This study investigated the morphologies of the intermetallic compounds(IMC)formed during soldering reaction between Sn_(1.0)Ag_(0.7)Cu-1.0SnO_(2) composite solder and Cu substrate at various temperatures.The prismtyp...This study investigated the morphologies of the intermetallic compounds(IMC)formed during soldering reaction between Sn_(1.0)Ag_(0.7)Cu-1.0SnO_(2) composite solder and Cu substrate at various temperatures.The prismtype Cu_(6)Sn_(5) forms when the soldering temperature is 260or 2800C,while those grains transform from prism type to scallop type at the temperatures of 300 and 320℃.It can be found that the morphologies of Cu6Sn5 grains affect adsorption of Ag_(3)Sn nanoparticles during soldering reaction.The scallop-type grains with a higher growth rate need to adsorb large amounts of Ag_(3)Sn particles.In terms of mechanical behavior,the shear strength of solder joint is improved from 40 to 46 MPa at soldering temperature of 300℃.In addition,the thickness of IMC increases with the extension of aging time.During aging,the morphology of Cu6Sn5 grains remains scallop type,but the number of Ag_(3)Sn nanoparticles is reduced largely.The scallop-type Cu^(6)Sn_(5) can increase in size and flatten in morphology with the aging time increasing.展开更多
基金supported by the Fundamental Research Funds for the Central Universities(2017XKQY007)。
文摘This study investigated the morphologies of the intermetallic compounds(IMC)formed during soldering reaction between Sn_(1.0)Ag_(0.7)Cu-1.0SnO_(2) composite solder and Cu substrate at various temperatures.The prismtype Cu_(6)Sn_(5) forms when the soldering temperature is 260or 2800C,while those grains transform from prism type to scallop type at the temperatures of 300 and 320℃.It can be found that the morphologies of Cu6Sn5 grains affect adsorption of Ag_(3)Sn nanoparticles during soldering reaction.The scallop-type grains with a higher growth rate need to adsorb large amounts of Ag_(3)Sn particles.In terms of mechanical behavior,the shear strength of solder joint is improved from 40 to 46 MPa at soldering temperature of 300℃.In addition,the thickness of IMC increases with the extension of aging time.During aging,the morphology of Cu6Sn5 grains remains scallop type,but the number of Ag_(3)Sn nanoparticles is reduced largely.The scallop-type Cu^(6)Sn_(5) can increase in size and flatten in morphology with the aging time increasing.
