Laser powder bed fusion of a Ni3Al-based intermetallic alloy with tailored microstructure and superior mechanical performance

Ni3Al-based alloys are excellent candidates for the structural materials used for turbine engines due to their excellent high-temperature properties.This study aims at laser powder bed fusion and post-hot isostatic pressing(HIP)treatment of Ni3Al-based IC^(-2)21 M alloy with a highγ0 volume fraction.The as-built samples exhibits unavoidable solidification cracking and ductility dip cracking,and the laser parameter optimization can reduce the crack density to 1.34 mm/mm^(2).Transmission electron microscope(TEM)analysis reveals ultra-fine nanoscaleγ0 phases in the as-built samples due to the high cooling rate during rapid solidification.After HIP treatment,a fully dense structure without cracking defects is achieved,which exhibits an equiaxed structure with grain size~120-180μm and irregularly shapedγ0 precipitates~1-3μm with a prominently high fraction of 86%.The room-temperature tensile test of as-built samples shows a high ultimate tensile strength(σUTS)of 1039.7 MPa and low fracture elongation of 6.4%.After HIP treatment,a significant improvement in ductility(15.7%)and a slight loss of strength(σUTS of 831.7 MPa)are obtained by eliminating the crack defects.Both the as-built and HIP samples exhibit retained highσUTS values of 589.8 MPa and 786.2 MPa,respectively,at 900C.The HIP samples exhibita slight decrease in ductility to~12.9%,indicating excellent high-temperature mechanical performance.Moreover,the abnormal increase in strength and decrease in ductility suggest the critical role of a highγ0 fraction in cracking formation.The intrinsic heat treatment during repeating thermal cycles can induce brittleness and trigger cracking initiation in the heat-affected zone with notable deteriorating ductility.The results indicate that the combination of LPBF and HIP can effectively reduce the crack density and enhance the mechanical properties of Ni_(3)Al-based alloy,making it a promising material for high-temperature applications.

A review of Al-based material dopants for high-performance solid state lithium metal batteries

As the world transitions to green energy, there is a growing focus among many researchers on the requirement for high-efficient and safe batteries. Solid-state lithium metal batteries(SSLMBs) have emerged as a promising alternative to traditional liquid lithium-ion batteries(LIBs), offering higher energy density, enhanced safety, and longer lifespan. The rise of SSLMBs has brought about a transformation in energy storage, with aluminum(Al)-based material dopants playing a crucial role in advancing the next generation of batteries. The review highlights the significance of Al-based material dopants in SSLMBs applications, particularly its contributions to solid-state electrolytes(SSEs), cathodes, anodes,and other components of SSLMBs. Some studies have also shown that Al-based material dopants effectively enhance SSE ion conductivity, stabilize electrode and SSE interfaces, and suppress lithium dendrite growth, thereby enhancing the electrochemical performance of SSLMBs. Despite the above mentioned progresses, there are still problems and challenges need to be addressed. The review offers a comprehensive insight into the important role of Al in SSLMBs and addresses some of the issues related to its applications, endowing valuable support for the practical implementation of SSLMBs.

In-situ Si particle-reinforced joints of hypereutectic Al−60Si alloys by ultrasonic-assisted soldering

To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.

Correlation between pre-peak in structure factor and physical properties in Al-based amorphous alloys

To study the influence of Fe addition on the Al-based amorphous alloys,the structure and properties of Al84Ni10La6 and Al84Ni9Fe1La6 alloys were investigated through various techniques.The results show that 1% Fe（molar fraction） addition increases the area of the pre-peak in the structure factor and decreases the thermal expansion coefficient difference between the crystalline and amorphous states.1% Fe addition also improves the glass forming ability（GFA）,micro-hardness,fracture toughness,electric resistivity,absolute diamagnetism and corrosion resistance of Al-Ni-La alloys,which is related to the changes of medium-range order and quench-in free volume caused by 1% Fe addition.

TEM Specimen Preparation for Al-based Amorphous Alloys

Transmission electron microscopy （TEM） is usually used to identify the amorphicity. However, some artifacts may be introduced due to improper TEM foil preparation. In this paper, three Al-rich metallic glasses with and without a glass transition were selected for characterizing the effect of the electropolishing condition on the as-quenched structure during TEM specimen preparation. It is shown that the occurrence of the modulated bright-dark structure under TEM observation is closely sensitive to the electropolishing condition, which suggests us being careful about the possible artifacts induced by specimen preparation when examining amorphous alloys under TEM.

