Effects of diamond particle size on microstructure and properties of diamond/Al-12Si composites prepared by vacuum-assisted pressure infiltration

Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size.

Microstructure and properties of Al/Si/SiC composites for electronic packaging

The Al/Si/SiC composites with medium volume fraction for electronic packaging were fabricated by gas pressure infiltration.On the premise of keeping the machinability of the composites,the silicon carbide particles,which have the similar size with silicon particles（average 13 μm）,were added to replace silicon particles of same volume fraction,and microstructure and properties of the composites were investigated.The results show that reinforcing particles are distributed uniformly and no apparent pores are observed in the composites.It is also observed that higher thermal conductivity（TC） and flexural strength will be obtained with the addition of SiC particles.Meanwhile,coefficient of thermal expansion（CTE） changes smaller than TC.Models for predicting thermal properties were also discussed.Equivalent effective conductivity（EEC） was proposed to make H-J model suitable for hybrid particles and multimodal particle size distribution.

Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy

The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe（Ni,Co） in the composites is reduced, because a-Fe（Ni,Co） partly transfers into y-Fe（Ni,Co） through the diffusion of the Ni atoms into a-Fe（Ni,Co） from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/（m.K） （as-tested） and a CTE of 10.79× 10-6/K （20-100 ℃）.

Laser-weldable Si_p-SiC_p/Al hybrid composites with bilayer structure for electronic packaging

Laser-weldable Sip-SiCp/Al hybrid composites with high volume fraction （60%-65%） of SiC reinforcement were fabricated by compression moulding and vacuum gas pressure infiltration technology. Microscopic observation displayed that the Sip-SiCp/Al hybrid composites with bilayer structure were compact without gas pores and the intergradation between Sip/Al layer and SiCp/Al layer was homogeneous and continuous. Further investigation revealed that the Sip-SiCp/Al hybrid composites possessed low density （2.96 g/cm^3）, high gas tightness （1.0 mPa·cm^3）/s）, excellent thermal management function as a result of high thermal conductivity （194 W/（m·K） and low coefficient of thermal expansion （7.0×10^-6 K-1）. Additionally, Sip-SiCp/Al hybrid composites had outstanding laser welding adaptability, which is significantly important for electronic packaging applications. The gas tightness of components after laser welding （48 mPa·cm^3）/s） can well match the requirement of advanced electronic packaging. Several kinds of these precision components passed tests and were put into production.

Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

Diamond/Cu-xCr composites were fabricated by pressure infiltration process.The thermal conductivities of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were above 650 W/mK,higher than that of diamond/Cu composites.The tensile strengths ranged from 186 to 225 MPa,and the bonding strengths ranged from 400 to 525 MPa.Influences of Cr element on the thermo-physical properties and interface structures were analyzed.The intermediate layer was confirmed as Cr3C2 and the amount of Cr3C2 increased with the increase of Cr concentration in Cu-xCr alloys.When the Cr concentration was up to 0.5 wt.%,the content of the Cr3C2 layer was constant.As the thickness of the Cr3C2 layer became larger,the composites showed a lower thermal conductivity but higher mechanical properties.The coefficients of thermal expansion（CTE） of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were in good agreement with the predictions of the Kerner＇ model.

Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites

To fabricate electronic packaging shell of coppermatrix composite with characteristics of high ther mal conductivity and low thermal expansion coefficient, semisolid forming technology, and powder metallurgy was combined. Conventional mechanical mixing of Cu and SiC could have insufficient wettability, and a new method of semisolid processing was introduced for billets preparation. The SiC/Cu composites were first prepared by PM, and then, semisolid reheating was performed for the successive semisolid forging. Composite billets with SiC 35 % vol ume fraction were compacted and sintered pressurelessly, microstructure analysis showed that the composites pre pared by PM had high density, and the combination between SiC particles and Cualloy was good. Semisolid reheating was the crucial factor in determining the micro structure and thixotropic property of the billet. An opti mised reheating strategy was proposed： temperature 1,025 ℃and holding time 5 min.

Outstanding Impact Resistance of Post-Consumer HDPE/Multilayer Packaging Composites

New recycling alternative for multilayer films was successfully presented. Food packaging formed from different materials is difficult to recycle. The use of aluminum, glass, paper, paints, varnishes, and other materials in the rolling processes from plastic packaging is intended to optimize the efficiency of packaging. Nevertheless, these materials prevent the recycling of packaging because they become contaminants to the recycling process. Food multilayered packaging containing poly (ethylene terephthalate) PET, poly (ethylene) PE and aluminum was used as filler in the preparation of composites with post-consumer high density polyethylene matrix. Composites containing up to 50 wt% of filler were feasible to prepare, allowing the obtention of a material with varied mechanical and thermal properties. This feature allows the preparation of composites suitable for specific application. The addition of multilayer matter in the polyethylene matrix provided a material with excellent mechanical properties such as higher tensile impact strength (148 J/m) and elasticity (350 MPa) as compared to pure polyethylene (40 J/m and 450 MPa).

