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Thermal stability of tungsten and tungsten nitride Schottky contacts to AlGaN/GaN
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作者 刘芳 秦志新 +4 位作者 许福军 赵胜 康香宁 沈波 张国义 《Chinese Physics B》 SCIE EI CAS CSCD 2011年第6期403-406,共4页
Thin tungsten nitride (WNx) films were produced by reactive DC magnetron sputtering of tungsten in an Ar-N2 gas mixture. The films were used as Schottky contacts on AlGaN/GaN heterostructures. The Schottky behaviour... Thin tungsten nitride (WNx) films were produced by reactive DC magnetron sputtering of tungsten in an Ar-N2 gas mixture. The films were used as Schottky contacts on AlGaN/GaN heterostructures. The Schottky behaviours of WNx contact was investigated under various annealing conditions by current-voltage (I-V) measurements. The results show that the gate leakage current was reduced to 10-6 A/cm2 when the N2 flow is 400 mL/min. The results also show that the WNx contact improved the thermal stability of Schottky contacts, Finally, the current transport mechanism in WNx/AlGaN/GaN Schottky diodes has been investigated by means of I-V characterisation technique at various temperatures between 300 K and 523 K. ATE model with a Gaussian distribution of Schottky barrier heights (SBHs) is thought to be responsible for the electrical behaviour at temperatures lower than 523 K. 展开更多
关键词 algan/gan heterostructures tungsten nitride schottky contacts
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Influence of Ni Schottky contact thickness on two-dimensional electron-gas sheet carrier concentration of strained Al_(0.3)Ga_(0.7)N/GaN heterostructures
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作者 赵建芝 林兆军 +5 位作者 吕元杰 Corrigan Timothy D 孟令国 张宇 王占国 陈弘 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2010年第8期74-77,共4页
Ni/Au Schottky contacts with thicknesses of either 50(?)/50(?) or 600(?)/2000(?) were deposited on strained Al_(0.3)Ga_(0.7)N/GaN heterostructures.Using the measured C-V curves and I-V characteristics ... Ni/Au Schottky contacts with thicknesses of either 50(?)/50(?) or 600(?)/2000(?) were deposited on strained Al_(0.3)Ga_(0.7)N/GaN heterostructures.Using the measured C-V curves and I-V characteristics at room temperature,the calculated density of the two-dimensional electron-gas(2DEG) of the 600(?)/2000(?) thick Ni/Au Schottky contact is about 9.13×10^(12) cm^(-2) and that of the 50(?)/50(?) thick Ni/Au Schottky contact is only about 4.77×10^(12) cm^(-2).The saturated current increases from 60.88 to 86.34 mA at a bias of 20 V as the thickness of the Ni/Au Schottky contact increases from 50(?)/50(?) to 600 A/2000 A.By self-consistently solving Schrodinger's and Poisson's equations,the polarization charge sheet density of the two samples was calculated,and the calculated results show that the polarization in the AlGaN barrier layer for the thick Ni/Au Schottky contact is stronger than the thin one.Thus,we attribute the results to the increased biaxial tensile stress in the Al_(0.3)Ga_(0.7)N barrier layer induced by the 600(?)/2000(?) thick Ni/Au Schottky contact. 展开更多
关键词 algan/gan heterostructure schottky contact thicknesses two dimensional electron gas tensile stress
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AlGaN/GaN肖特基结参数分析与电流运输机理研究 被引量:1
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作者 王欣娟 张金凤 +1 位作者 张进城 郝跃 《物理学报》 SCIE EI CAS CSCD 北大核心 2008年第5期3171-3175,共5页
通过对AlGaN/GaN HEMT器件肖特基栅电流输运机理的研究,在变温下采用I-V法对AlGaN/GaN上的Ni/Au肖特基势垒高度和理想因子进行了计算.通过对不同电流机理的分立研究,得到了更为准确的势垒高度值b.通过分析温度在300—550K之间肖特基... 通过对AlGaN/GaN HEMT器件肖特基栅电流输运机理的研究,在变温下采用I-V法对AlGaN/GaN上的Ni/Au肖特基势垒高度和理想因子进行了计算.通过对不同电流机理的分立研究,得到了更为准确的势垒高度值b.通过分析温度在300—550K之间肖特基反向泄漏电流的特性,得出结论:AlGaN材料的表面漏电不是HEMT器件反向泄漏电流的主要来源. 展开更多
关键词 algan/gan异质结 肖特基结 理想因子
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