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AlGaN/GaN MIS-HEMT using NbAlO dielectric layer grown by atomic layer deposition
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作者 毕志伟 冯倩 +5 位作者 郝跃 王党会 马晓华 张进成 全思 许晟瑞 《Chinese Physics B》 SCIE EI CAS CSCD 2010年第7期513-517,共5页
We present an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT) with an NbAIO high-k dielectric deposited by atomic layer deposition (ALD). Surface morphology of samples are obse... We present an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT) with an NbAIO high-k dielectric deposited by atomic layer deposition (ALD). Surface morphology of samples are observed by atomic force microscopy (AFM), indicating that the ALD NbA10 has an excellent-property surface. Moreover, the sharp transition from depletion to accumulation in capacitance voltage (C-V)curse of MIS-HEMT demonstrates the high quality bulk and interface properties of NbA10 on A1GaN. The fabricated MIS-HEMT with a gate length of 0.5 μm exhibits a maximum drain current of 960 mA/mm, and the reverse gate leakage current is almost 3 orders of magnitude lower than that of reference HEMT. Based on the improved direct-current operation, the NbA10 can be considered to be a potential gate oxide comparable to other dielectric insulators. 展开更多
关键词 algan/gan mis-hemt nbaio high-k
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