The Packaging Materials with Carbon Nanotube/Polymer Composites

A polymer-based carbon nano-tubes (CNTs) composite with high electromagnetic (EM) wave shielding effectiveness (SE) and with high mechanical property is developed for packaging of electronic modulus or devices.The liquid crystal polymers (LCP) and melamine formaldehydes (MF) polymer are used to study the orientation effect of CNTs in various polymeric matrix.The influences of orientation,aspect ratio,and mass fraction of CNTs upon the shielding effectiveness (SE) of CNTs-composites are investigated.The higher the orientation,aspect ratio,and weight percentages of nano-materials are, the higher the SE of the carbon composites.The highest SE for the CNTs/LCP nano composite obtained is more than 62 dB. This results may lead to the developing for CPU IC chip packaging.

Numerical simulation on thixoforging of electronic packaging shell with SiC_p/A356 composites

Based on the research of modem electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process of thixo-extrusion with SiCp/A356 composites was simulated by the finite element software DEFORM-3D, then the flow velocity field, equivalent strain field and temperature field were analyzed. The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation. The results show that thixo-forming technology can be used in producing electronic package shell with SiCp/A356 composites, and high volume fraction of SiCp with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials.

Research on Silicon Carbide Dispersion-Reinforced Hypereutectic Aluminum-Silicon Electronic Packaging Materials

The objective of this study is to improve the mechanical properties and machining performance of high thermal conductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon electronic packaging materials to meet the needs of aviation,aerospace,and electronic packaging fields.We used the powder metallurgy method and high-temperature hot pressing technology to prepare SiC/Al-Si composite materials with different SiC contents(5vol%,10vol%,15vol%,and 20vol%).The results showed that as the SiC content increased,the tensile strength of the composite material first increased and then decreased.The tensile strength was the highest when the SiC content was 15%;the sintering temperature significantly affected the composite material’s structural density and mechanical properties.Findings indicated 700℃was the optimal sintering and the optimal SiC content of SiC/Al-Si composite materials was between 10%and 15%.Besides,the sintering temperature should be strictly controlled to improve the material’s structural density and mechanical properties.

Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming

The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.

Microstructure and electric properties of Si_p/Al composites for electronic packaging applications

Sip/1199,Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure,particle volume fraction,particle size,matrix alloy and heat treatment on the electrical properties of composites were discussed,and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy,the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same particle content,the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Particle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results.

Fabrication and properties of Si/Al interpenetrating phase composites for electronic packaging

In order to improve the thermal properties of MMCs for electronic packaging,the concept of fabrication MMCs with particular interpenetrating phases(IPCs) was proposed. Based on the diffusion theory of reinforcement element in matrix alloys of some particular PMMCs,a novel fabrication method to produce IPCs was proposed. The Si/Al composites(65%Si,volume fraction) with interpenetrating phases were fabricated successfully by squeeze casting and hot press sintering technology. Microstructure observations indicate that the reinforcements Si are of three-dimensional continuous network and the composites are compact without obvious defects. The average linear thermal expansion coefficient(CTE) between 20 ℃ and 100 ℃ of the Si/Al IPCs is 8.27×10-6/K,and the thermal conductivity(TC) is 124.03 W/(m·K),and the composites can meet the demands of electronic packaging. ROM model and Turner model can be used to predict the CTEs of IPCs,and the experimental CTEs are between their theoretical and calculated values.

Thermal expansion and mechanical properties of high reinforcement content SiC_(p)/Cu composites fabricated by squeeze casting technology

High reinforcement content SiCp/Cu composites (φp=50%, 55% and 60%) for electronic packaging applications were fabricated by patent cost-effective squeeze-casting technology. The composites appear to be free of pores, and the SiC particles are distribute uniformly in the composites. The mean linear coefficients of thermal expansion (CTEs, 20-100 ℃ ) of as-cast SiCp/Cu composites range from 8.8×10-6 ℃-1 to 9.9×10-6 ℃-1 and decrease with the increase of SiC content. The experimental CTEs of as-cast SiCp/Cu composites agree well with the predicted values based on Kerner model. The CTEs of composites reduce after annealing treatment due to the fact that the internal stress of the composite is released. The Brinell hardness increases from 272.3 to 313.2, and the modulus increases from 186 GPa to 210 GPa for the corresponding composites. The bending strength is larger than 374 MPa, but no obvious trend between bending strength and SiCp content is observed.

