(Invar)composites are nearly fully dense with the optimum phase composition and elementdistribution.More importantly,Cu and the Invar alloy in the composites distribute continuously in a three-dimensional(3D)networkstructure.Cu/Invar interface diffusion is effectively inhibited by the Ag barrier layer,leading to a great improvement of themechanical and thermal properties of the Cu/Ag(Invar)composites.展开更多
基金Projects(51572112,51401034)supported by the National Natural Science Foundation of ChinaProject(BK20151340)supported by the Natural Science Foundation of Jiangsu Province,China+3 种基金Projects(2014-XCL-002,TD-XCL-004)supported by the Six Talent Peaks Project of Jiangsu Province,ChinaProject(BRA2017387)supported by the 333 Talents Project of Jiangsu Province,ChinaProject([2015]26)supported by the Innovation/Entrepreneurship Program of Jiangsu Province,ChinaProject([2016]15)supported by the Qing Lan Project,China
文摘The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed.The SiC particles are evenly distributed in the coating and enveloped with Ni.No reaction layer is observed at the coating/SiCp/Al composite interfaces.The contact angle increases from^19°with the Ni-P coating to 29°,43°and 113°with the corresponding Ni-P-3SiC,Ni-P-6SiC and Ni-P-9SiC coatings,respectively.An interaction layer containing Cu,Ni,Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces,and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer.Moreover,the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC)coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate.
基金Project(2014DFA50860) supported by the International Science&Technology Cooperation Program of China
文摘The Ag(Invar)composite powder prepared by ball milling was used to fabricate the Cu/Ag(Invar)composites.Microstructures and properties of the composites were studied after sintering and thermo-mechanical treatment.The results indicatethat during ball milling,micro-forging weld and work-hardening fracture result in that the average particle size of the Ag(Invar)powder increases rapidly at first,and then decreases sharply,finally tends to be constant.Compared with the Cu/Invar ones,thesinterability of the composites is greatly improved,resulting in that the pores in them are smaller in amount and size.After thethermo-mechanical treatment,the Cu/Ag(Invar)composites are nearly fully dense with the optimum phase composition and elementdistribution.More importantly,Cu and the Invar alloy in the composites distribute continuously in a three-dimensional(3D)networkstructure.Cu/Invar interface diffusion is effectively inhibited by the Ag barrier layer,leading to a great improvement of themechanical and thermal properties of the Cu/Ag(Invar)composites.