Hot corrosion of modified Ti_3Al-based alloy coated with thin Na_2SO_4 film at 910 and 950℃ in air

The hot corrosion behaviour of a modified Ti3Al-based alloy under thin Na2SO4deposit film was investigated at910and950°C in air.The corrosion product was identified by XRD and its morphologies on the surface and cross-section were observed bySEM.The alloy suffered from considerable hot corrosion attack.The mass gain versus time curves obtained by TGA exhibited tworegions of different kinetics.The whole corroded layer consisted of loose and porous mixture oxides of TiO2,Nb2O5and Al2O3.Numerous small nodules of corrosion product were observed.An illustrative schematic was established to describe the formationprocess of such nodules.It seemed that the refractory oxides played a significantly important role in determining the development ofhot corrosion attack.

Evolution of V-containing phases during preparation of Al-based Al−V master alloys

Al-based Al−V master alloys were prepared by both the stepwise heating melting experiment and stepwise melting cooling experiment with rapid solidification to investigate the transformation of V-containing phases which gave different effects on microstructures and properties of commercial Al alloys and Ti alloys,as both melting and solidification processes affect the evolution of V-containing phases largely.The results showed that the raw Al−50wt.%V alloy consisted of needle-like Al_(3)V phase and Al8V5 phase(matrix),while petal-like Al_(3)V,needle-like Al_(7)V and plate-like Al_(10)V phase were present in the Al−V master alloys.The metastable Al_(7)V phase was evolved from Al_(3)V phase and then evolved into Al_(10)V phase during melting process.The number of Al_(10)V phase increased with the decrease of temperature in the range of 800−1000℃.Petal-like Al_(3)V phases could be transformed from Al_(8)V_(5) phase,pre-precipitated from Al−V molten liquid during melting process and precipitated directly during rapid solidification,respectively.

Rare Earth Application in Sealing Anodized Al-Based Metal Matrix Composites

A new method for corrosion protection of Al-based metal matrix composites (MMC) was developed using two-step process, which involves anodizing in H2SO4 solution and sealing in rare earth solution. Corrosion resistance of the treated surface was evaluated with polarization curves. The results showed that the effect of the protection using rare earth sealing is equivalent to that using chromate sealing for Al6061/SiCp. The rare earth metal salt can be an alternative to the toxic chromate for sealing anodized Al MMC.

Performance and microstructure of Al-based grinding wheel

Diamond grinding wheel were prepared with Al-based bonding agent.The microstructure of Al-based diamond grinding wheel was observed by SEM.The fracture morphology,interface between bonding agent and diamond,and the elemental distribution in bonding agent were studied.The results showed that there were some Al-based agents retained on the diamond surface.Ti,Ni formed intermetallurgy phase with Al in the agent and reduced the plasticity of bonding agent.The service life of this Al-based diamond grinding wheel is proved by the grinding experiments to be three times as long as that of resin-bonded grinding wheel.

EFFECT OF ELONGATED GRAIN STRUCTURE ON THEMECHANICAL PROPERTIES OF AN Fe_3Al-BASEDALLOY

The effect of hot-rolling processing on microstructure as well as the relationship between the elongated grain structure and tensile properties are investigated. The results indicate that the elongated grain structure influences the tensile properties and creep rupture life of Fe3Al alloy significantly. For the better strength and ductility at RT,a thinner elongated grain structure is desirable. When the elongated grain size is increased, the tensile properties will be decreased. On the other hand, the creeP rupture life at 600℃ is increased with the increase of elongated grain size.

The Kinetics of Hydrogen Diffusion in Ti_3Al-Based Alloy

The Proccss of gascous hydrogcn charging into a Ti_3Al- based alloy in the temperature range of 500-650℃isinvcstigatcd. The rcsnlls snoxvc that in rclatiollshil, between the average hydrogen concentration at constant tempreature and charging time reveals a parabolie rate law Applying the theory of lattice constant tcnlpcralurc and hrgillg tin rcvcals a parabolic riltc laiv. Applyillg tbcthcoly oftatticc dillbsio to allalyzc the hydrogcll diethesioll they andthat cncrgy of hydrogcn diffusion is 90.40 kJ/mol. and the equilibrium hydrogen content in the alloy depends on the temperature of the gaseous hydrogen charging process

A comprehensive review of radiation effects on solder alloys and solder joints

In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

Al-based Assistants

Whether you leave business school to become a corporate manager, a professional high performer or an entrepreneur, you will spend much of your time on tasks unrelated to your expertise. Only the most senior executives now have dedicated personal assistants and so the more mundane work of emails.