Microstructure and properties of high-fraction graphite nanoflakes/6061Al matrix composites fabricated via spark plasma sintering

30-50 wt.%graphite nanoflakes(GNFs)/6061Al matrix composites were fabricated via spark plasma sintering(SPS)at 610℃.The effects of the sintering pressure and GNF content on the microstructure and properties of the composites were investigated.The results indicated that interfacial reactions were inhibited during SPS because no Al4C3 was detected.Moreover,the agglomeration of the GNFs increased,and the distribution orientation of the GNFs decreased with increasing the GNF content.The relative density,bending strength,and coefficient of thermal expansion(CTE)of the composites decreased,while the thermal conductivity(TC)in the X−Y direction increased.As the sintering pressure increased,the GNFs deagglomerated and were distributed preferentially in the X−Y direction,which increased the relative density,bending strength and TC,and decreased the CTE of the composites.The 50wt.%GNFs/6061Al matrix composite sintered at 610℃ under 55 MPa demonstrated the best performance,i.e.,bending strength of 72 MPa,TC and CTE(RT−100℃)of 254 W/(m·K)and 8.5×10^(−6)K^(−1)in the X−Y direction,and 55 W/(m·K)and 9.7×10^(−6)K^(−1)in the Z direction,respectively.

Conceptual Design and Selection of Natural Fibre Reinforced Biopolymer Composite (NFBC) Takeout Food Container

Biopolymer composite has gained huge attention for its beneficial properties such as biodegradable and less impact to the environment.This consequently would diminish the dependency on the petroleum-based polymer.Abundance of studies have been done on the development and characterization of biopolymer composite materials for food packaging application,but work on the conceptual design of biopolymer composite packaging product is hardly found.Using the Kano Model,Quality Function Deployment for Environment(QFDE),morphological map,and Analytic Hierarchy Method(AHP)framework combination,this paper presents the conceptual design of a natural fibre reinforced biopolymer composites take-out food container.To understand customer satisfaction with the current use of takeout food containers,the Kano model was applied,and the findings were integrated into QFDE.The highest weight of voices of customer and environment(VOCE)as the solution parameters for the design characteristics were later refined using the aid of morphological chart(MC)to systematically develop conceptual designs.Lastly,AHP was utilized to pick the final concept design.The concept design with the highest score(8.3%)was chosen as the final conceptual design.

Infiltration kinetics of pressureless infiltration in SiC_p/Al composites

The pressureless infiltration kinetics was investigated by plotting the infiltration distance as function of the infiltration time. The effects of key process parameters such as time, temperature, Mg content on the pressureless infiltration of silicon carbide particle compacts were studied and quantified. The preform with high volume fraction SiC was obtained by mixing SiC particles with bimodal size distribution, whose diameters are 5 and 50 μm, respectively. The results show that an incubation period exists before infiltration, the influence of temperature on the incubation time exceeds that of Mg content, infiltration rate increases with the increasing temperature and Mg content, infiltration rate decreases as Mg consumes. A model of macroscopical infiltration and microscopical infiltration of liquid alloy in porous SiC preform was proposed.

Thermal and Mechanical Properties of Isotactic Polypropylene/TiO_2 Particulate Composites

Particulate composites based on isotactic polypropylene(iPP) and titanium dioxide(TiO 2) have been prepared and their morphology and thermal behavior investigated by scanning electron microscopy(SEM), differential scanning calorimetry(DSC) and thermogravimetric analysis(TGA). Tensile tests were performed to assess the influence of TiO 2 on the mechanical properties of the iPP.

增强体表面改性在高导热金属基复合材料中的应用

随着电子技术的高速发展和电子器件的更新换代,电子封装材料的性能需求越来越高。金属基复合材料,尤其是铝基和铜基复合材料具有高导热、低膨胀、高稳定性等特点,是具有广阔应用前景的电子封装材料。然而,金刚石、石墨烯、硅等增强体与基体的润湿性差,或者在高温下与基体发生有害的界面反应,限制了此类高导热金属基复合材料的开发和应用。本文简述了金属基复合材料的界面研究进展,结合影响金属基复合材料界面结合的因素,提出了几种改善界面结合的方法。增强体表面改性是改善金属基复合材料界面的重要途径之一,常用工艺有磁控溅射法、化学气相沉积法、溶胶凝胶法、化学镀法等;最后,对增强体表面改性在高热导金属基复合材料中的应用进行分析和展望。

科教融汇及思政育人新路径——食品包装技术课程创新实验设计

在前期研究基础上,为食品包装技术实验课开设了明胶-淀粉复合膜制备和性能评估实验,引入绿色包装材料最新科研成果,紧贴社会热点环境保护,结合食品专业多学科知识,涵盖产品研发全过程,全方位渗透思想政治教育。实验包括学生自行筛选复合膜配方、进行质量评估和数据分析、撰写论文模式实验报告。3年的教学实践表明,该课程设计创新性强、综合性高、学生认可度高且教学成果丰富,能极大激发学生实验兴趣和培养正确思想价值。