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Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag-Cu-In-Ti alloy 被引量:9
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作者 Yan LIU Yunzhou ZHU +2 位作者 Yong YANG Xuejian LIU Zhengren HUANG 《Journal of Advanced Ceramics》 SCIE CAS 2014年第1期71-75,共5页
The SiC/SiC joints were vacuum brazed at 700℃,740℃,780℃and 800℃for 10 min respectively,using Ag-Cu-In-Ti active filler alloy.The microstructure and joining strength of the joints were characterized by electron pro... The SiC/SiC joints were vacuum brazed at 700℃,740℃,780℃and 800℃for 10 min respectively,using Ag-Cu-In-Ti active filler alloy.The microstructure and joining strength of the joints were characterized by electron probe X-ray microanalyser(EPMA),energy dispersive spectroscopy(EDS),transmission electron microscopy(TEM)and four-point bending strength test.The interface of the joints was composed of three parts:SiC substrate,reaction layer and filler alloy.A representative microstructure of the reaction layer:In-containing layer/TiC layer/Ti5Si3 layer was found from the TEM image.The forming of the In-containing layer could be attributed to the crack or delamination of SiC/TiC interface.The In-containing layer intensified the coefficient of thermal expansion(CTE)mismatch of SiC and the reaction layer,and affected the joining strength.With the increase of the reaction layer’s thickness,the joining strength firstly increased,then declined,and the maximum four-point bending strength reached 234 MPa. 展开更多
关键词 ag-cu-in-ti SiC/SiC joints reaction layer MICROSTRUCTURE joining strength
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采用两种银基活性钎料钎焊AlN陶瓷与可伐合金的接头组织与性能 被引量:7
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作者 朱成俊 李成思 董雪花 《焊接学报》 EI CAS CSCD 北大核心 2018年第10期16-19,40,129,共6页
采用Ag-Cu-Ti和Ag-Cu-In-Ti两种活性钎料箔带,分别在860℃/10 min和760℃/10 min两种规范下对AlN与可伐合金(4J29)进行了真空钎焊连接,获得了冶金质量良好的接头.对接头室温抗剪强度进行了测试,AlN/Ag-Cu-Ti/4J29和AlN/Ag-Cu-In-Ti/4J2... 采用Ag-Cu-Ti和Ag-Cu-In-Ti两种活性钎料箔带,分别在860℃/10 min和760℃/10 min两种规范下对AlN与可伐合金(4J29)进行了真空钎焊连接,获得了冶金质量良好的接头.对接头室温抗剪强度进行了测试,AlN/Ag-Cu-Ti/4J29和AlN/Ag-Cu-In-Ti/4J29两种接头强度分别为126和113 MPa.微观分析结果表明,两种接头中靠近陶瓷母材附近生成了连续的扩散反应层,结合XRD结果,该层主要由TiN相组成,反应层的厚度对接头强度有影响;钎缝基体区由铜基固溶体、银基固溶体和复杂的Ni(Fe,Co)-Ti化合物组成. 展开更多
关键词 ALN陶瓷 AG-CU-TI ag-cu-in-ti 真空钎焊
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含In银基钎料连接紫铜和Al2O3陶瓷的组织及性能分析 被引量:1
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作者 刘雨 许祥平 王锡岭 《热加工工艺》 北大核心 2021年第5期42-45,共4页
使用Ag-Cu-In-Ti钎料真空钎焊连接Al2O3陶瓷和紫铜。采用扫描电镜(SEM)和能谱仪(EDS)研究了紫铜/Ag-Cu-In-Ti/Cu/Ag-Cu-In-Ti/Al2O3陶瓷接头的微观组织结构,采用四点弯曲试验研究了钎焊温度和是否添加中间层Cu箔对接头力学性能的影响。... 使用Ag-Cu-In-Ti钎料真空钎焊连接Al2O3陶瓷和紫铜。采用扫描电镜(SEM)和能谱仪(EDS)研究了紫铜/Ag-Cu-In-Ti/Cu/Ag-Cu-In-Ti/Al2O3陶瓷接头的微观组织结构,采用四点弯曲试验研究了钎焊温度和是否添加中间层Cu箔对接头力学性能的影响。结果表明,添加中间层的钎焊接头可能的界面组织结构是紫铜/Ag-Cu+Ag(s,s)+Cu(s,s)/Cu Ti2O+Ti Al/Al2O3陶瓷。无论添加中间层与否,接头的弯曲强度均随钎焊温度的升高先上升后降低。未添加中间层的接头强度在800℃时达到最大值35 MPa,中间层的加入可以显著提高钎焊焊缝的厚度和接头的强度,并在800℃时达到最高强度101 MPa。 展开更多
关键词 ag-cu-in-ti钎料 中间层 界面组织 弯曲强度
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