A review of extreme condition effects on solder joint reliability:Understanding failure mechanisms

Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

Industrial Fusion Cascade Detection of Solder Joint

With the remarkable advancements in machine vision research and its ever-expanding applications,scholars have increasingly focused on harnessing various vision methodologies within the industrial realm.Specifically,detecting vehicle floor welding points poses unique challenges,including high operational costs and limited portability in practical settings.To address these challenges,this paper innovatively integrates template matching and the Faster RCNN algorithm,presenting an industrial fusion cascaded solder joint detection algorithm that seamlessly blends template matching with deep learning techniques.This algorithm meticulously weights and fuses the optimized features of both methodologies,enhancing the overall detection capabilities.Furthermore,it introduces an optimized multi-scale and multi-template matching approach,leveraging a diverse array of templates and image pyramid algorithms to bolster the accuracy and resilience of object detection.By integrating deep learning algorithms with this multi-scale and multi-template matching strategy,the cascaded target matching algorithm effectively accurately identifies solder joint types and positions.A comprehensive welding point dataset,labeled by experts specifically for vehicle detection,was constructed based on images from authentic industrial environments to validate the algorithm’s performance.Experiments demonstrate the algorithm’s compelling performance in industrial scenarios,outperforming the single-template matching algorithm by 21.3%,the multi-scale and multitemplate matching algorithm by 3.4%,the Faster RCNN algorithm by 19.7%,and the YOLOv9 algorithm by 17.3%in terms of solder joint detection accuracy.This optimized algorithm exhibits remarkable robustness and portability,ideally suited for detecting solder joints across diverse vehicle workpieces.Notably,this study’s dataset and feature fusion approach can be a valuable resource for other algorithms seeking to enhance their solder joint detection capabilities.This work thus not only presents a novel and effective solution for industrial solder joint detection but lays the groundwork for future advancements in this critical area.

Effect of Mo and ZrO_(2)nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.

西北汉简中的“贳卖”与“贳买”

西北汉简中有一类“戍卒贳卖名籍”,内容是记录内地戍卒将其携带衣财物在边地贳卖的名单。贳卖即赊卖,西北汉简中记载的贳卖是一种有特定含义的贸易活动。贳卖地点包括吏所和民所两类,分别对应“卒居署贳卖名籍”和“卒行道贳卖名籍”。贳卖民所标识信息详细,包括籍贯、人名,且有任者,并标注身份或居住地;贳卖吏所记录则相对简单,只标注隧长、隧名。偶有作为知情人、见证人的“旁人”,但并不涉及经济关系。其原因在于军政系统中的候官对军吏约束力强。贳卖对象相对集中,故而当为中介机构而非个人。官府禁止戍卒私贳卖衣财物。边地官府掌控着贳卖活动,军政系统由部—候官—都尉府层层控制,通过帮助收债、干预贳卖价格、调查交易中的不法行为来实现。贳卖方来源于内地戍卒,贳买方主要为边地的底层官吏和百姓。内地戍卒的贳卖活动有专门贸易的倾向,可以满足对现钱的需求,是丝路贸易的一种形式。边地军政机构也能通过贳卖名籍掌握士卒的衣物装备,从而保证戍卒基本屯戍衣装需要。国家对边地贳卖活动的管理显示出其为巩固边疆所做出的努力。

Effect of Sb content on properties of Sn-Bi solders

The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.

Effects of Sn element on microstructure and properties of Zn-Cu-Bi-Sn high-temperature solder

The microstructures and properties of the Zn-Cu-Bi-Sn(ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry(DSC),scanning electron microscopy(SEM) and X-ray diffraction(XRD).The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate.The shear strength of solder joints reaches a maximum value with the Sn addition of 5%(mass fraction),which is attributed to the formation of refined β-Sn and primary ε-CuZn_5 phases in η-Zn matrix.However,when the content of Sn exceeds 5%,the shear strength decreases due to the formation of coarse β-Sn phase,which is net-shaped presented at the grain boundary.