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挤压铸造对Al-Sr中间合金性能及变质效果的影响
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作者 李润霞 张鹏 +4 位作者 李荣德 于宝义 常保磊 白彦华 郝建飞 《铸造》 CAS CSCD 北大核心 2016年第7期616-620,共5页
本研究采用金相显微镜、X射线衍射(XRD)、能谱分析及扫描电镜(SEM)等技术,对重力铸造制坯后热挤压成Al-Sr中间合金线材与挤压铸造制坯后热挤压成Al-Sr中间合金线材中Al4Sr相的微观形貌、晶粒尺寸和断口形貌进行了对比分析。试验结果表明... 本研究采用金相显微镜、X射线衍射(XRD)、能谱分析及扫描电镜(SEM)等技术,对重力铸造制坯后热挤压成Al-Sr中间合金线材与挤压铸造制坯后热挤压成Al-Sr中间合金线材中Al4Sr相的微观形貌、晶粒尺寸和断口形貌进行了对比分析。试验结果表明,挤压铸造制坯后热挤压成形Al-Sr中间合金线材中的Al4Sr相呈细小颗粒状,分布均匀,等效圆半径约为25.4μm,合金伸长率达到24.74%。塑性的提高使得中间合金线材易于加工成卷。同时,挤压铸造制坯后热挤压成形的Al-Sr中间合金线材具有较短的变质孕育期,变质效果良好。 展开更多
关键词 al-sr中间合金 al-sr相 挤压铸造 变质效果
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Effect of Sr modification on microstructure and thermal conductivity of hypoeutectic Al−Si alloys 被引量:18
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作者 Jun-qi GAN Yu-jian HUANG +1 位作者 Cheng WEN Jun DU 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2020年第11期2879-2890,共12页
Trace amount of Sr(0.05 wt.%)was added into the hypoeutectic Al−Si(3−12 wt.%Si)alloys to modify their microstructure and improve thermal conductivity.The results showed that the thermal conductivity of hypoeutectic Al... Trace amount of Sr(0.05 wt.%)was added into the hypoeutectic Al−Si(3−12 wt.%Si)alloys to modify their microstructure and improve thermal conductivity.The results showed that the thermal conductivity of hypoeutectic Al−Si alloys was improved by Sr modification,and the increment and increasing rate of the thermal conductivity gradually increased with Si content increasing.The improvement of thermal conductivity was primarily related to the morphology variation of eutectic Si phases.In Sr-modified Al−Si alloys,the morphology of eutectic Si phases was a mixed morphology of fiber structure and fine flaky structure,and the proportion of the fine flaky eutectic Si phases gradually decreased with Si content increasing.Under the Si content reaching 9 wt.%,the proportion of fine flaky eutectic Si phases was nearly negligible in Sr-modified alloys.Correspondingly,the increment and increasing rate of thermal conductivity of Sr-modified alloys reached the maximum and tended to be stable. 展开更多
关键词 hypoeutectic Al−Si alloy Sr modification eutectic Si morphology thermal conductivity Al/Si interface
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