The hot deformation behaviors and microstructures of A1-Zn-Mg-Cu-Cr aluminum alloy have been studied using thermal simulation test, optical microscopy and transmission electron microscopy. As a result, the true stress...The hot deformation behaviors and microstructures of A1-Zn-Mg-Cu-Cr aluminum alloy have been studied using thermal simulation test, optical microscopy and transmission electron microscopy. As a result, the true stress versus true strain curves and the microstructures under various deformation conditions are obtained. The microstructures gradually incline to dynamic-recrystallization with the deformation temperature rising and the recrystallization grains refine with the decrease of deformation temperature or with raising the strain rates. The quantitative relationship between the Zener-Hollomon parameter （Z） and average recrystallization grain size in the subsequent heat treatment is set up.展开更多
In order to join alumina ceramic to 5A05 aluminum alloy and obtain the excellent airtightness of joints whose maximum service temperature is 623 K, transient liquid phase （TLP） bonding technique was ,investigated us...In order to join alumina ceramic to 5A05 aluminum alloy and obtain the excellent airtightness of joints whose maximum service temperature is 623 K, transient liquid phase （TLP） bonding technique was ,investigated using Ag-Cu-Ti alloy as interlayer. The wetting experimental results confirm that Ti can react with alumina ceramic at 833 K by adding 2 wt.% Ti in Sn. But during bonding alumina ceramic and 5A05 aluminum alloy with Ag-Cu-Ti interlayer at 833 K, Ti preferentially reacts with Al and there is no reaction layer on alumina ceramic/Ag-Cu-Ti interface, which finally results in a poorly airtight joint.展开更多
采用显微组织观察、扫描电镜及能谱分析、透射电镜分析、DSC热差分析、JMat Pro 5.0软件计算和室温力学性能测试,对低频电磁铸造新型高强Al-Mg-Si-Cu合金铸态、挤压态和T6态的组织与力学性能进行研究,获得该合金的最佳Cu含量。结果表明...采用显微组织观察、扫描电镜及能谱分析、透射电镜分析、DSC热差分析、JMat Pro 5.0软件计算和室温力学性能测试,对低频电磁铸造新型高强Al-Mg-Si-Cu合金铸态、挤压态和T6态的组织与力学性能进行研究,获得该合金的最佳Cu含量。结果表明,Cu含量的变化对该合金过烧温度影响很小,不同含Cu量的该类合金进行均匀化处理和固溶处理时温度可相同。Cu在该合金铸态组织中除了形成球状AlMgSiCu相外,含Cu相还可与其他相结合形成球状共晶组织。Cu对合金再结晶行为的影响很小。随Cu含量的增加,合金T6态试样中Q'析出强化相的数量增加,同时该合金挤压棒材T6态试样的强度和伸长率也增加。在限定的元素含量范围内,提高Cu含量至1.0 mass%,合金的强韧性可达到最佳状态。展开更多
AA7085 aluminum alloys with different Cu/Mg ratios （0.67, 1.0, 1.06, 1.6） were prepared by ingot metallurgy method. The effects of Cu/Mg ratio on the microstructure, mechanical properties and corrosion behavior of t...AA7085 aluminum alloys with different Cu/Mg ratios （0.67, 1.0, 1.06, 1.6） were prepared by ingot metallurgy method. The effects of Cu/Mg ratio on the microstructure, mechanical properties and corrosion behavior of the AA7085 alloys were investigated by optical microscope, scanning electron microscope （SEM）, mechanical properties and corrosion testing. The results indicate that a better recrystallization inhibition and corrosion resistance can be achieved when Cu/Mg ratio is 1.6. When Cu/Mg ratio is 0.67, the alloy reveals better mechanical properties, and the tensile strength and yield strength of AA7085 alloys are 586 and 550 MPa, respectively. Moreover, both the mechanical properties and corrosion resistance of the alloy are reduced when Cu/Mg ratio is equal to 1.0.展开更多
文摘The hot deformation behaviors and microstructures of A1-Zn-Mg-Cu-Cr aluminum alloy have been studied using thermal simulation test, optical microscopy and transmission electron microscopy. As a result, the true stress versus true strain curves and the microstructures under various deformation conditions are obtained. The microstructures gradually incline to dynamic-recrystallization with the deformation temperature rising and the recrystallization grains refine with the decrease of deformation temperature or with raising the strain rates. The quantitative relationship between the Zener-Hollomon parameter （Z） and average recrystallization grain size in the subsequent heat treatment is set up.
基金This work was supported by the National Natural Science Foundation of China （ No. 50705022）.
文摘In order to join alumina ceramic to 5A05 aluminum alloy and obtain the excellent airtightness of joints whose maximum service temperature is 623 K, transient liquid phase （TLP） bonding technique was ,investigated using Ag-Cu-Ti alloy as interlayer. The wetting experimental results confirm that Ti can react with alumina ceramic at 833 K by adding 2 wt.% Ti in Sn. But during bonding alumina ceramic and 5A05 aluminum alloy with Ag-Cu-Ti interlayer at 833 K, Ti preferentially reacts with Al and there is no reaction layer on alumina ceramic/Ag-Cu-Ti interface, which finally results in a poorly airtight joint.
文摘采用显微组织观察、扫描电镜及能谱分析、透射电镜分析、DSC热差分析、JMat Pro 5.0软件计算和室温力学性能测试,对低频电磁铸造新型高强Al-Mg-Si-Cu合金铸态、挤压态和T6态的组织与力学性能进行研究,获得该合金的最佳Cu含量。结果表明,Cu含量的变化对该合金过烧温度影响很小,不同含Cu量的该类合金进行均匀化处理和固溶处理时温度可相同。Cu在该合金铸态组织中除了形成球状AlMgSiCu相外,含Cu相还可与其他相结合形成球状共晶组织。Cu对合金再结晶行为的影响很小。随Cu含量的增加,合金T6态试样中Q'析出强化相的数量增加,同时该合金挤压棒材T6态试样的强度和伸长率也增加。在限定的元素含量范围内,提高Cu含量至1.0 mass%,合金的强韧性可达到最佳状态。
基金Projects(51271152,51021063)supported by the National Natural Science Foundation of ChinaProject(13JJ6006)supported by Hunan Provincial Natural Science Foundation,ChinaProject(2012CB619502)supported by National Basic Research Program of China
文摘AA7085 aluminum alloys with different Cu/Mg ratios （0.67, 1.0, 1.06, 1.6） were prepared by ingot metallurgy method. The effects of Cu/Mg ratio on the microstructure, mechanical properties and corrosion behavior of the AA7085 alloys were investigated by optical microscope, scanning electron microscope （SEM）, mechanical properties and corrosion testing. The results indicate that a better recrystallization inhibition and corrosion resistance can be achieved when Cu/Mg ratio is 1.6. When Cu/Mg ratio is 0.67, the alloy reveals better mechanical properties, and the tensile strength and yield strength of AA7085 alloys are 586 and 550 MPa, respectively. Moreover, both the mechanical properties and corrosion resistance of the alloy are reduced when Cu/Mg ratio is equal to 1.0.
